第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2013-11-07
上傳用戶：aa7821634
電路板布局………………………………………42.1 電源和地…………………………………………………………………….42.1.1 感抗……………………………………………………………………42.1.2 兩層板和四層板………………………………………………………42.1.3 單層板和二層板設(shè)計(jì)中的微處理器地……………………………….42.1.4 信號(hào)返回地……………………………………………………………52.1.5 模擬數(shù)字和高壓…………………………………………………….52.1.6 模擬電源引腳和模擬參考電壓……………………………………….52.1.7 四層板中電源平面因該怎么做和不應(yīng)該怎么做…………………….52.2 兩層板中的電源分配……………………………………………………….62.2.1 單點(diǎn)和多點(diǎn)分配……………………………………………………….62.2.2 星型分配………………………………………………………………62.2.3 格柵化地……………………………………………………………….72.2.4 旁路和鐵氧體磁珠……………………………………………………92.2.5 使噪聲靠近磁珠……………………………………………………..102.3 電路板分區(qū)………………………………112.4 信號(hào)線……………………………………………………………………...122.4.1 容性和感性串?dāng)_……………………………………………………...122.4.2 天線因素和長(zhǎng)度規(guī)則………………………………………………...122.4.3 串聯(lián)終端傳輸線…………………………………………………..132.4.4 輸入阻抗匹配………………………………………………………...132.5 電纜和接插件……………………………………………………………...132.5.1 差模和共模噪聲……………………………………………………...142.5.2 串?dāng)_模型……………………………………………………………..142.5.3 返回線路數(shù)目……………………………………..142.5.4 對(duì)板外信號(hào)I/O的建議………………………………………………142.5.5 隔離噪聲和靜電放電ESD ……………………………………….142.6 其他布局問題……………………………………………………………...142.6.1 汽車和用戶應(yīng)用帶鍵盤和顯示器的前端面板印刷電路板………...152.6.2 易感性布局…………………………………………………………...15
上傳時(shí)間： 2013-10-19
上傳用戶：HGH77P99
減小電磁干擾的印刷電路板設(shè)計(jì)原則 內(nèi) 容 摘要……1 1 背景…1 1.1 射頻源.1 1.2 表面貼裝芯片和通孔元器件.1 1.3 靜態(tài)引腳活動(dòng)引腳和輸入.1 1.4 基本回路……..2 1.4.1 回路和偶極子的對(duì)稱性3 1.5 差模和共模…..3 2 電路板布局…4 2.1 電源和地…….4 2.1.1 感抗……4 2.1.2 兩層板和四層板4 2.1.3 單層板和二層板設(shè)計(jì)中的微處理器地.4 2.1.4 信號(hào)返回地……5 2.1.5 模擬數(shù)字和高壓…….5 2.1.6 模擬電源引腳和模擬參考電壓.5 2.1.7 四層板中電源平面因該怎么做和不應(yīng)該怎么做…….5 2.2 兩層板中的電源分配.6 2.2.1 單點(diǎn)和多點(diǎn)分配.6 2.2.2 星型分配6 2.2.3 格柵化地.7 2.2.4 旁路和鐵氧體磁珠……9 2.2.5 使噪聲靠近磁珠……..10 2.3 電路板分區(qū)…11 2.4 信號(hào)線……...12 2.4.1 容性和感性串?dāng)_……...12 2.4.2 天線因素和長(zhǎng)度規(guī)則...12 2.4.3 串聯(lián)終端傳輸線…..13 2.4.4 輸入阻抗匹配...13 2.5 電纜和接插件……...13 2.5.1 差模和共模噪聲……...14 2.5.2 串?dāng)_模型……..14 2.5.3 返回線路數(shù)目..14 2.5.4 對(duì)板外信號(hào)I/O的建議14 2.5.5 隔離噪聲和靜電放電ESD .14 2.6 其他布局問題……...14 2.6.1 汽車和用戶應(yīng)用帶鍵盤和顯示器的前端面板印刷電路板...15 2.6.2 易感性布局…...15 3 屏蔽..16 3.1 工作原理…...16 3.2 屏蔽接地…...16 3.3 電纜和屏蔽旁路………………..16 4 總結(jié)…………………………………………17 5 參考文獻(xiàn)………………………17
標(biāo)簽： 印刷電路板 設(shè)計(jì)原則
上傳時(shí)間： 2013-10-22
上傳用戶：a6697238
西門子建筑電器-電氣安裝技術(shù)部發(fā)行的各類產(chǎn)品樣本：小型斷路器、剩余電流保護(hù)斷路器和模數(shù)化產(chǎn)品(中/ 英文)Miniature Circuit-Breakers, Residual Current Operated Circuit-Breakers and Modular Devices (Chinese/English)低壓熔斷器系統(tǒng)(中/ 英文)Fuse System (Chinese/English)雷擊，過電壓－不再是問題(中文)Thunderstorms - no problem (Chinese)西門子建筑電器目錄(中文)Electrical Installation Technology Catalog (Chinese)終端配電保護(hù)產(chǎn)品(中文)5 IN 1 (Chinese)SIKUS 和 STAB UNIVERSAL 目錄(中文)SIKUS and STAB UNIVERSAL Catalogue (Chinese)SIKUS HC 目錄(中文)SIKUS HC Catalogue (Chinese)SentronTM 母線槽 (中文)SentronTM Busway System (Chinese)SentronTM 母線槽系統(tǒng)快速選型 (準(zhǔn)備中) (中文)SentronTM Busway System quick selection (in preparing) (Chinese)建筑低壓配電一體化解決方案－住宅小區(qū)應(yīng)用(中文)Building LV PD Solution (Chinese)西門子 DELTA vista“遠(yuǎn)景”系列開關(guān)和插座價(jià)目表(中文)Delta vista Switch and Socket Pricelist (Chinese)instabus EIB 面向未來的樓宇智能控制系統(tǒng)(中文)instabus EIB (Chinese)instabus EIB 面向未來的樓宇智能控制系統(tǒng)技術(shù)手冊(cè) (準(zhǔn)備中) (中文)instabus EIB technical handbook (in preparing) (Chinese)西門子電氣安裝技術(shù)業(yè)績(jī)卓越(中/ 英文)ET Reference Manual (Chinese/English)
上傳時(shí)間： 2013-11-23
上傳用戶：瓦力瓦力hong
這是一個(gè)字母或數(shù)制之間的轉(zhuǎn)化程序，5為主模塊，調(diào)用模塊1和模塊7模塊1又調(diào)用模塊2、3、4和6四個(gè)模塊，其中： 模塊2實(shí)現(xiàn)小寫字母向大寫字母的轉(zhuǎn)換 模塊3實(shí)現(xiàn)大寫字母向小寫字母的轉(zhuǎn)換 模塊4實(shí)現(xiàn)二進(jìn)制數(shù)向十六進(jìn)制數(shù)的轉(zhuǎn)換 模塊6實(shí)現(xiàn)十六進(jìn)制數(shù)向二進(jìn)制數(shù)的轉(zhuǎn)換 模塊7實(shí)現(xiàn)十六進(jìn)制數(shù)向十進(jìn)制數(shù)的轉(zhuǎn)換按“q”鍵退出。使用時(shí)，需將7個(gè)文件分別匯編，連接的方法為：5＋1＋2＋3＋4＋6＋7生成可執(zhí)行文件“5” 即可運(yùn)行。
標(biāo)簽： 字母 數(shù)制 轉(zhuǎn)化 程序
上傳時(shí)間： 2015-02-27
上傳用戶：hn891122
I. Introduction This code exploits a previously undisclosed vulnerability in the bit string decoding code in the Microsoft ASN.1 library. This vulnerability is not related to the bit string vulnerability described in eEye advisory AD20040210-2. Both vulnerabilities were fixed in the MS04-007 patch. II. Screenshots $ ./kill-bill.pl . kill-bill : Microsoft ASN.1 remote exploit for CAN-2003-0818 (MS04-007) by Solar Eclipse <solareclipse@phreedom.org> Usage: kill-bill -p <port> -s <service> host Services: iis IIS HTTP server (port 80) iis-ssl IIS HTTP server with SSL (port 443) exchange Microsoft Exchange SMTP server (port 25) smb-nbt SMB over NetBIOS (port 139) smb SMB (port 445) If a service is running on its default port you don t have to specify both the service and the port. Examples: kill-bill -s iis 192.168.0.1 kill-bill -p 80 192.168.0.1 kill-bill -p 1234 -s smb 192.168.0.1
標(biāo)簽： I. vulnerability Introduction undisclosed
上傳時(shí)間： 2015-05-15
上傳用戶：xhz1993
數(shù)字運(yùn)算，判斷一個(gè)數(shù)是否接近素?cái)?shù) A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no
上傳時(shí)間： 2015-05-21
上傳用戶：daguda
源代碼\用動(dòng)態(tài)規(guī)劃算法計(jì)算序列關(guān)系個(gè)數(shù) 用關(guān)系"<"和"="將3個(gè)數(shù)a，b，c依次序排列時(shí)，有13種不同的序列關(guān)系： a=b=c,a=b<c,a<b=v,a<b<c,a<c<b a=c<b,b<a=c,b<a<c,b<c<a,b=c<a c<a=b,c<a<b,c<b<a 若要將n個(gè)數(shù)依序列，設(shè)計(jì)一個(gè)動(dòng)態(tài)規(guī)劃算法，計(jì)算出有多少種不同的序列關(guān)系， 要求算法只占用O(n),只耗時(shí)O(n*n).
標(biāo)簽： lt 源代碼 動(dòng)態(tài)規(guī)劃 序列
上傳時(shí)間： 2013-12-26
上傳用戶：siguazgb
這是一個(gè)字母或數(shù)制之間的轉(zhuǎn)化程序，5為主模塊，調(diào)用模塊1和模塊7 模塊1又調(diào)用模塊2、3、4和6四個(gè)模塊，其中： 模塊2實(shí)現(xiàn)小寫字母向大寫字母的轉(zhuǎn)換 模塊3實(shí)現(xiàn)大寫字母向小寫字母的轉(zhuǎn)換 模塊4實(shí)現(xiàn)二進(jìn)制數(shù)向十六進(jìn)制數(shù)的轉(zhuǎn)換 模塊6實(shí)現(xiàn)十六進(jìn)制數(shù)向二進(jìn)制數(shù)的轉(zhuǎn)換 模塊7實(shí)現(xiàn)十六進(jìn)制數(shù)向十進(jìn)制數(shù)的轉(zhuǎn)換 按“q”鍵退出。 使用時(shí)，需將7個(gè)文件分別匯編，連接的方法為： 5＋1＋2＋3＋4＋6＋7 生成可執(zhí)行文件“5” 即可運(yùn)行。
標(biāo)簽： 字母 數(shù)制 轉(zhuǎn)化 程序
上傳時(shí)間： 2015-06-14
上傳用戶：許小華
空時(shí)正交編碼源程序，參考文獻(xiàn)： V.Tarokh,H. Jafarkhani,and A. R. Calderbank "Space-Time Codes from ％Orthogonal Designs",IEEE Trans. Inform. Theory VOL. 45,NO. 5,JULY 1
上傳時(shí)間： 2013-12-26
上傳用戶：fandeshun
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