In a recent discussion with a system designer, the requirementfor his power supply was to regulate 1.5Vand deliver up to 40A of current to a load that consistedof four FPGAs. This is up to 60W of power that must bedelivered in a small area with the lowest height profi lepossible to allow a steady fl ow of air for cooling. Thepower supply had to be surface mountable and operateat high enough effi ciency to minimize heat dissipation.He also demanded the simplest possible solution so histime could be dedicated to the more complex tasks. Asidefrom precise electrical performance, this solution had toremovethe heat generated during DC to DC conversionquickly so that the circuit and the ICs in the vicinity do notoverheat. Such a solution requires an innovative designto meet these criteria:
上傳時間： 2013-11-24
上傳用戶：defghi010
Photomultipliers (PMT), avalanche photodiodes (APD),ultrasonic transducers, capacitance microphones, radiationdetectors and similar devices require high voltage,low current bias. Additionally, the high voltage must bepristinely free of noise; well under a millivolt is a commonrequirement with a few hundred microvolts sometimesnecessary. Normally, switching regulator confi gurationscannot achieve this performance level without employingspecial techniques. One aid to achieving low noise is thatload currents rarely exceed 5mA. This freedom permitsoutput fi ltering methods that are usually impractical
上傳時間： 2013-10-28
上傳用戶：lhw888
數字控制的交流調速系統所選用的微處理器、功率器件及產生PWM波的方法是影響交流調速系統性能好壞的直接因素。在介紹了正弦脈寬調制(SPWM)技術的基礎上，設計了一種以8098單片機作為控制器，以智能功率模塊IPM為開關器件的變頻調速系統。通過軟件編程，產生正弦脈沖寬度調制波形來控制絕緣柵雙極晶體管的導通和關斷，從而達到控制異步電動機轉速的目的。實驗結果表明，該系統可調頻率調電壓，穩定度高，調速范圍寬，具有較強的實用價值 Abstract: AC variable speed with digital control systems used microprocessors， power devices and generate PWM wave is the direct factors of affecting the performance AC speed regulation system. On the basis of introducing the sinusoidal pulse width modulation (SPWM) technology，this paper designed variable speed system which used 8098 as a controller， intelligent power module IPM as switching device. Through software programming， resulting in sinusoidal pulse width modulation waveform to control the insulated gate bipolar transistor turn on and off， so as to achieve the purpose of speed control of induction motors. Experimental results show that the system can adjust frequency modulation voltage， high stability， wide speed range， has a strong practical value.
上傳時間： 2013-11-14
上傳用戶：ynwbosss
為解決傳統可視倒車雷達視頻字符疊加器結構復雜，可靠性差，成本高昂等問題，在可視倒車雷達設計中采用視頻字符發生器芯片MAX7456。該芯片集成了所有用于產生用戶定義OSD，并將其插入視頻信號中所需的全部功能，僅需少量的外圍阻容元件即可正常工作。給出了以MAX7456為核心的可視倒車雷達的軟、硬件實現方案及設計實例。該方案具有電路結構簡單、價格低廉、符合人體視覺習慣的特點。經實際裝車測試，按該方案設計的可視倒車雷達視場清晰、提示字符醒目、工作可靠，可有效降低駕駛員倒車時的工作強度、減少倒車事故的發生。 Abstract: A new video and text generation chip，MAX7456，was used in the design of video parking sensor in order to simplify system structure，improve reliability and reduce cost. This chip included all the necessary functions to generate user-defined OSDs and to add them into the video signals. It could be put into work with addition of just a small number of resistances and capacitors. This paper provided software and hardware implementation solutions and design example based on the chip. The system had the characteristics of simplicity in circuit structure，lower cost，and comfort for the nature of human vision. Loading road test demonstrates high video and text display quality and reliable performance，which makes the driver easy to see backward and reduces chance of accidents.
上傳時間： 2013-12-10
上傳用戶：qiaoyue
NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speedFlash memory. This Flash memory includes a special 128-bit wide memory interface andaccelerator architecture that enables the CPU to execute sequential instructions fromFlash memory at the maximum 72 MHz system clock rate. This feature is available onlyon the LPC2000 ARM Microcontroller family of products. The LPC2400 can execute both32-bit ARM and 16-bit Thumb instructions. Support for the two Instruction Sets meansEngineers can choose to optimize their application for either performance or code size atthe sub-routine level. When the core executes instructions in Thumb state it can reducecode size by more than 30 % with only a small loss in performance while executinginstructions in ARM state maximizes core performance.
上傳時間： 2013-11-15
上傳用戶：zouxinwang
The TJA1042 is a high-speed CAN transceiver that provides an interface between aController Area Network (CAN) protocol controller and the physical two-wire CAN bus.The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in theautomotive industry, providing the differential transmit and receive capability to (amicrocontroller with) a CAN protocol controller.
標簽： High-speed transce 1042 TJA
上傳時間： 2014-12-28
上傳用戶：氣溫達上千萬的
The TJA1051 is a high-speed CAN transceiver that provides an interface between aController Area Network (CAN) protocol controller and the physical two-wire CAN bus.The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in theautomotive industry, providing differential transmit and receive capability to (amicrocontroller with) a CAN protocol controller.
標簽： High-speed transce 1051 TJA
上傳時間： 2013-10-17
上傳用戶：jisujeke
基于單片機的除塵控制器的設計:介紹通用控制儀的硬件組成和軟件設計,闡述了系統的性能指標和功能特點。該產品功能完善,可靠性高,具有很好的應用前景。關鍵詞: 除塵器;通用控制儀;單片機;系統設計 Abstract: The hardware structure and the software design are introduced in this paper, and the performance index and the features of the system are expounded. It has comp rehensive functions, high reliability and good app lication.Key words: dust catcher; universal controller; microcontroller; system design
上傳時間： 2013-11-16
上傳用戶：ming52900
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標簽： UltraScale Xilinx 架構
上傳時間： 2013-11-13
上傳用戶：瓦力瓦力hong
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
