Low power operation of electronic apparatus has becomeincreasingly desirable. Medical, remote data acquisition,power monitoring and other applications are good candidatesfor battery driven, low power operation. Micropoweranalog circuits for transducer-based signal conditioningpresent a special class of problems. Although micropowerICs are available, the interconnection of these devices toform a functioning micropower circuit requires care. (SeeBox Sections, “Some Guidelines for Micropower Designand an Example” and “Parasitic Effects of Test Equipmenton Micropower Circuits.”) In particular, trade-offs betweensignal levels and power dissipation become painful whenperformance in the 10-bit to 12-bit area is desirable.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main Sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
提出一種基于凌陽單片機(jī)的步進(jìn)電機(jī)加減速的控制方法。采用凌陽科技推出的16位結(jié)構(gòu)工控單片機(jī)SPMC75F2413A為控制器，由Allegro公司生產(chǎn)的兩相步進(jìn)電機(jī)專用驅(qū)動器件SLA7042M構(gòu)成步進(jìn)電機(jī)的驅(qū)動電路，在傳統(tǒng)的3段直線加減速控制算法基礎(chǔ)上增加至7段S形曲線加減速過程，控制步進(jìn)電機(jī)的啟動和停止。實(shí)驗(yàn)結(jié)果表明，該控制方法克服了直線加減速中不連續(xù)、易造成系統(tǒng)沖擊的問題，整個系統(tǒng)實(shí)現(xiàn)柔性控制，電機(jī)啟動、停止連續(xù)性能提高30%。
Abstract:
The method of controlled stepping motor is referred based on SPMC75F2413A MCU， which adopts the 16 knots SPMC75F2413A MCU as the controller. The special-purpose actuation chip SLA7042M of two stepping motor produced by Allegro Corporation constituted to actuation electric circuit. The purpose of increasing to seven section of S shape curve based on the traditional three Sections of straight line is to control the start and stop process of stepping motor. The experimental results show that the control method solves easy to pull-out and overshot problems. The overall system realizes flexible control， and the performance of motor start or stop continuity is increased 30%
MPLAB C30用戶指南(英文)
HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support
Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on Sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
Nios II軟件構(gòu)建工具入門
The Nios® II Software Build Tools (SBT) allows you to construct a wide variety of
complex embedded software systems using a command-line interface. From this
interface, you can execute Software Built Tools command utilities, and use scripts
other tools) to combine the command utilities in many useful ways.
This chapter introduces you to project creation with the SBT at the command line
This chapter includes the following Sections:
■ “Advantages of Command-Line Software Development”
■ “Outline of the Nios II SBT Command-Line Interface”
■ “Getting Started in the SBT Command Line”
■ “Software Build Tools Scripting Basics” on page 3–8
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main Sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
The AN10 begins with a survey of methods for measuring op amp settling time. This commentary develops into circuits for measuring settling time to 0.0005%. Construction details and results are presented. Appended Sections cover oscilloscope overload limitations and amplifier frequency compensation.
A collection of interface applications between various microprocessors/ controllers and the LTC1090 family of data acquisition systems. The note is divided into Sections specific to each interface.
