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SPECIFICATIONs

產品規格（SPECIFICATIONs）是指物件的體積、大小、型號。是用來識別物品的編號。中國最早沒有編號規則，一汽投產時是CA10、CA30等參考蘇聯的編號。

SMPP SPECIFICATIONs used for SMPP configuration and settings to connect SMSC

SMPP SPECIFICATIONs used for SMPP configuration and settings to connect SMSC

標簽： SMPP SPECIFICATIONs configuration settings

上傳時間： 2014-01-27

上傳用戶：熊少鋒
PayPass – M/Chip Technical SPECIFICATIONs

PayPass – M/Chip Technical SPECIFICATIONs

標簽： SPECIFICATIONs Technical PayPass Chip

上傳時間： 2017-07-04

上傳用戶：頂得柱
complete perl SPECIFICATIONs

complete perl SPECIFICATIONs

標簽： SPECIFICATIONs complete perl

上傳時間： 2013-12-14

上傳用戶：aappkkee
understanding operational amplifiers SPECIFICATIONs

understanding operational amplifiers SPECIFICATIONs

標簽： SPECIFICATIONs understanding operational amplifiers

上傳時間： 2017-07-15

上傳用戶：hakim
Understanding and Using DC Motor SPECIFICATIONs

Understanding and Using DC Motor SPECIFICATIONs

標簽： SPECIFICATIONs Understanding Motor Using

上傳時間： 2013-12-23

上傳用戶：杜瑩12345
提高在噪聲環境下的磁卡讀寫器(MCR)系統

Abstract: Most magnetic read head data sheets do not fully specify the frequency-dependent components andare often vague when specifying other key parameters. In some cases, the SPECIFICATIONs of two very similarheads from two different manufacturers might be quite different in terms of parameters specified and omitted.The limitations in the data sheets make designing an optimum card reading system unnecessarily difficult andtime consuming. This document outlines a strategy to overcome the above shortcomings and offers guidelinesto overcome the noise issues.

標簽： MCR 噪聲環境磁卡讀寫器

上傳時間： 2013-11-13

上傳用戶：dysyase
MEMS麥克風有助于提高系統設計效率

A MEMS microphone IC is unique among Analog Devices, Inc., products in that its input is an acoustic pressure wave. For this reason, some SPECIFICATIONs included in the data sheets for these parts may not be familiar, or familiar SPECIFICATIONs may be applied in unfamiliar ways. This application note explains the specifica-tions and terms found in MEMS microphone data sheets so that the microphone can be appropriately designed into a system.

標簽： MEMS 麥克風系統設計效率

上傳時間： 2013-10-31

上傳用戶：masochism
了解模數轉換器的噪聲、ENOB

Abstract: SPECIFICATIONs such as noise, effective number of bits (ENOB), effective resolution, and noise-free resolution inlarge part define how accurate an ADC really is. Consequently, understanding the performance metrics related to noise isone of the most difficult aspects of transitioning from a SAR to a delta-sigma ADC. With the current demand for higherresolution, designers must develop a better understanding of ADC noise, ENOB, effective resolution, and signal-to-noiseratio (SNR). This application note helps that understanding.

標簽： ENOB 模數轉換器

上傳時間： 2013-10-16

上傳用戶：x18010875091
pci e PCB設計規范

This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable SPECIFICATIONs. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.

標簽： pci PCB 設計規范

上傳時間： 2013-10-15

上傳用戶：busterman
確保電解電容器的壽命長-LED燈泡為例

Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their SPECIFICATIONs isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.

標簽： LED 電解電容器壽命

上傳時間： 2013-11-17

上傳用戶：asdfasdfd

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SPECIFICATIONs

SMPP SPECIFICATIONs used for SMPP configuration and settings to connect SMSC

PayPass – M/Chip Technical SPECIFICATIONs

complete perl SPECIFICATIONs

understanding operational amplifiers SPECIFICATIONs

Understanding and Using DC Motor SPECIFICATIONs

提高在噪聲環境下的磁卡讀寫器(MCR)系統

MEMS麥克風有助于提高系統設計效率

了解模數轉換器的噪聲、ENOB

pci e PCB設計規范

確保電解電容器的壽命長-LED燈泡為例