This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
資源簡介:This document provides practical, common guidelines for incorporating pci Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guideline...
上傳時間: 2013-10-15
上傳用戶:busterman
資源簡介:This document provides practical, common guidelines for incorporating pci Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guideline...
上傳時間: 2014-01-24
上傳用戶:s363994250
資源簡介:PCB shej PCB 設計規范 下載看看
上傳時間: 2013-04-24
上傳用戶:yyq123456789
資源簡介:華為印刷電路板PCB設計規范 華為企業技術標準,有一定參考意義
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資源簡介:開關電源的PCB設計規范 在任何開關電源設計中,PCB板的物理設計都是最后一個環節,如果設計方法不當,PCB可能會輻射過多的電磁干擾,造成電源工作不穩定,以下針對各個步驟中所需注意的事項進行分析
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資源簡介:華碩內部的PCB設計規范,華碩內部的PCB設計規范
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資源簡介:和記奧普泰通信技術有限公司 印刷電路板PCB設計規范
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資源簡介:PCB設計規范2010最新版,79頁經典講解,設計者不可不看!
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資源簡介:臺灣神達電腦集團PCB設計規范
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上傳用戶:tyg88888
資源簡介:開關電源的PCB設計規范與方法
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上傳用戶:MATAIYES
資源簡介:PCB設計開關電源的PCB設計規范?,?,,
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上傳用戶:wxhwjf
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上傳用戶:奇奇奔奔
資源簡介:PCB設計規范.rar
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上傳用戶:569342831
資源簡介:福特的PCB設計規范,寫的很詳細,不錯
上傳時間: 2016-01-24
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資源簡介:華為內部的PCB設計規范,可以讓新手迅速了解PCB的設計規范
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資源簡介:某公司的內部PCB設計規范,PDF文件,LAYOUT的朋友有興趣可以
上傳時間: 2014-09-10
上傳用戶:hphh
資源簡介:大眾電腦有限公司的PCB設計規范,LAYOUT人員可以做參考
上傳時間: 2016-04-08
上傳用戶:ayfeixiao
資源簡介:PCB設計規范.pdf,設計PCB板技術人員必須了解的知識。
上傳時間: 2014-01-16
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資源簡介:華為 PCB 設計規范,號稱內部教材
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上傳用戶:wys0120
資源簡介:華為PCB設計規范,詳細介紹了電路板EMI,EMC
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上傳用戶:hasan2015
資源簡介:PCB系列資料.PCB設計規范,標準等資料
上傳時間: 2014-01-24
上傳用戶:xlcky
資源簡介:本文介紹華維內部PCB設計規范. 對搞好PCB設記人員是有用的`.
上傳時間: 2016-11-24
上傳用戶:hfmm633
資源簡介:華碩電腦PCB設計規范,內部資料, PCB Layout Rule Rev1.70, 規範內容如附件所示, 其中分為: (1) ”PCB LAYOUT 基本規範”:為R&D Layout時必須遵守的事項, 否則SMT,DIP,裁板時無法生產. (2) “錫偷LAYOUT RULE建議規範”: 加適合的錫偷可降低短路及錫球. ...
上傳時間: 2013-12-16
上傳用戶:奇奇奔奔
資源簡介:內容有:0歐姆電阻作用,LC,RC濾波電路設計,PCB銅箔厚度、線寬和電流表,Total_etch_path_manhattan,電學計算公式,華碩內部的PCB設計規范,大家可以看一下
上傳時間: 2017-04-14
上傳用戶:星仔
資源簡介:華為印制電路板(PCB)設計規范.pdf,很好的參考資料,值得下啊
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資源簡介:pci-E接口設計是現在系統設計的熱點,本文檔是在xilinx芯片中集成pcie接口控制器的好資料
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資源簡介:PCB設計規范,比較詳細全面,值得大家學習
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上傳用戶:Vent