(place C717
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0115171C)
     ("Source Package" "CAP NP")
     (Value 10nF)
     (Description "L 3.3nH +-0.3n 0402")))
   (place C718
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01151104)
     ("Source Package" "CAP NP")
     (Value 0)
     (Description "L 3.3nH +-0.3n 0402")))
   (place C210
    (property 
     ("PCB Footprint" 0805)
     (timestamp 011673F4)
     ("Source Package" "CAP NP")
     (Material X5R)
     (Value "10u (0805 X5R 6.3V)")
     (Description "C 10u 6.3V Z 0805 X5R"))))
  (component FDG6303_0
   (place U402
    (property 
     ("PCB Footprint" "SC70-6-V1")
     (timestamp 010C9573)
     (Vendor FAIRCHILD)
     ("Part Number" 84.06303.03K)
     ("Source Package" FDG6303_0)
     (Value FDG6303N)
     (PN FDG6303N)
     (Description FDG6303N))))
  (component ASM_5X4_0
   (place U600
    (property 
     ("PCB Footprint" "LMSP33CA-465TEMP")
     (timestamp 01036EA2)
     (Vendor muRata)
     ("Source Package" ASM_5X4_0)
     (Value "LMSP33CA-465TEMP")
     (PN "LMSP33CA-465TEMP")
     (Description "LMSP33CA-465TEMP"))))
  (component IND_0402
   (place L600
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186277)
     ("Source Package" IND_0402)
     (Value 0)))
   (place L601
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186229)
     (Vendor MURATA)
     ("Source Package" IND_0402)
     (Value 18nH)
     (Description "L 18nH 5% 0402")))
   (place L602
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186392)
     (Vendor MURATA)
     ("Source Package" IND_0402)
     (Value 2.2nH)
     (Description "L 2.2nH +-0.3n 0402")))
   (place L603
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186372)
     ("Source Package" IND_0402)
     (Value 0)))
   (place L604
    (property 
     ("PCB Footprint" 0402)
     (timestamp 011862D8)
     (Vendor MURATA)
     ("Source Package" IND_0402)
     (Value 9.1nH)
     (Description "L 6.8nH 5% 0402")))
   (place L608
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186308)
     (Vendor MURATA)
     ("Source Package" IND_0402)
     (Value 15nH)
     (PN LQG15HS18NJ02)
     (Description "L 15nH 5% 0402")))
   (place L609
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01186362)
     (Vendor MURATA)
     ("Source Package" IND_0402)
     (Value 4.3nH)
     (PN LQG15HS4N7J02)
     (Description "L 5.1nH +-0.3n 0402")))
   (place L610
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0118637A)
     (Vendor MURATA)
     ("Source Package" IND_0402)
     (Value 4.3nH)
     (PN LQG15HS4N7J02)
     (Description "L 4.3nH +-0.3n 0402")))
   (place L700
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00F9C632)
     ("Source Package" IND_0402)
     (Value 1.6nH)))
   (place L701
    (property 
     ("PCB Footprint" 0402)
     (timestamp 010D9569)
     ("Source Package" IND_0402)
     (Value 0)))
   (place L702
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00F9A9CA)
     ("Source Package" IND_0402)
     (Value NC)))
   (place L703
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00F9A9E2)
     ("Source Package" IND_0402)
     (Value NC)))
   (place L704
    (property 
     ("PCB Footprint" 0402)
     (timestamp 00F9BE62)
     ("Source Package" IND_0402)
     (Value 1.5nH))))
  (component "keypad B2B_1"
   (place U301
    (property 
     ("PCB Footprint" "KEYPAD(FPC-15PIN)

")
     (timestamp 01045163)
     ("Source Package" "keypad B2B_1")
     (Value "keypad conn. pad"))))
  (component "SMALL CAP"
   (place C501
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01039C14)
     ("Source Package" "SMALL CAP")
     (Value "1u (0603 X5R 10V)")))
   (place C892
    (property 
     ("PCB Footprint" 0603)
     (timestamp 0118512C)
     ("Source Package" "SMALL CAP")
     (Value 1uF)))
   (place C893
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01185156)
     ("Source Package" "SMALL CAP")
     (Value 1uF)))
   (place C832
    (property 
     ("PCB Footprint" 0402)
     (timestamp 01184FCC)
     ("Source Package" "SMALL CAP")
     (Value 100nF/25V)))
   (place C833
    (property 
     ("PCB Footprint" 0402)
     (timestamp 0118515E)
     ("Source Package" "SMALL CAP")
     (Value 100nF/25V)))
   (place C419
    (property 
     ("PCB Footprint" 0603)
     (timestamp 00C88F6A)
     ("Source Package" "SMALL CAP")
     (Value "100n/10V (X5R)"))))
  (component PIFA
   (place U801
    (property 
     ("PCB Footprint" "AT3216-B2R7HAA")
     (timestamp 01184E0A)
     ("Source Package" PIFA)
     (Value "AT3216-B2R7HAA"))))
  (component "HEADER 4_0"
   (place U407
    (property 
     ("PCB Footprint" "BAT(BC-2.5-3MG3SMT)")
     (timestamp 01000CFF)
     (Vendor OUPIIN)
     ("Source Package" "HEADER 4_0")
     (Value "BATTERY CONN.")
     (PN "BC-2.5-3MG3SMT"))))
  (component "MMC CONN_3"
   (place U502
    (property 
     ("PCB Footprint" "SD-47352-001")
     (timestamp 0101CCC0)
     (Vendor MOLEX)
     ("Source Package" "MMC CONN_3")
     (Value "TFLASH 1.1MM*8")
     (PN "SD-47352-001-5"))))
  (component CRYSTAL_0
   (place X802
    (property 
     ("PCB Footprint" "SC-1.27")
     (timestamp 01184E2B)
     (Vendor MICROCRYSTAL)
     ("Source Package" CRYSTAL_0)
     (Value "NC// 32K")
     (PN "MS21-T1S")
     (Description "Crystal MS21-T1S"))))
  (component SPEAKER_2
   (place J202
    (property 
     ("PCB Footprint" "RECEIVER-B71")
     (timestamp 011674D7)
     (Vendor "AAC ELECTRONICS CORP")
     ("Source Package" SPEAKER_2)
     (Value "SDRP0615CJ02-F")
     (PN "SDRP0615CJ02-F")))
   (place J203
    (property 
     ("PCB Footprint" "LOUDSPEAKER-SUPERCONA")
     (timestamp 01069787)
     (Vendor SANYO)
     ("Source Package" SPEAKER_2)
     (Value "S01120J01-B")
     (PN "S01120J01-B"))))
  (component "CAP POL"
   (place C856
    (property 
     ("PCB Footprint" 0603)
     (timestamp 0118519C)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value "4.7uF ( X5R )")
     (Description "C4.7u 6.3V K 0603 X5R")))
   (place C507
    (property 
     ("PCB Footprint" 0603)
     (timestamp 0114678D)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value " 2.2u (0603 X5R)")
     (PN GRM39X5R225K6.3)
     (Description "C 2.2u 6.3V K 0603 X5R")))
   (place C863
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01184F7B)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value "4.7uF ( X5R )")
     (Description "C4.7u 6.3V K 0603 X5R")))
   (place C868
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01184E1A)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value "2.2uF ( X5R )")
     (PN GRM39X5R225K6.3)
     (Description "C 2.2u 6.3V K 0603 X5R")))
   (place C869
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01184E9B)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value "10uF ( X5R )")
     (PN GRM39X5R225K6.3)
     (Description "C 2.2u 6.3V K 0603 X5R")))
   (place C651
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01186406)
     ("Source Package" "CAP POL")
     (Value "4.7u (0603 X5R)")
     (Description "C 4.7u 6.3V K 0603 X5R")))
   (place C845
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01184E67)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value "2.2uF ( X5R )")
     (PN GRM39X5R225K6.3)
     (Description "C 2.2u 6.3V K 0603 X5R")))
   (place C846
    (property 
     ("PCB Footprint" 0603)
     (timestamp 01184E93)
     (Vendor MURATA)
     ("Source Package" "CAP POL")
     (Value "1uF ( X5R )")
     (PN GRM39X5R225K6.3)
     (Description "C 2.2u 6.3V K 0603 X5R")))
   (place C603
    (property 
     ("PCB Footprint" "CAP-B")
     (timestamp 011862B0)
     (Vendor Kamet)
     ("Source Package" "CAP POL")
     (Value 100u/10V)
     (PN B45194R1227M409)
     (Description "Tan. Cap 100u 6.3V X Low ESR"))))
  (component TCVCXO_0
   (place U701
    (property 
     ("PCB Footprint" TCXO3225)
     (timestamp 00FA0364)
     (Vendor TEW)
     ("Source Package" TCVCXO_0)
     (Value 7M26000172)
     (PN "TTS18VSA-A5-26MHZ")
     (Description "VCXO-26MHZ")))
   (place U604
    (property 
     ("PCB Footprint" TCXO3225)
     (timestamp 0118643E)
     (Vendor NDK)
     ("Source Package" TCVCXO_0)
     (Value "X'tal 26MHz")
     (PN "W211-133")
     (Description "VCXO 26MHz"))))
  (component CON3_0
   (place R609
    (property 
     ("PCB Footprint" "0402-3P(1-2)")
     (timestamp 0118CBEE)
     ("Source Package" CON3_0)
     (Value 0)))
   (place R423
    (property 
     ("PCB Footprint" "0402-3P(1-2)")
     (timestamp 0111861E)
     ("Source Package" CON3_0)
     (Value 0)))
   (place R103
    (property 
     ("PCB Footprint" "0402-3P(1-2)")
     (timestamp 010331A1)
     ("Source Package" CON3_0)
     (Value 0)))
   (place R500
    (property 
     ("PCB Footprint" "0402-3P(1-2)")
     (timestamp 0106D1E6)
     ("Source Package" CON3_0)
     (Value 0)))
   (place R300
    (property 
     ("PCB Footprint" "0402-3P(1-2)")
     (timestamp 01120A84)
     ("Source Package" CON3_0)
     (Value 0))))
  (component APL5151_2
   (place U601
    (property 
     ("PCB Footprint" "SOT23-5")
     (timestamp 0118625F)
     (Vendor Ricoh)
     ("Source Package" APL5151_2)
     (Value "Ricoh R1114_2.8V")
     (PN "Ricoh R1114_2.8V")
     (Description "LDO 2.8V")))
   (place U101
    (property 
     ("PCB Footprint" "SOT23-5")
     (timestamp 011A10EA)
     (Vendor Ricoh)
     ("Source Package" APL5151_2)
     (Value "Ricoh R1114_2.8V")
     (PN "Ricoh R1114_2.8V")
     (Description "LDO 2.8V"))))
  (component HPI_6
   (place U2
    (property 
     ("PCB Footprint" SM100)
     (timestamp 011850CC)
     ("Source Package" HPI_6)
     (Value "WiFi module"))))
  (component SAW_0
   (place U702
    (property 
     ("PCB Footprint" LFB182G45SG9A293)
     (timestamp 00F9DD2F)
     (Vendor EPCOS)
     ("Source Package" SAW_0)
     (Value LFB182G45SG9A293)
     (PN LFB182G45SG9A293)
     (Description "RF SAW B7825"))))
  (component DIODE_0
   (place D402
    (property 
     ("PCB Footprint" EMD2)
     (timestamp 00D09DF1)
     (Vendor Rohm)
     ("Source Package" DIODE_0)
     (Value "RB520S-30")
     (PN "RB520S-30")
     (Description "Diode RB520S-30 EMD2")))
   (place D405
    (property 
     ("PCB Footprint" EMD2)
     (timestamp 0103C5DD)
     ("Source Package" DIODE_0)
     (Value "RB520S-30")
     (PN "RB520S-30")))
   (place D200
    (property 
     ("PCB Footprint" EMD2)
     (timestamp 0116739E)
     (Vendor Rohm)
     ("Source Package" DIODE_0)
     (Value "RB520S-30")
     (PN "RB520S-30")
     (Description "Diode RB520S-30 EMD2")))
   (place D201
    (property 
     ("PCB Footprint" EMD2)
     (timestamp 01107280)
     (Vendor Rohm)
     ("Source Package" DIODE_0)
     (Value "RB520S-30")
     (PN "RB520S-30")
     (Description "Diode RB520S-30 EMD2"))))
  (component "SIM SOCKET_2"
   (place U406
    (property 
     ("PCB Footprint" "SIM(C-CAD-0604-XX2)")
     (timestamp 01124951)
     (Vendor Amphenol)
     (Function SIM)
     ("Source Package" "SIM SOCKET_2")
     (Value "SIM(C-CAD-0604-XX2)")
     (Description "SIM(302-0000-497)"))))
  (component MT6318_0
   (place U400
    (property 
     ("PCB Footprint" "MT6318-TFBGA96P/0.6")
     (timestamp 010C9751)
     (Vendor MTK)
     ("Source Package" MT6318_0)
     (Value MT6318)
     (PN MT6318)
     (Description "PMIC 7*7 TFBGA96"))))
  (component "TSC2046-QFP_0"
   (place U505
    (property 
     ("PCB Footprint" "S-PQFP-N16")
     (timestamp 01108B24)
     ("Source Package" "TSC2046-QFP_0")
     (Value "MT6301N(QFN)"))))
  (component "SIM SOCKET"
   (place J920
    (property 
     ("PCB Footprint" "SIM(IM002-0260-KT)")
     (timestamp 011825C2)
     ("Source Package" "SIM SOCKET")
     (Value "ID1A-6S-2.54SF")))
   (place J924
    (property 
     ("PCB Footprint" "SIM(IM002-0260-KT)")
     (timestamp 0118265D)
     ("Source Package" "SIM SOCKET")
     (Value "ID1A-6S-2.54SF"))))
  (component SAW_1
   (place Z600
    (property 
     ("PCB Footprint" QCS5F)
     (timestamp 01030DF3)
     (Vendor Fujitsu)
     ("Source Package" SAW_1)
     (Value "FAR-F5KA-897M50-D4CN")
     (PN "FAR-F5KA-897M50-D4CN")
     (Description "1411 TX SAW"))))
  (component "micro SW_0"
   (place SW300
    (property 
     ("PCB Footprint" EVQP7C)
     (timestamp 0108C721)
     (Vendor Panasonic)
     ("Source Package" "micro SW_0")
     (Value EVQP7C01K)
     (PN EVQP7C01K)))
   (place SW301
    (property 
     ("PCB Footprint" EVQP7C)
     (timestamp 01055942)
     (Vendor Panasonic)
     ("Source Package" "micro SW_0")
     (Value EVQP7C01K)
     (PN EVQP7C01K)))
   (place SW302
    (property 
     ("PCB Footprint" EVQP7C)
     (timestamp 01055A5D)