OpenSVM was developped under Visual C++ 6.0 SP6, You can open the workspace file(*.dsw) in the opensvm-src folder. The folder include the svm.h and svm.cpp which in the libsvm (Copyright (c) 2000-2007 Chih-Chung Chang and Chih-Jen Lin All rights reserved) in the opensvm-src\libsvm. However, the files svm.h and svm.cpp codes were copied/merged into stdafx.h and stdafx.cpp in order to support the development, and OpenSVM still use other codes of libsvm. So you can see the libsvm package in the source package. You can open and build it with Visual C++ 6.0. Note: the problems must be in LIBSVM format. OpenSVM project page: http://sourceforge.net/projects/opensvm If you had any question, please mail to: cloudbyron@gmail.com
標簽： developped the workspace OpenSVM
上傳時間： 2016-01-30
上傳用戶：asdfasdfd
fpga open door,最最基礎的入門介紹，針對首次接觸此類的新手\r\n
上傳時間： 2013-08-10
上傳用戶：daijun20803
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上傳時間： 2013-10-22
上傳用戶：pei5
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
返馳式(Flyback) 電源供應器是交換式電源設計供應器(Switch Power Supply，SPS)的一種，為工業界常用之電路架構，其特點如下表所示，圖一所示為返馳式轉換器(Flyback Converter)電路。 一般設計SPS需要一些保護來提高系統設備之穩定安全，尤其是輸出過電壓保護極為重要，這個輸出過電壓保護目的是防止電氣設備上的元件之絕緣遭受過電壓的破壞。一般過電壓的測試方法是將回授Open讓系統呈現段回路狀況，導致一次側能量無限制提供給二次測來達到輸出過電壓現象。
上傳時間： 2013-11-06
上傳用戶：haoxiyizhong
Abstract: Stuxnet, a sophisticated virus that damaged Iran's nuclear capability, should be an eye openerfor the world. We can choose to learn something very narrow (how to combat the Stuxnet virus) or wecan choose to focus on the larger goal of thwarting the next type of creative cyber attack. Unfortunately,critical industrial infrastructure is not currently designed with security as a key goal, leaving open multipleavenues for an educated and funded attacker to create massive problems. This tutorial outlines somebasic concepts that engineers and product definers should consider to make sure their new projects stayahead of future threats.
上傳時間： 2013-11-17
上傳用戶：llwap
本文檔介紹如何使用PIC單片機編程器開發工具在目標電路板上仿真和調試固件。本手冊的內容編排如下 第一章 PIC單片機編程器概述 第二章 入門 第三章 PIC編程器和ICSP 第四章 PICKIT DEBUG EXPRESS 第五章 疑難解答 ......................
上傳時間： 2013-10-19
上傳用戶：sardinescn
遙控器使用方便, 功能多, 目前已廣泛應用在電視機、、、空調等各種家用電器中, 且價格便宜, 市上非常容易買到。如果能將遙控器上許多的按鍵解碼出來, 用作單片機系統的輸入, 則解決了常規矩陣鍵盤線路板大、布線復雜、占用口過多的弊病。而且通過使用遙控器, 操作時可實現人與設備的分離, 從而更加方便使用。下面以下編碼芯片的遙控器為例,談談如何用常用的系統單片機進行遙控的解碼。
上傳時間： 2013-10-15
上傳用戶：gxmm
任務1 廣告燈電路的制作 任務2 音頻控制電路的制作 任務3 繼電器控制電路的制作 任務4 程序調試 任務5 程序燒寫
上傳時間： 2013-10-29
上傳用戶：ZOULIN58
MSP430和ARM7是兩個完全不同體系構架的處理器，因此雖一些在應用上具有共性的問題做個簡要比較。 目前在應用中比較普遍關心的是 速度和功耗、 應用范圍、內部資源、硬件設計、設計周期、成本考慮
上傳時間： 2013-10-22
上傳用戶：wenwiang
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