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MIXED-signal

  • 光電轉(zhuǎn)換電路設(shè)計(jì)

    OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.

    標(biāo)簽: 光電轉(zhuǎn)換 電路設(shè)計(jì)

    上傳時(shí)間: 2013-10-27

    上傳用戶:落花無痕

  • 高速PCB基礎(chǔ)理論及內(nèi)存仿真技術(shù)(經(jīng)典推薦)

    第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠0弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309

    標(biāo)簽: PCB 內(nèi)存 仿真技術(shù)

    上傳時(shí)間: 2014-04-18

    上傳用戶:wpt

  • pci e PCB設(shè)計(jì)規(guī)范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標(biāo)簽: pci PCB 設(shè)計(jì)規(guī)范

    上傳時(shí)間: 2013-10-15

    上傳用戶:busterman

  • GPON系統(tǒng)的APD偏置解決方案

      Avalanche photo diode (APD) receiver modules arewidely used in fi ber optic communication systems. AnAPD module contains the APD and a signal conditioningamplifi er, but is not completely self contained. It stillrequires signifi cant support circuitry including a highvoltage, low noise power supply and a precision currentmonitor to indicate the signal strength. The challenge issqueezing this support circuitry into applications withlimited board space. The LT®3482 addresses this challengeby integrating a monolithic DC/DC step-up converter andan accurate current monitor. The LT3482 can supportup to a 90V APD bias voltage, and the current monitorprovides better than 10% accuracy over four decades ofdynamic range (250nA to 2.5mA).

    標(biāo)簽: GPON APD 方案

    上傳時(shí)間: 2014-01-18

    上傳用戶:wenyuoo

  • 光纖激光器的電流源分析

      A large group of fiber optic lasers are powered by DCcurrent. Laser drive is supplied by a current source withmodulation added further along the signal path. Thecurrent source, although conceptually simple, constitutesan extraordinarily tricky design problem. There are anumber of practical requirements for a fiber optic currentsource and failure to consider them can cause laser and/or optical component destruction.

    標(biāo)簽: 光纖激光器 電流源

    上傳時(shí)間: 2013-10-30

    上傳用戶:wanghui2438

  • 測量和控制的實(shí)用電路分析

      This collection of circuits was worked out between June1991 and July of 1994. Most were designed at customerrequest or are derivatives of such efforts. All representsubstantial effort and, as such, are disseminated here forwider study and (hopefully) use.1 The examples areroughly arranged in categories including power conversion,transducer signal conditioning, amplifiers and signalgenerators. As always, reader comment and questionsconcerning variants of the circuits shown may be addresseddirectly to the author.

    標(biāo)簽: 測量 控制 實(shí)用電路

    上傳時(shí)間: 2013-11-15

    上傳用戶:凌云御清風(fēng)

  • 基于開關(guān)電容技術(shù)的鎖定放大器設(shè)計(jì)

    鎖定放大是微弱信號(hào)檢測的重要手段。基于相關(guān)檢測理論,利用開關(guān)電容的開關(guān)實(shí)現(xiàn)鎖定放大器中乘法器的功能,提出開關(guān)電容和積分器相結(jié)合以實(shí)現(xiàn)相關(guān)檢測的方法,并設(shè)計(jì)出一種鎖定放大器。該鎖定放大器將微弱信號(hào)轉(zhuǎn)化為與之相關(guān)的方波,通過后續(xù)電路得到正比于被測信號(hào)的直流電平,為后續(xù)采集處理提供方便。測量數(shù)據(jù)表明鎖定放大器前級(jí)可將10-6 A的電流轉(zhuǎn)換為10-1 V的電壓,后級(jí)通過帶通濾波器級(jí)聯(lián)可將信號(hào)放大1×105倍。該方法在降低噪聲的同時(shí),可對(duì)微弱信號(hào)進(jìn)行放大,線性度較高、穩(wěn)定性較好。 Abstract:  Lock-in Amplifying(LIA)is one of important means for weak signal detection. Based on cross-correlation detection theory, switch in the swithched capacitor was used as multiplier of LIA, and a new method of correlation detection was proposed combining swithched capacitor with integrator. A kind of LIA was designed which can convert the weak signal to square-wave, then DC proportional to measured signal was obtained through follow-up conditioning circuit, providing convenience for signal acquisition and processing. The measured data shows that the electric current(10-6 A) can be changed into voltage(10-1 V) by LIA, and the signal is magnified 1×105 times by cascade band-pass filter. The noise is suppressed and the weak signal is amplified. It has the advantages of good linearity and stability.

    標(biāo)簽: 開關(guān)電容 鎖定放大器

    上傳時(shí)間: 2013-11-29

    上傳用戶:黑漆漆

  • MAXX9257 MAX9258芯片可編程SerDes持續(xù)時(shí)間計(jì)算

    The MAX9257/MAX9258 programmable serializer/deserializer (SerDes) devices transfer both video data and control signals over the same twisted-pair cable. However, control data can only be transmitted during the vertical blank time, which is indicated by the control-channel-enabled output (CCEN) signal. The electronic control unit (ECU) firmware designer needs to know how quickly to respond to the CCEN signal before it times out and how to calculate this duration. This application note describes how to calculate the duration of the CCEN for the MAX9257/MAX9258 SerDes chipset. The calculation is based on STO timeout, clock frequency, and UART bit timing. The CCEN duration is programmable and can be closed if not in use.

    標(biāo)簽: SerDes MAXX 9257 9258

    上傳時(shí)間: 2014-01-24

    上傳用戶:xingisme

  • 基于AVR單片機(jī)的閉環(huán)控制系統(tǒng)

      針對(duì)科研實(shí)驗(yàn)中對(duì)拉壓千斤頂加載過程控制的需要,采用ATmega128單片機(jī)控制步進(jìn)電機(jī)進(jìn)而實(shí)現(xiàn)對(duì)執(zhí)行系統(tǒng)的電動(dòng)泵站實(shí)行自動(dòng)控制。對(duì)力和位移的數(shù)據(jù)采集與處理及用步進(jìn)電機(jī)控制電動(dòng)泵站手柄的技術(shù)細(xì)節(jié)作了重點(diǎn)描述。通過單片機(jī)的A/D變換器對(duì)AMP放大模塊采集的電橋信號(hào)作量化處理,千斤頂?shù)牟倏厥直恢靡离妱?dòng)油泵閥門開啟的方向和大小作若干定位,單片機(jī)根據(jù)力或位移傳感器信號(hào),實(shí)時(shí)控制步進(jìn)電機(jī)驅(qū)動(dòng)手柄旋轉(zhuǎn)到相應(yīng)操控位置。   Abstract:   This article describes the use of ATmega128 AVR microcontroller series of DBS electric pumping stations and QF100/200 separate twoway hydraulic jack to automate the process of manipulating the work of the technical content. Articles on force and displacement data acquisition and processing, and stepper motor control electric pump with the handle of the key technical details were described. Through the MCU’s A / D converter module is collected on the AMP amplification quantify the signal bridge, jack handle position control valve opening according to the direction of electric pumps for a number of positioning and size of the microcontroller based on force or displacement sensor signals, real-time control stepper motor drive control handle rotate to the appropriate location.  

    標(biāo)簽: AVR 單片機(jī) 閉環(huán)控制

    上傳時(shí)間: 2014-01-16

    上傳用戶:hasan2015

  • 基于PIC18F1320微控制器的信號(hào)采集系統(tǒng)

      便攜式信號(hào)采集在機(jī)器健康診斷系統(tǒng)中有較高的應(yīng)用價(jià)值。機(jī)器健康診斷的信號(hào)特點(diǎn)是包括低頻信號(hào)。本文研究是為了實(shí)現(xiàn)簡易而且低成本的低頻便攜式信號(hào)采集。以Microchip公司單片機(jī)PIC18F1320為核心設(shè)計(jì)信號(hào)采集電路,實(shí)現(xiàn)了信號(hào)的采集和保存。系統(tǒng)采用串行電可擦除芯片24LC32A保存數(shù)據(jù),經(jīng)過有線通信,信號(hào)數(shù)據(jù)由串行口通過MAX232芯片輸送到微型計(jì)算機(jī)接收和保存,最后繪制出信號(hào)波形。 微型計(jì)算機(jī)程序采用Visual Basic編程。研究成功采樣頻率為3 kHz的復(fù)雜信號(hào),證明該方案符合設(shè)計(jì)要求。   Abstract:   Portable signal acquisition is useful in machine health monitoring systems. The signal characteristics of machine health monitoring includes low frequency signals. The goal of this study is to realize simple, inexpensive and portable low frequency signal sampling. This paper provides the project of signal acquisition system design based on PIC18F1320 microcontroller manufactured by the Microchip Technology Incorporation to achieve signal sampling and storage. The system adopted EEPROM 24LC32A to store the signal data. The microcomputer received data via wired link with the MAX232 IC through the serial port. The microcomputer program, programmed in Visual Basic, received the data, stored it and plotted the signal. The study successfully samples 3kHz complicated signals and thus meets the design requirement.

    標(biāo)簽: F1320 1320 PIC 18F

    上傳時(shí)間: 2013-11-19

    上傳用戶:moerwang

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