Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which INCLUDEs the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This INCLUDEs interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
The LTP5900 INCLUDEs sufficient power supply filtering and decoupling capacitancesuch that additional filtering should not be necessary for most battery-powereddesigns. Care must be taken to avoid large transient voltages on the supply as theM2510 steps up its current consumption (see the section on Supply Design below).
Abstract: This document details the Lakewood (MAXREFDES7#) subsystem reference design, a 3.3V input, ±12V (±15V) output, isolated power supply. The Lakewood reference design INCLUDEs a 3W primary-side transformer H-bridge driver for isolated supplies, and two wide input range and adjustable output low-dropout linear regulators (LDOs). Test results and hardware files are included.
Abstract: This document details the Riverside (MAXREFDES8#) subsystem reference design, a 3.3V input, 12V (15V) output, isolated power supply. The Riverside reference design INCLUDEs a 3W primary-side transformer H-bridge driver for isolated supplies, and one wide input range and adjustable output low-dropout linear regulator (LDO). Test results and hardware files are included.
Abstract: This document details the Oceanside (MAXREFDES9#) subsystem reference design, a 3.3V to 15V input,±15V (±12V) output, isolated power supply. The Oceanside design INCLUDEs a high-efficiency step-up controller, a36V H-bridge transformer driver for isolated supplies, a wide input range, and adjustable output low-dropout linearregulator (LDO). Test results and hardware files are included.
Easy-to-use and compact point-of-load power suppliesare necessary in systems with widely distributed, highcurrent, low voltage loads. The LTC®3415 provides acompact, simple and versatile solution. It INCLUDEs a pairof integrated complementary power MOSFETs (32mΩtop and 25mΩ bottom) and requires no external senseresistor. A complete design requires an inductor andinput/output capacitors, and that’s it. The result is a fast,constant frequency, 7A current mode DC/DC switchingregulator.
When a system designer specifies a nonisolated dc/dc powermodule, considering the needed input voltage range isequally as important as considering the required performanceattributes and features. Generally, nonisolated moduleshave either a narrow or a wide input voltage range. Narrowinputmodules typically have a nominal input voltage of3.3, 5, or 12 V. For systems that operate from a tightlyregulated input bus—such as those that do not use batterybackup—a narrow-input module is often adequate sincethe input remains fairly stable.Offering greater flexibility, wide-input modules operatewithin a range of 7 to 36 V, which INCLUDEs the popular12- or 24-V industrial bus. This enables a single module tobe used for generating multiple voltages. These modulesare ideal for industrial controls, HVAC systems, vehicles,medical instrumentation, and other applications that usea loosely regulated distribution bus. In addition, systemspowered by a rectifier/battery charger with lead-acidbattery backup almost always require wide-input modules.System designers who choose power supplies may wantto take a close look at the latest generation of wide-inputdc/dc modules.
為了提高PCB板制作的效率，改變傳統(tǒng)的化學腐蝕制板工藝，使用機械仿形銑制作電路板的方法，設計了以ATMEGA16單片機為核心部件的PCB板雕刻機控制系統(tǒng)。其中包括PCB雕刻機的基本功能、主要硬件電路設計和軟件的實現(xiàn)流程，并給出了相關設計電路。重點分析了雕刻機步進電機的驅動電路以及主軸電機的驅動電路，該雕刻機經實際運行，系統(tǒng)工作良好，可有效提高PCB板的制作效率。
Abstract:
In order to improve the efficiency of production of PCB board and change the traditional chemical etching plates， using of mechanical copying milling method makes circuit boards，this paper introduces the PCB engraving machine control system used ATMEGA16 microcomputer as the core components. It INCLUDEs basic function， the hardware circuit design and software realization process， and gives the corresponding circuit design.It analyses the drive circuit of engrawing machine stepper motor and spindle motor in detail. This engraving machine by practical operation， the system works well， which can effectively improve the production efficiency of PCB board.
