When I started writing the first edition of RF Power Amplifiers for Wireless Communications,some time back in 1997, it seemed that I was roaming a largely uninhabitedlandscape. For reasons still not clear to me there were few, if any, otherbooks dedicated to the subject of RF power amplifiers. Right at the same time, however,hundreds of engineers were being assigned projects to design PAs for wirelesscommunications products. It was not, therefore, especially difficult to be successfulwith a book that was fortuitously at the right place and the right time.
標(biāo)簽： Communications Amplifiers Wireless Edition
上傳時間： 2013-11-12
上傳用戶：YYRR
Abstract: The process of designing a radio system can be complex and often involves many project tradeoffs. Witha little insight, balancing these various characteristics can make the job of designing a radio system easier. Thistutorial explores these tradeoffs and provides details to consider for various radio applications. With a focus on theindustrial, scientific, medical (ISM) bands, the subjects of frequency selection, one-way versus two-way systems,modulation techniques, cost, antenna options, power-supply influences, effects on range, and protocol selectionare explored.
標(biāo)簽： 無線
上傳時間： 2013-12-13
上傳用戶：eastgan
在研究傳統(tǒng)家用燃?xì)鈭缶鞯幕A(chǔ)上，以ZigBee協(xié)議為平臺，構(gòu)建mesh網(wǎng)狀網(wǎng)絡(luò)實現(xiàn)網(wǎng)絡(luò)化的智能語音報警系統(tǒng)。由于傳感器本身的溫度和實際環(huán)境溫度的影響，傳感器標(biāo)定后采用軟件補償方法。為了減少系統(tǒng)費用，前端節(jié)點采用半功能節(jié)點設(shè)備，路由器和協(xié)調(diào)器采用全功能節(jié)點設(shè)備，構(gòu)建mesh網(wǎng)絡(luò)所形成的家庭內(nèi)部報警系統(tǒng)，通過通用的電話接口連接到外部的公用電話網(wǎng)絡(luò)，啟動語音模塊進行報警。實驗結(jié)果表明，在2.4 GHz頻率下傳輸，有墻等障礙物的情況下，節(jié)點的傳輸距離大約為35 m，能夠滿足家庭需要，且系統(tǒng)工作穩(wěn)定，但在功耗方面仍需進一步改善。 Abstract: On the basis of studying traditional household gas alarm system, this paper proposed the platform for the ZigBee protocol，and constructed mesh network to achieve network-based intelligent voice alarm system. Because of the sensor temperature and the actual environment temperature, this system design used software compensation after calibrating sensor. In order to reduce system cost, semi-functional node devices were used as front-end node, however, full-function devices were used as routers and coordinator，constructed alarm system within the family by building mesh network，connected to the external public telephone network through the common telephone interface, started the voice alarm module. The results indicate that nodes transmit about 35m in the distance in case of walls and other obstacles by 2.4GHz frequency transmission, this is able to meet family needs and work steadily, but still needs further improvement in power consumption.
標(biāo)簽： ZigBee 無線智能 家 報警系統(tǒng)
上傳時間： 2013-10-30
上傳用戶：swaylong
通過比較各種隔離數(shù)字通信的特點和應(yīng)用范圍，指出塑料光纖在隔離數(shù)字通信中的優(yōu)勢。使用已經(jīng)標(biāo)準(zhǔn)化的TOSLINK接口，有利于節(jié)省硬件開發(fā)成本和簡化設(shè)計難度。給出了塑料光纖的硬件驅(qū)動電路，說明設(shè)計過程中的注意事項，對光收發(fā)模塊的電壓特性和頻率特性進行全面試驗，并給出SPI口使用塑料光纖隔離通信的典型應(yīng)用電路圖。試驗結(jié)果表明，該設(shè)計可為電力現(xiàn)場、電力電子及儀器儀表的設(shè)計提供參考。 Abstract: y comparing characteristics and applications area of various isolated digital communications， this article indicates advantages of plastic optical fiber in isolated digital communications. Using the standardized TOSLINK interface， it helps to control costs and difficulty in hardware development and design. Then it gives the hardware driver circuit of plastic optical fiber module， explains the noticed details in design process， gives results on the basis of the optical transceiver module voltage characteristics and frequency characteristics tests. Finally，it gives typical application circuit of the SPI communication port by using plastic optical fiber isolation .The results show that this design can be referenced for the power field， power electronics and instrumentation design.
標(biāo)簽： 塑料光纖 高壓隔離 通信 接口設(shè)計
上傳時間： 2014-01-10
上傳用戶：gundan
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.
標(biāo)簽： Cortex-M 1850 LPC 內(nèi)核微控制器
上傳時間： 2014-12-31
上傳用戶：zhuoying119
資料介紹說明 orcad到power格式Dxdesigner轉(zhuǎn)換器下載，為綠色免安裝版，下載后雙擊schcvt.exe，即可使用了，界面如下圖所示
標(biāo)簽： Dxdesigner orcad power 轉(zhuǎn)換器
上傳時間： 2013-11-01
上傳用戶：xinyuzhiqiwuwu
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽： UltraScale Xilinx 架構(gòu)
上傳時間： 2013-11-21
上傳用戶：wxqman
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 圖Figure 1. Local Safety System
標(biāo)簽： FPGA 安全系統(tǒng)
上傳時間： 2013-11-14
上傳用戶：zoudejile
WP369可擴展式處理平臺-各種嵌入式系統(tǒng)的理想解決方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
上傳時間： 2013-10-18
上傳用戶：cursor
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
標(biāo)簽： EMI 開關(guān)電源 英文
上傳時間： 2013-11-16
上傳用戶：萍水相逢
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