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  • IEC 62368_2014--安規

    THIS PUBLICATION IS COPYRIGHT PROTECTEDCopyright ? 2014 IEC, Geneva, SwitzerlandAll rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any formor by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing fromeither IEC or IEC's member National Committee in the country of the requester. If you have any questions about IECcopyright or have an enquiry about obtaining additional rights to this publication, please contact the address below oryour local IEC member National Committee for further information.Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduiteni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopieet les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez desquestions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisezles coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

    標簽: iec標準

    上傳時間: 2021-10-21

    上傳用戶:kent

  • Datasheet for ST17H26 藍牙芯片產品詳細信息

    Legal Disclaimer Lenze Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lenze Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Lenze Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling Lenze Semiconductor products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Lenze Semiconductor for any damages arising or resulting from such use or sale.

    標簽: 藍牙芯片 ST17H26

    上傳時間: 2022-06-25

    上傳用戶:

  • GD32 Keil5工程創建步驟

    第一步:安裝DFP軟件包(1)按照Keil uVision5,步驟略。我的keil版本如下:uVision V5.21.1.0Copyright(C)2016 ARM Ltd and ARM Germany GmbH. All rights reserved.(2)下載GD3210X的DFP軟件包。下載地址:(3)安裝DFP軟件包。雙擊pack文件進行安裝,如下圖所示:點擊next,將包文件復制到上面的路徑位置。如下圖:GigaDevice文件夾就是安裝好的軟件包。第二步:創建Keil工程(1)通常要新建3個文件夾。如下圖所示:(2)打開keil5,新建project.將工程文件放到Mdk-Arm目錄下面。彈出器件選擇界面:在Device 下拉框,選擇Software Packs,選擇GD32F103RB點擊OK

    標簽: gd32 keil

    上傳時間: 2022-07-23

    上傳用戶:

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