Abstract: Standard PCB design and mounting processes can adversely influence MEMS inertial sensors.This application note contains guidelines for the layout, soldering, and mounting of MEMS inertialsensors in LGA packages in order to reduce stresses and improve functionality.
標簽：
MEMS
慣性傳感器
焊接
上傳時間：
2014-01-15
上傳用戶：sjb555
