Abstract: This article explains the recent trend in heart-rate and fitness monitors to go wireless toeliminate cables to allow free movement, and allow convenient data collection without the need to plug intheir DEVICES. It details a typical wireless system, using the MAX1472 crystal-referenced phase-lockedloop (PLL) VHF/UHF transmitter.
Abstract: When people want portable music, they usually rely on battery-powered audio DEVICES. With a bit of engineeringblood (or curiosity) running in your veins, it is not difficult to build a wireless Bluetooth® stereo audio system that can becontrolled with any device that has a Bluetooth connection and a music player
在研究傳統家用燃氣報警器的基礎上，以ZigBee協議為平臺，構建mesh網狀網絡實現網絡化的智能語音報警系統。由于傳感器本身的溫度和實際環境溫度的影響，傳感器標定后采用軟件補償方法。為了減少系統費用，前端節點采用半功能節點設備，路由器和協調器采用全功能節點設備，構建mesh網絡所形成的家庭內部報警系統，通過通用的電話接口連接到外部的公用電話網絡，啟動語音模塊進行報警。實驗結果表明，在2.4 GHz頻率下傳輸，有墻等障礙物的情況下，節點的傳輸距離大約為35 m，能夠滿足家庭需要，且系統工作穩定，但在功耗方面仍需進一步改善。
Abstract:
On the basis of studying traditional household gas alarm system, this paper proposed the platform for the ZigBee protocol，and constructed mesh network to achieve network-based intelligent voice alarm system. Because of the sensor temperature and the actual environment temperature, this system design used software compensation after calibrating sensor. In order to reduce system cost, semi-functional node DEVICES were used as front-end node, however, full-function DEVICES were used as routers and coordinator，constructed alarm system within the family by building mesh network，connected to the external public telephone network through the common telephone interface, started the voice alarm module. The results indicate that nodes transmit about 35m in the distance in case of walls and other obstacles by 2.4GHz frequency transmission, this is able to meet family needs and work steadily, but still needs further improvement in power consumption.
本軟件是關于MAX338, MAX339的英文數據手冊：MAX338, MAX339 8通道/雙4通道、低泄漏、CMOS模擬多路復用器
The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both DEVICES can be used as either a mux or a demux. On-resistance is 400Ω max, and the DEVICES conduct current equally well in both directions.
These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim DEVICES with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
It would not be an exaggeration to say that semiconductor DEVICES have transformed humanlife. From computers to communications to internet and video games these DEVICES and the technologies they have enabled have expanded human experience in a way that is unique in history. Semiconductor DEVICES have exploited materials, physics and imaginative applications to spawn new lifestyles. Of course for the device engineer, in spite of the advances, the challenges of reaching higher frequency, lower power consumption, higher power generation etc.
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger DEVICES one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
Abstract: Designers who must interface 1-Wire temperature sensors with Xilinx field-programmable gate arrays(FPGAs) can use this reference design to drive a DS28EA00 1-Wire slave device. The downloadable softwarementioned in this document can also be used as a starting point to connect other 1-Wire slave DEVICES. The systemimplements a 1-Wire master connected to a UART and outputs temperature to a PC from the DS28EA00 temperaturesensor. In addition, high/low alarm outputs are displayed from the DS28EA00 PIO pins using LEDs.
通過以太網遠程配置Nios II 處理器 應用筆記
Firmware in embedded hardware systems is frequently updated over the Ethernet. For
embedded systems that comprise a discrete microprocessor and the DEVICES it controls, the
firmware is the software image run by the microprocessor. When the embedded system
includes an FPGA, firmware updates include updates of the hardware image on the FPGA. If
the FPGA includes a Nios® II soft processor, you can upgrade both the Nios II processor—as
part of the FPGA image—and the software that the Nios II processor runs, in a single remote
configuration session.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor DEVICES. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Designing withProgrammable Logicin an Analog WorldProgrammable logic DEVICES revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity DEVICES that use nonvolatilesea-of-gates cells called complexprogrammable logic DEVICES (CPLDs)or they can be high-density DEVICESbased on SRAM look-up tables (LUTs)
