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SINGLE-chip

  • LPC4300系列ARM雙核微控制器產品數據手冊

    The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals

    標簽: 4300 LPC ARM 雙核微控制器

    上傳時間: 2013-10-28

    上傳用戶:15501536189

  • LPC1300系列產品勘誤數據手冊

    On the LPC13xx, programming, erasure and re-programming of the on-chip flash can be performed using In-System Programming (ISP) via the UART serial port, and also, can be performed using In-Application Programming (IAP) calls directed by the end-user code. For In-System Programming (ISP) via the UART serial port, the ISP command handler (resides in the bootloader) allows erasure of one or more sector (s) of the on-chip flash memory.

    標簽: 1300 LPC 勘誤 數據手冊

    上傳時間: 2013-12-13

    上傳用戶:lmq0059

  • 遠程配置Nios II處理器應用筆記

         通過以太網遠程配置Nios II 處理器 應用筆記 Firmware in embedded hardware systems is frequently updated over the Ethernet. For embedded systems that comprise a discrete microprocessor and the devices it controls, the firmware is the software image run by the microprocessor. When the embedded system includes an FPGA, firmware updates include updates of the hardware image on the FPGA. If the FPGA includes a Nios® II soft processor, you can upgrade both the Nios II processor—as part of the FPGA image—and the software that the Nios II processor runs, in a single remote configuration session.

    標簽: Nios 遠程 處理器 應用筆記

    上傳時間: 2013-11-22

    上傳用戶:chaisz

  • Nios II定制指令用戶指南

         Nios II定制指令用戶指南:With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor. The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.

    標簽: Nios 定制 指令 用戶

    上傳時間: 2013-10-12

    上傳用戶:kang1923

  • 《器件封裝用戶向導》賽靈思產品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-11-21

    上傳用戶:不懂夜的黑

  • Analog Solutions for Altera FPGAs

    Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)

    標簽: Solutions Analog Altera FPGAs

    上傳時間: 2013-10-27

    上傳用戶:fredguo

  • XAPP440 - Xilinx CPLD的上電性能

    Applying power to a standard logic chip, SRAM, or EPROM, usually results in output pinstracking the applied voltage as it rises. Programmable logic attempts to emulate that behavior,but physics forbids perfect emulation, due to the device programmability. It requires care tospecify the pin behavior, because programmable parts encounter unknown variables – yourdesign and your power environment.

    標簽: Xilinx XAPP CPLD 440

    上傳時間: 2013-11-24

    上傳用戶:253189838

  • XAPP144 -設計CPLD多電壓系統

    Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.

    標簽: XAPP CPLD 144 電壓

    上傳時間: 2013-11-10

    上傳用戶:yy_cn

  • XAPP740利用AXI互聯設計高性能視頻系統

    This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board

    標簽: XAPP 740 AXI 互聯

    上傳時間: 2013-11-23

    上傳用戶:shen_dafa

  • xilinx Zynq-7000 EPP產品簡介

    The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously. 

    標簽: xilinx Zynq 7000 EPP

    上傳時間: 2013-10-09

    上傳用戶:evil

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