為深入了解基于UC3854A控制的PFC變換器中的動(dòng)力學(xué)特性，研究系統(tǒng)參數(shù)變化對(duì)變換器中分岔現(xiàn)象的影響，在建立Boost PFC變換器雙閉環(huán)數(shù)學(xué)模型的基礎(chǔ)上，用Matlab軟件對(duì)變換器中慢時(shí)標(biāo)分岔及混沌等不穩(wěn)定現(xiàn)象進(jìn)行了仿真。在對(duì)PFC變換器中慢時(shí)標(biāo)分岔現(xiàn)象仿真的基礎(chǔ)上，分析了系統(tǒng)參數(shù)變化對(duì)分岔點(diǎn)的影響，并進(jìn)行了仿真驗(yàn)證。仿真結(jié)果清晰地顯示了輸入整流電壓的幅值變化對(duì)系統(tǒng)分岔點(diǎn)的影響。
Abstract:
In order to better understand the dynamics characteristic of power factor correction converter based on UC3854A， and make the way that parameters change influences the bifurcation phenomena of the system clearly. The math model of the two closed loop circuits to the Boost PFC （Power Factor Correction） converter controller was built. Then， with the help of Matlab， the simulation for nonlinear phenomena such as chaos and slow-scale bifurcation in the PFC converter was made. Finally the factors that have influence to the phenomenon of bifurcation under slow-scale in PFC converter were analyzed. The simulation results clearly show the parameters change influences the bifurcation point of the system.
The MC68HC05K0 is a low cost, low pin countsingle chip microcomputer with 504 bytes of userROM and 32 bytes of RAM. The MC68HC05K0 isa member of the 68HC05K series of devices whichare available in 16-pin DIL or SOIC packages.It uses the same CPU as the other devices in the68HC05 family and has the same instructions andregisters. Additionally, the device has a 15-stagemulti-function timer and 10 general purposebi-directional I/0 lines. A mask option is availablefor software programmable pull-downs on all ofthe I/O pins and four of the pins are capable ofgenerating interrupts.The device is ideally suited for remote-controlkeyboard applications because the pull-downs andthe interrupt drivers on the port pins allowkeyboards to be built without any externalcomponents except the keys themselves. There isno need for external pull-up or pull-down resistors,or diodes for wired-OR interrupts, as these featuresare already designed into the device.
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
Agilent AN 154 S-Parameter Design Application Note S參數(shù)的設(shè)計(jì)與應(yīng)用
The need for new high-frequency, solid-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design solid state circuitsthat will operate at higher and higher frequencies.The development of microwave transistors andAgilent Technologies’ network analysis instrumentationsystems that permit complete network characterizationin the microwave frequency rangehave greatly assisted these engineers in their work.The Agilent Microwave Division’s lab staff hasdeveloped a high frequency circuit design seminarto assist their counterparts in R&D labs throughoutthe world. This seminar has been presentedin a number of locations in the United States andEurope.From the experience gained in presenting this originalseminar, we have developed a four-part videotape, S-Parameter Design Seminar. While the technologyof high frequency circuit design is everchanging, the concepts upon which this technologyhas been built are relatively invariant.The content of the S-Parameter Design Seminar isas follows:
Nios II軟件構(gòu)建工具入門
The Nios® II Software Build Tools (SBT) allows you to construct a wide variety of
complex embedded software systems using a command-line interface. From this
interface, you can execute Software Built Tools command utilities, and use scripts
other tools) to combine the command utilities in many useful ways.
This chapter introduces you to project creation with the SBT at the command line
This chapter includes the following sections:
■ “Advantages of Command-Line Software Development”
■ “Outline of the Nios II SBT Command-Line Interface”
■ “Getting Started in the SBT Command Line”
■ “Software Build Tools Scripting Basics” on page 3–8
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
