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標(biāo)簽： 源代碼
上傳時(shí)間： 2017-11-17
上傳用戶：wendingchang
This book is an entry-level text on the technology of telecommunications. It has been crafted with the newcomer in mind. The eighteen chapters of text have been prepared for high-school graduates who understand algebra, logarithms, and basic electrical prin- ciples such as Ohm’s law. However, many users require support in these areas so Appen- dices A and B review the essentials of electricity and mathematics through logarithms.
標(biāo)簽： Telecommunications Fundamentals 1st of ed
上傳時(shí)間： 2020-05-27
上傳用戶：shancjb
This book is an entry-level text on the technology of telecommunications. It has been crafted with the newcomer in mind. The twenty-one chapters of text have been prepared for high-school graduates who understand algebra, logarithms, and the basic principles of electricity such as Ohm’s law. However, it is appreciated that many readers require support in these areas. Appendices A and B review the essentials of electricity and mathematics up through logarithms. This material was placed in the appendices so as not to distract from the main theme, the technology of telecommunication systems. Another topic that many in the industry find difficult is the use of decibels and derived units. Appendix C provides the reader a basic understanding of decibels and their applications. The only mathematics necessary is an understanding of the powers of ten
標(biāo)簽： Telecommunications Fundamentals 2nd of ed
上傳時(shí)間： 2020-05-27
上傳用戶：shancjb
This edition updates and continues the series of books based on the residential courses on radiowave propagation organised by the IEE/IET. The first course was held in 1974, with lectures by H. Page, P. Matthews, D. Parsons, M.W. Gough, P.A. Watson, E. Hickin, T. Pratt, P. Knight, T.B. Jones, P.A. Bradley, B. Burgess and H. Rishbeth.
標(biāo)簽： Propagation Radiowaves edition 3rd of
上傳時(shí)間： 2020-05-31
上傳用戶：shancjb
It was the publisher’s idea that I write RFID in the Supply Chain: A Guide to Selection and Implementation . Not only am I editor of Enterprise Inte- gration System , Second Edition Handbook and author of The Complete Book of Middleware , I also had some innovative business process and project management ideas on improving the effectiveness of integrating enterprise systems with information on product traceability, the scope of which has been widened by the RFID technology mandates.
標(biāo)簽： Selection Supply Chain Guide RFID the in to
上傳時(shí)間： 2020-06-08
上傳用戶：shancjb
用三點(diǎn)法實(shí)現(xiàn)機(jī)器人三維位置測(cè)量的研究摘 要 ：提 出 了一 種 微 小 爬 壁 機(jī) 器 人 三 維 位 置 測(cè) 量 的新 方 法 。筆 者 通 過(guò) 深 入 分 析 研 究各 種 位 置 測(cè) 控 方 法 與 系 統(tǒng) ，提 出采 用單 目視 覺(jué)方 法 中的 聚 焦法 ，以 CCD作 為 傳 感 器 ，用 三 點(diǎn) 法 實(shí)現(xiàn) 對(duì) 機(jī) 器 人 的 三 維 位 置 測(cè) 量 。 驗(yàn) 證性 實(shí)驗(yàn) 結(jié)果表 明 ，本研 究提 出的測(cè) 量原 理和 系統(tǒng)是 正 確 可行 的 。 關(guān)鍵詞 ：機(jī) 器人 ；位置 測(cè)量 ；CCD傳 感 器 ；單 目視 覺(jué) ；攝 像 機(jī) 標(biāo) 定 中 圖分 類 號(hào) ：TP242．6 文 獻(xiàn) 標(biāo) 識(shí) 碼 ：B Abstract：A new 3D position measurementmethod Ofa wall—climbing micro robothas been researched．Researc— hing on the various position measuring and controlling method，theauthorhasputforwardanewprojecttomeas— ure the 3D position of the robot，in which the focusing method with singlecamera and CCD sensorhasbeen used to getthe position information．The elementary experiment has verified the principle and the system． Key words：robot；position detection；CCD sensor；single camera vision；camera caiibration 位置測(cè)量技 術(shù)是智 能機(jī) 器人 的關(guān)鍵 技術(shù) ，是各 種 機(jī)器人控 制系統(tǒng) 中極 為重 要 的環(huán)節(jié) ，也 是 國(guó)內(nèi)外研 究 的熱點(diǎn)所 在。 按 照測(cè)試 系統(tǒng) 與被 測(cè)機(jī) 器 人 的關(guān) 系 ，可 以將位 置 測(cè)量技術(shù) 分為接觸 式和非接觸式 兩大類 。接觸 式測(cè)量 系統(tǒng) 由于在測(cè) 量過(guò)程 中或多或少地 對(duì)機(jī)器人施 加 了載 荷 ，因而僅適用于靜 態(tài) 位置測(cè) 量 。而動(dòng) 態(tài) 位 置測(cè)量 系 統(tǒng) 主要分 5類 ：①激光跟蹤 系統(tǒng) ；@ CCD交 互測(cè)量 收 稿 日期 ：2001—07—03 基 金項(xiàng) 目：國(guó)家 863高科技 研 究 資助 項(xiàng) 目(9804-06)；教 育 部 高 等 學(xué)校 骨干教 師 資助 計(jì) 3t,j項(xiàng) 目 作者 簡(jiǎn) 介 ：張 智海 (1973一 )，男 ，工 學(xué)碩 士 ，主 要 研 究 方 向 為 智 能 機(jī) 器人 測(cè) 控 技 術(shù) 。 系統(tǒng) ；③ 超聲波 測(cè)量 系統(tǒng) ；④ PSD(positionsensitivede— vice)位 置 測(cè) 量 系統(tǒng) ；⑤ 帶 有 接 近覺(jué) 傳 感 器 的 測(cè)量 系 統(tǒng) 。位置測(cè)量 還可 以從另一個(gè)分類 角度劃分為主動(dòng)式 測(cè)量和被動(dòng) 式測(cè) 量 。主動(dòng)式測(cè) 量主要可 以分為結(jié) 構(gòu)光方法和激光 自動(dòng)聚焦法兩類 。被 動(dòng)式測(cè)量 主要 可 以分為雙 目視 覺(jué) 、三 目視覺(jué) 、單 目視覺(jué) 等方法 。 對(duì) 比以上各種方法 的 優(yōu)缺 點(diǎn) ，針對(duì) 筆者 研制 的微 小爬壁機(jī)器人 的空 間三 維位 置 測(cè)量 的要 求 ，測(cè)量 系統(tǒng) 必須滿足尺 寸小 、分 辨率 高 、穩(wěn)定 性 和可 靠性 好 、時(shí) 間 響應(yīng)快等特 點(diǎn) ，提 出了采用 單 目視覺(jué)方法 中的聚焦法 ， 選用 CCD作 為傳感器 ，用 三點(diǎn)法實(shí)現(xiàn)對(duì)機(jī)器人 的三維 位置測(cè)量 ，并用 Matlab和 V
標(biāo)簽： 機(jī)器人
上傳時(shí)間： 2022-02-12
上傳用戶：
高通(Qualcomm)藍(lán)牙芯片QCC5144_硬件設(shè)計(jì)詳細(xì)指導(dǎo)書（官方內(nèi)部培訓(xùn)手冊(cè)）其內(nèi)容是針對(duì)硬件設(shè)計(jì)、部分重要元器件選擇(ESD，F(xiàn)ilter）及走線注意事項(xiàng)的詳細(xì)說(shuō)明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 92.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天線 走線的注意事項(xiàng))4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 USB interfaces7.1 USB device port7.1.1 USB device port7.1.2 Layout notes 7.1.3 USB charger detectionA QCC5144 VFBGA example schematic and BOM B Recommended SMPS components specificationB.1 Inductor specifition B.2 Recommended inductors B.3 SMPS capacitor specifition
上傳時(shí)間： 2022-04-07
上傳用戶：默默
STM32 F1系列 MCU ATIUM AD集成庫(kù) 原理圖庫(kù) PCB 3D封裝庫(kù)文件,STM32F1XXXXX全系列原理圖+PCB封裝庫(kù)文件，共209個(gè)器件型號(hào)，CSV text has been written to file : STM32 F1.csvLibrary Component Count : 209Name Description----------------------------------------------------------------------------------------------------STM32F100C4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C4T7B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100C6T7B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100CBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100CBT7B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100R4H6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R4T6BTR STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100R6H6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R6T6 STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100R8H6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RBH6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100RBH6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100RBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RBT6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RCT6B STM32 ARM-based 32-bit MCU Value Line with 256 kB Flash, 24 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6 STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6B STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6 STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6B STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-
上傳時(shí)間： 2022-04-30
上傳用戶：jiabin
DescriptionThe IMX385LQR-C is a diagonal 8.35 mm (Type 1/2) CMOS active pixel type solid-state image sensor with a squarepixel array and 2.13 M effective pixels. This chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V triplepower supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved throughthe adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variablecharge-integration time.(Applications: Surveillance cameras)
標(biāo)簽： CMOS傳感器 IMX385LQR-C
上傳時(shí)間： 2022-06-18
上傳用戶：
sony CMOS傳感器datasheet，IMX178LQJ-C_Data_SheetDescriptionThe IMX178LQJ-C is a diagonal 8.92 mm (Type 1/1.8) CMOS active pixel type image sensor with a square pixelarray and 6.44 M effective pixels. This chip operates with analog 2.9 V, digital 1.2 V and interface 1.8 V triple powersupply, and has low power consumption.High sensitivity, low dark current and no smear are achieved through the adoption of R, G and B primary colormosaic filters.This chip features an electronic shutter with variable charge-integration time.(Applications: Surveillance cameras, FA cameras, Industrial cameras)
標(biāo)簽： CMOS傳感器 IMX178LQJ-C
上傳時(shí)間： 2022-06-18
上傳用戶：
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