1.5mm間距BGA封裝庫BGA芯片封裝ALTIUM庫(AD庫PCB封裝庫 )，51個封裝，列表如下：Component Count : 51Component Name-----------------------------------------------BGA150P3X3-9BGA150P4X4-16BGA150P4X4-16ABGA150P5X5-25BGA150P5X5-25ABGA150P5X5-25BBGA150P6X6-36BGA150P6X6-36ABGA150P6X6-36BBGA150P7X7-49BGA150P7X7-49ABGA150P7X7-49BBGA150P8X8-64BGA150P8X8-64ABGA150P8X8-64BBGA150P9X9-81BGA150P9X9-81ABGA150P10X10-100BGA150P10X10-100ABGA150P11X11-121BGA150P11X11-121ABGA150P12X12-144BGA150P13X13-169BGA150P14X14-196BGA150P14X14-196ABGA150P15X15-225BGA150P15X15-225ABGA150P15X15-225BBGA150P16X16-256BGA150P17X17-289BGA150P18X18-324BGA150P18X18-324ABGA150P19X19-361BGA150P19X19-361ABGA150P20X20-400BGA150P21X21-441BGA150P22X22-484BGA150P22X22-484ABGA150P23X23-529BGA150P24X24-576BGA150P25X25-625BGA150P25X25-625ABGA150P26X26-676BGA150P27X27-729BGA150P28X28-784BGA150P29X29-841BGA150P30X30-900BGA150P30X30-900ABGA150P31X31-961BGA150P32X32-1024BGA150P33X33-1089
標(biāo)簽： BGA封裝庫
上傳時間： 2021-11-30
上傳用戶：qingfengchizhu
0.5mm間距BGA封裝庫BGA芯片封裝ALTIUM庫(AD庫PCB封裝庫 )，21個，封裝型號列表如下：Component Count : 21Component Name-----------------------------------------------BGA50P5X5-25BGA50P5X5-25VBGA50P6X6-36VBGA50P7X7-48BGA50P7X7-49BGA50P7X7-49VBGA50P8X8-56BGA50P8X8-64BGA50P9X9-80BGA50P9X9-81BGA50P10X10-56BGA50P11X11-100BGA50P11X11-120BGA50P11X11-121BGA50P14X14-100BGA50P14X14-132BGA50P14X14-196BGA50P15X15-164BGA50P18X18-180BGA50P19X19-281BGA50P20X20-256
標(biāo)簽： BGA封裝庫
上傳時間： 2021-11-30
上傳用戶：
0.8mm間距BGA封裝庫BGA芯片封裝ALTIUM庫(AD庫PCB封裝庫 )，50個，PCB封裝列表：Component Count : 50Component Name-----------------------------------------------BGA80P6X6-36BGA80P7X7-48BGA80P7X7-49BGA80P7X7-49ABGA80P8X6-48BGA80P8X8-64BGA80P8X8-64ABGA80P8X8-64BBGA80P9X9-81BGA80P10X10-84BGA80P10X10-100BGA80P10X10-100ABGA80P12X12-128BGA80P12X12-128ABGA80P12X12-128BBGA80P12X12-144BGA80P12X12-144ABGA80P13X13-144ABGA80P13X13-144BBGA80P13X13-144CBGA80P13X13-152BGA80P13X13-169BGA80P14X14-160BGA80P14X14-180BGA80P14X14-180ABGA80P14X14-196BGA80P14X14-196ABGA80P15X15-176BGA80P15X15-177BGA80P16X16-208BGA80P16X16-256BGA80P16X16-256ABGA80P17X17-208BGA80P17X17-208ABGA80P17X17-256BGA80P17X17-272BGA80P17X17-289BGA80P19X19-257BGA80P19X19-257ABGA80P19X19-280ABGA80P19X19-280BBGA80P19X19-280CBGA80P19X19-288BGA80P19X19-332BGA80P20X20-324BGA80P20X20-363BGA80P22X22-240BGA80P22X22-340BGA80P22X22-384BGA80P22X22-484
標(biāo)簽： BGA封裝庫
上傳時間： 2021-11-30
上傳用戶：xsr1983
1mm間距BGA芯片封裝庫ALTIUM庫PCB封裝庫(AD庫 )，114個，封裝庫型號列表：Component Count : 114Component Name-----------------------------------------------BGA100P5X5-25BGA100P6X6-36BGA100P6X6-36ABGA100P7X7-49BGA100P7X7-49ABGA100P8X8-64BGA100P8X8-64ABGA100P9X9-81BGA100P9X9-81ABGA100P10X10-100BGA100P10X10-100ABGA100P10X10-100BBGA100P10X10-100CBGA100P11X11-121BGA100P11X11-121ABGA100P12X12-144BGA100P12X12-144ABGA100P12X12-144BBGA100P13X13-169BGA100P13X13-169ABGA100P14X14-160BGA100P14X14-176BGA100P14X14-196BGA100P14X14-196BBGA100P15X15-225BGA100P16X16-208BGA100P16X16-256BGA100P16X16-256BBGA100P16X16-256CBGA100P17X17-169BGA100P17X17-289BGA100P18X18-320BGA100P18X18-324BGA100P19X19-361BGA100P20X20-292BGA100P20X20-400BGA100P20X20-400ABGA100P21X21-441BGA100P22X22-324BGA100P22X22-388BGA100P22X22-456BGA100P22X22-484BGA100P22X22-484BBGA100P22X22-484CBGA100P22X22-484DBGA100P23X23-413BGA100P23X23-529BGA100P24X24-552BGA100P24X24-552ABGA100P24X24-552BBGA100P24X24-576BGA100P24X24-576ABGA100P25X25-625BGA100P26X26-352BGA100P26X26-388BGA100P26X26-416BGA100P26X26-452BGA100P26X26-456ABGA100P26X26-484BGA100P26X26-665BGA100P26X26-668BGA100P26X26-672BGA100P26X26-675BGA100P26X26-676BGA100P26X26-676ABGA100P27X27-729BGA100P28X28-780BGA100P28X28-780ABGA100P28X28-783BGA100P28X28-784BGA100P29X29-841BGA100P30X30-516BGA100P30X30-556BGA100P30X30-676BBGA100P30X30-896ABGA100P30X30-900BGA100P31X31-961BGA100P32X32-772BGA100P32X32-772ABGA100P32X32-1020BGA100P32X32-1024BGA100P33X33-1089BGA100P34X34-580BGA100P34X34-680BGA100P34X34-1136BGA100P34X34-1148BGA100P34X34-1152ABGA100P34X34-1152BBGA100P34X34-1153BGA100P34X34-1156BGA100P36X36-1296BGA100P37X37-1369BGA100P38X38-1444BGA100P39X39-680BGA100P39X39-680ABGA100P39X39-792BGA100P39X39-896BGA100P39X39-1508ABGA100P39X39-1513BGA100P39X39-1517BGA100P39X39-1521BGA100P41X41-1681BGA100P42X42-860BGA100P42X42-1696BGA100P42X42-1704BGA100P42X42-1738BGA100P42X42-1760BGA100P42X42-1764
上傳時間： 2021-11-30
上傳用戶：
主板BGA芯片焊接拆裝工藝視頻
上傳時間： 2013-11-22
上傳用戶：GeekyGeek
主板BGA芯片焊接拆裝工藝視頻
上傳時間： 2013-11-14
上傳用戶：tfyt
常用芯片表貼芯片表貼電阻電容STM封裝庫AD庫（ATIUM PCB封裝庫）:PCB Library : 常用芯片表貼芯片表貼電阻電容STM封裝庫AD庫（ATIUM PCB封裝庫）.PcbLibDate : 2021/5/14Time : 16:14:01Component Count : 463Component Name-----------------------------------------------LC-12-DIPH-300LC-0201LC-0201_CLC-0201_LLC-0201_RLC-0402LC-0402_CLC-0402_LLC-0402_RLC-0402_Rx2LC-0402_Rx4LC-0603LC-0603_CLC-0603_Cx4LC-0603_LLC-0603_LEDLC-0603_RLC-0603_Rx2LC-0603_Rx4LC-0805LC-0805_CLC-0805_LLC-0805_LEDLC-0805_RLC-1206LC-1206_CLC-1206_LLC-1206_RLC-1210LC-1210_CLC-1210_RLC-1806LC-1806_CLC-1806_LLC-1806_RLC-1808LC-1808_CLC-1808_LLC-1808_RLC-1812LC-1812_CLC-1812_LLC-1812_RLC-1825LC-1825_CLC-1825_LLC-1825_RLC-2010LC-2010_CLC-2010_LLC-2010_RLC-2220LC-2220_CLC-2220_LLC-2220_RLC-2225LC-2225_CLC-2225_RLC-2512LC-2512_CLC-2512_LLC-2512_RLC-ABSLC-BGA-14LC-BGA-84_7.5x12.5mmLC-BGA-121LC-BGA-143LC-BR-3LC-BR-6LC-BR-10LC-CASE 017AA-01LC-CASE-A_3216LC-CASE-B_3528LC-CASE-C_6032LC-CASE-D_7343LC-CASE-E_7343LC-CASE-P_2012LC-CASE-R_2012LC-DBLC-DBSLC-DFN-2LLC-DFN-8_3x3mmLC-DFN-8_5x6mmLC-DFN-10_3x3mmLC-DFN-10_EP_3x3mmLC-DIP-4LC-DIP-5LC-DIP-6LC-DIP-7LC-DIP-8LC-DIP-14LC-DIP-16LC-DIP-18LC-DIP-20LC-DIP-24_300milLC-DIP-24_600milLC-DIP-28_300milLC-DIP-28_600milLC-DIP-40LC-DO-15LC-DO-27LC-DO-35LC-DO-41LC-DO-201ADLC-DO-213AALC-DO-213ABLC-DO-218ABLC-DSON-10LC-FBGA-84_9x12.5mmLC-FBGA-96_8x14mmLC-FBGA-256LC-FBGA-272LC-FBGA-289LC-FBGA-484LC-FBGA-780LC-GBJLC-GBULC-GDTs_SMDLC-GDTs_THTLC-HC-49SLC-HC-49SMDLC-HC-49ULC-HTSSOP-32LC-HVMDIPLC-HVQFN-32_5x5x05PLC-HZIP25-P-1.27LC-KBJLC-KBLLC-KBPLC-KBPCLC-KBULC-LBSLC-LFBGA-217LC-LFCSP-8_3x2x05PLC-LFCSP-8_3x3x05PLC-LFCSP-16_4x4x05PLC-LFCSP-20_4x4x05PLC-LFCSP-24_4x4x05PLC-LFCSP-28_5x5x05PLC-LFCSP40_6x6x05PLC-LFCSP56_8x8x05PLC-LGA-8_3x5mmLC-LGA-14_3x5mmLC-LGA-16_3x3mmLC-LGA-16_4x4mmLC-LL-34LC-LL-35LC-LL-41LC-LPCC-148LC-LQFP-32_7x7x08PLC-LQFP-44_10x10x08PLC-LQFP-48_7x7x05P
上傳時間： 2021-12-02
上傳用戶：
目前cPU+ Memory等系統(tǒng)集成的多芯片系統(tǒng)級封裝已經(jīng)成為3DSiP（3 Dimension System in Package，三維系統(tǒng)級封裝）的主流，非常具有代表性和市場前景，SiP作為將不同種類的元件，通過不同技術(shù)，混載于同一封裝內(nèi)的一種系統(tǒng)集成封裝形式，不僅可搭載不同類型的芯片，還可以實現(xiàn)系統(tǒng)的功能。然而，其封裝具有更高密度和更大的發(fā)熱密度和熱阻，對封裝技術(shù)具有更大的挑戰(zhàn)。因此，對SiP封裝的工藝流程和SiP封裝中的濕熱分布及它們對可靠性影響的研究有著十分重要的意義本課題是在數(shù)字電視（DTV）接收端子系統(tǒng)模塊設(shè)計的基礎(chǔ)上對CPU和DDR芯片進(jìn)行芯片堆疊的SiP封裝。封裝形式選擇了適用于小型化的BGA封裝，結(jié)構(gòu)上采用CPU和DDR兩芯片堆疊的3D結(jié)構(gòu)，以引線鍵合的方式為互連，實現(xiàn)小型化系統(tǒng)級封裝。本文研究該SP封裝中芯片粘貼工藝及其可靠性，利用不導(dǎo)電膠將CPU和DDR芯片進(jìn)行了堆疊貼片，分析總結(jié)了SiP封裝堆疊貼片工藝最為關(guān)鍵的是涂布材料不導(dǎo)電膠的體積和施加在芯片上作用力大小，對制成的樣品進(jìn)行了高溫高濕試驗，分析濕氣對SiP封裝的可靠性的影響。論文利用有限元軟件 Abaqus對SiP封裝進(jìn)行了建模，模型包括熱應(yīng)力和濕氣擴(kuò)散模型。模擬分析了封裝體在溫度循環(huán)條件下，受到的應(yīng)力、應(yīng)變、以及可能出現(xiàn)的失效形式：比較了相同的熱載荷條件下，改變塑封料、粘結(jié)層的材料屬性，如楊氏模量、熱膨脹系數(shù)以及芯片、粘結(jié)層的厚度等對封裝體應(yīng)力應(yīng)變的影響。并對封裝進(jìn)行了濕氣吸附分析，研究了SiP封裝在85℃RH85%環(huán)境下吸濕5h、17h、55和168h后的相對濕度分布情況，還對SiP封裝在濕熱環(huán)境下可能產(chǎn)生的可靠性問題進(jìn)行了實驗研究。在經(jīng)過168小時濕氣預(yù)處理后，封裝外部的基板和模塑料基本上達(dá)到飽和。模擬結(jié)果表明濕應(yīng)力同樣對封裝的可靠性會產(chǎn)生重要影響。實驗結(jié)果也證實了，SiP封裝在濕氣環(huán)境下引入的濕應(yīng)力對可靠性有著重要影響。論文還利用有限元分析方法對超薄多芯片SiP封裝進(jìn)行了建模，對其在溫度循環(huán)條件下的應(yīng)力、應(yīng)變以及可能的失效形式進(jìn)行了分析。采用二水平正交試驗設(shè)計的方法研究四層芯片、四層粘結(jié)薄膜、塑封料等9個封裝組件的厚度變化對芯片上最大應(yīng)力的影響，從而找到最主要的影響因子進(jìn)行優(yōu)化設(shè)計，最終得到更優(yōu)化的四層芯片疊層SiP封裝結(jié)構(gòu)。
標(biāo)簽： sip封裝
上傳時間： 2022-04-08
上傳用戶：
摘要：本文介紹了使用Cadence APD完成一款SIP芯片BGA封裝的設(shè)計流程。結(jié)合Cadence APD在BGA封裝設(shè)計方面的強(qiáng)大功能，以圖文并茂、實際設(shè)計為例說明Cadence APD完成包含一塊基帶芯片和一塊RF芯片的BGA封裝的設(shè)計方法和設(shè)計流程。該設(shè)計方法對于SIP封裝設(shè)計、加速設(shè)計周期、降低開發(fā)成本具有直接的指導(dǎo)價值。關(guān)鍵詞：Cadence APD、SIP設(shè)計、BGA封裝設(shè)計1引言隨著通訊和消費類電子的飛速發(fā)展，電子產(chǎn)品、特別是便攜式產(chǎn)品不斷向小型化和多功能化發(fā)展，對集成電路產(chǎn)品提出了新的要求，更加注重多功能、高集成度、高性能、輕量化、高可靠性和低成本。而產(chǎn)品的快速更新?lián)Q代，使得研發(fā)周期的縮短也越來越重要，更快的進(jìn)入市場也就意味著更多的利潤。微電子封裝對集成電路（IC）產(chǎn)品的體積、性能、可靠性質(zhì)量、成本等都有重要影響，IC成本的40%是用于封裝的，而產(chǎn)品失效率中超過25%的失效因素源自封裝，封裝已成為研發(fā)新一代電子系統(tǒng)的關(guān)鍵環(huán)節(jié)及制約因素（圖1.1）。系統(tǒng)封裝（Sip）具有高密度封裝、多功能化設(shè)計、較短的市場進(jìn)入時間以及更低的開發(fā)成本等優(yōu)勢，得到了越來越多的關(guān)注。國際上大的封裝廠商如ASE、Amkor、ASAT和Starchips等都已經(jīng)推出了自己的SIP產(chǎn)品。
標(biāo)簽： cadenceapd sip 芯片封裝
上傳時間： 2022-07-04
上傳用戶：
視頻圖像格式轉(zhuǎn)換芯片的算法研究
標(biāo)簽： 視頻圖像 格式轉(zhuǎn)換 芯片 算法研究
上傳時間： 2013-05-25
上傳用戶：eeworm
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