SMPP SPECIFICATIONs used for SMPP configuration and settings to connect SMSC
標簽： SMPP SPECIFICATIONs configuration settings
上傳時間： 2014-01-27
上傳用戶：熊少鋒
PayPass – M/Chip Technical SPECIFICATIONs
標簽： SPECIFICATIONs Technical PayPass Chip
上傳時間： 2017-07-04
上傳用戶：頂得柱
complete perl SPECIFICATIONs
標簽： SPECIFICATIONs complete perl
上傳時間： 2013-12-14
上傳用戶：aappkkee
understanding operational amplifiers SPECIFICATIONs
標簽： SPECIFICATIONs understanding operational amplifiers
上傳時間： 2017-07-15
上傳用戶：hakim
Understanding and Using DC Motor SPECIFICATIONs
標簽： SPECIFICATIONs Understanding Motor Using
上傳時間： 2013-12-23
上傳用戶：杜瑩12345
Abstract: Most magnetic read head data sheets do not fully specify the frequency-dependent components andare often vague when specifying other key parameters. In some cases, the SPECIFICATIONs of two very similarheads from two different manufacturers might be quite different in terms of parameters specified and omitted.The limitations in the data sheets make designing an optimum card reading system unnecessarily difficult andtime consuming. This document outlines a strategy to overcome the above shortcomings and offers guidelinesto overcome the noise issues.
上傳時間： 2013-11-13
上傳用戶：dysyase
A MEMS microphone IC is unique among Analog Devices, Inc., products in that its input is an acoustic pressure wave. For this reason, some SPECIFICATIONs included in the data sheets for these parts may not be familiar, or familiar SPECIFICATIONs may be applied in unfamiliar ways. This application note explains the specifica-tions and terms found in MEMS microphone data sheets so that the microphone can be appropriately designed into a system.
上傳時間： 2013-10-31
上傳用戶：masochism
Abstract: SPECIFICATIONs such as noise, effective number of bits (ENOB), effective resolution, and noise-free resolution inlarge part define how accurate an ADC really is. Consequently, understanding the performance metrics related to noise isone of the most difficult aspects of transitioning from a SAR to a delta-sigma ADC. With the current demand for higherresolution, designers must develop a better understanding of ADC noise, ENOB, effective resolution, and signal-to-noiseratio (SNR). This application note helps that understanding.
上傳時間： 2013-10-16
上傳用戶：x18010875091
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable SPECIFICATIONs. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their SPECIFICATIONs isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.
上傳時間： 2013-11-17
上傳用戶：asdfasdfd
