STM32 L1系列 MCU 集成庫 原理圖庫 PCB封裝庫文件CSV text has been written to file : STM32 L1.csvLibrary Component Count : 27Name Description----------------------------------------------------------------------------------------------------STM32L151C8T6 STM32L ARM-based EnergyLite 32-bit MCU, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM32L151C8U6 STM32L ARM-based EnergyLite 32-bit MCU, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM32L151CBT6 STM32L ARM-based EnergyLite 32-bit MCU, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM32L151CBU6 STM32L ARM-based EnergyLite 32-bit MCU, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM32L151R8H6 STM32L ARM-based EnergyLite 32-bit MCU, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 64-pin TFBGA, TraySTM32L151R8T6 STM32L ARM-based EnergyLite 32-bit MCU, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 64-pin LQFP, TraySTM32L151RBH6 STM32L ARM-based EnergyLite 32-bit MCU, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 64-pin TFBGA, TraySTM32L151RBT6 STM32L ARM-based EnergyLite 32-bit MCU, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 64-pin LQFP, TraySTM32L151V8H6 STM32L ARM-based EnergyLite 32-bit MCU, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 100-pin UFBGA, TraySTM32L151V8T6 STM32L ARM-based EnergyLite 32-bit MCU, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 100-pin LQFP, TraySTM32L151VBH6 STM32L ARM-based EnergyLite 32-bit MCU, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 100-pin UFBGA, TraySTM32L151VBT6 STM32L ARM-based EnergyLite 32-bit MCU, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 100-pin LQFP, TraySTM32L152C8T6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM32L152C8U6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM32L152CBT6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM32L152CBU6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM32L152R8H6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 64-pin TFBGA, TraySTM32L152R8T6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 64-pin LQFP, TraySTM32L152RBH6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 64-pin TFBGA, TraySTM32L152RBT6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 64-pin LQFP, TraySTM32L152V8H6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 100-pin UFBGA, TraySTM32L152V8T6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 64 kB Flash, 10 kB Internal RAM, -40 to +85癈 Temperature, 100-pin LQFP, TraySTM32L152VBH6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 100-pin UFBGA, TraySTM32L152VBH6D STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, 1.65 to 3.6VDD, -40 to +85癈 Temperature, 100-pin UFBGA, TraySTM32L152VBT6 STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 100-pin LQFP, TraySTM32L152VBT6TR STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 100-pin LQFP, Tape and ReelSTM32L152_DB STM32L ARM-based EnergyLite 32-bit MCU, LCD, 128 kB Flash, 16 kB Internal RAM, -40 to +85癈 Temperature, 100-pin LQFP, Tape and Reel
上傳時間： 2022-04-30
上傳用戶：trh505
STM32 F0系列 MCU 集成庫 原理圖庫 PCB封裝庫文件CSV text has been written to file : STM32 F0.csvLibrary Component Count : 17Name Description----------------------------------------------------------------------------------------------------STM32F050C4T6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F050C6T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F050C6T6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F050K4U6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F050K6U6A ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051C4T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F051C6T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F051C8T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 39 High Current I/Os, -40 to +85癈, 48-Pin LQFP, TraySTM32F051K4U6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051K6U6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051K8U6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 27 High Current I/Os, -40 to +85癈, 32-Pin UFQFPN, TraySTM32F051R4T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, TraySTM32F051R4T6TR ARM Cortex-M0 32-bit RISC core (48 MHz max), 16kB Flash, 4 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, Tape and ReelSTM32F051R6T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 32kB Flash, 4 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, TraySTM32F051R8T6 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 55 High Current I/Os, -40 to +85癈, 64-Pin LQFP, TraySTM32F051R8T7 ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 55 High Current I/Os, -40 to +105癈, 64-Pin LQFP, TraySTM32F051R8TR ARM Cortex-M0 32-bit RISC core (48 MHz max), 64kB Flash, 8 kB Internal RAM, 55 High Current I/Os, -40 to +105癈, 64-Pin LQFP, Tape and Reel
上傳時間： 2022-04-30
上傳用戶：
STM8L全系列MCU AD ALTIUM 集成庫 原理圖庫 PCB封裝庫文件-79個芯片器件型號列表：Library Component Count : 79Name Description----------------------------------------------------------------------------------------------------STM8L101F2P3 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F2P6 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F2P6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, Tape and ReelSTM8L101F2U6A STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tube, COMP_REF availableSTM8L101F2U6ATR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and Reel, COMP_REF availableSTM8L101F2U6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and ReelSTM8L101F3P3 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +125癈 Temperature, 20-pin TSSOP, TubeSTM8L101F3P6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin TSSOP, TubeSTM8L101F3U6ATR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and Reel, COMP_REF availableSTM8L101F3U6TR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 20-pin UFQFPN, Tape and ReelSTM8L101G2U6 STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, TraySTM8L101G2U6A STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tray, COMP_REF availableSTM8L101G2U6TR STM8L ARM-based EnergyLite 8-bit MCU, 4 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tape and ReelSTM8L101G3U6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, TraySTM8L101G3U6A STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 28-pin UFQFPN, Tray, COMP_REF availableSTM8L101K3T3 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +125癈 Temperature, 32-pin LQFP, TraySTM8L101K3T6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin LQFP, TraySTM8L101K3U6 STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin UFQFPN, TraySTM8L101K3U6TR STM8L ARM-based EnergyLite 8-bit MCU, 8 kB Flash, 1.5 kB Internal RAM, -40 to +85癈 Temperature, 32-pin UFQFPN, Tape and ReelSTM8L151C4T3 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6BGT STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C4T6TR STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, Tape and ReelSTM8L151C4U6 STM8L ARM-based EnergyLite 8-bit MCU, 16 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM8L151C6T3 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C6T6 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C6U6 STM8L ARM-based EnergyLite 8-bit MCU, 32 kB Flash, 2 kB Internal RAM, -40 to +85癈 Temperature, 48-pin UFQFPN, TraySTM8L151C8 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, 48-pin LQFPSTM8L151C8T3 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, TraySTM8L151C8T3TR STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +125癈 Temperature, 48-pin LQFP, Tape and ReelSTM8L151C8T6 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 48-pin LQFP, TraySTM8L151C8T7 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +105癈 Temperature, 48-pin LQFP, TraySTM8L151C8U6 STM8L ARM-based EnergyLite 8-bit MCU, 64 kB Flash, 4 kB Internal RAM, -40 to +85癈
上傳時間： 2022-05-02
上傳用戶：bluedrops
Compact PCI（Compact Peripheral Component Interconnect）簡稱CPCI，中文又稱緊湊型PCI，是國際工業(yè)計算機(jī)制造者聯(lián)合會（PCI Industrial Computer Manufacturer's Group，簡稱PICMG）于1994提出來的一種總線接口標(biāo)準(zhǔn)。是以PCI電氣規(guī)范為標(biāo)準(zhǔn)的高性能工業(yè)用總線。為了將PCI SIG的PCI總線規(guī)范用在工業(yè)控制計算機(jī)系統(tǒng)，1995年11月PCI工業(yè)計算機(jī)制造者聯(lián)合會（PICMG）頒布了CPCI規(guī)范1.0版，以后相繼推出了PCI-PCI Bridge規(guī)范、Computer Telephony TDM規(guī)范和User-defined I/O pin assignment規(guī)范。
標(biāo)簽： cpci
上傳時間： 2022-05-20
上傳用戶：
美國PIN公司的RM3100芯片的驅(qū)動程序，有IIC和SPI的。
上傳時間： 2022-06-01
上傳用戶：shjgzh
摘要：隨著客戶要求手機(jī)攝像頭像素越來越高，同時要求高的傳輸速度，傳統(tǒng)的并口傳輸越來越受到挑戰(zhàn)。提高并口傳輸?shù)妮敵鰰r鐘是一個辦法，但會導(dǎo)致系統(tǒng)的EMC設(shè)計變得越來困難；增加傳輸線手機(jī)攝像頭MIPI技術(shù)介紹隨著客戶要求手機(jī)攝像頭像素越來越高，同時要求高的傳輸速度，傳統(tǒng)的并口傳輸越來越受到挑戰(zhàn)。提高并口傳輸?shù)妮敵鰰r鐘是一個辦法，但會導(dǎo)致系統(tǒng)的EMC設(shè)計變得越來困難；增加傳輸線的位數(shù)是，但是這又不符合小型化的趨勢。采用MIPI接口的模組，相較于并口具有速度快，傳輸數(shù)據(jù)量大，功耗低，抗干擾好的優(yōu)點(diǎn)，越來越受到客戶的青睞，并在迅速增長。例如一款同時具備MIPI和并口傳輸?shù)?M的模組，8位并口傳輸時，需要至少11根的傳輸線，高達(dá)96M的輸出時鐘，才能達(dá)到12FPS的全像素輸出；而采用MIPI接口僅需要2個通道6根傳輸線就可以達(dá)到在全像素下12FPS的幀率，且消耗電流會比并口傳輸?shù)痛蟾?0MA。由于MIPI是采用差分信號傳輸?shù)?，所以在設(shè)計上需要按照差分設(shè)計的一般規(guī)則進(jìn)行嚴(yán)格的設(shè)計，關(guān)鍵是需要實現(xiàn)差分阻抗的匹配，MIPI協(xié)議規(guī)定傳輸線差分阻抗值為80-125歐姆。上圖是個典型的理想差分設(shè)計狀態(tài)，為了保證差分阻抗，線寬和線距應(yīng)該根據(jù)軟件仿真進(jìn)行仔細(xì)選擇；為了發(fā)揮差分線的優(yōu)勢，差分線對內(nèi)部應(yīng)該緊密耦合，走線的形狀需要對稱，甚至過孔的位置都需要對稱擺放；差分線需要等長，以免傳輸延遲造成誤碼：另外需要注意一點(diǎn)，為了實現(xiàn)緊密的耦合，差分對中間不要走地線，PIN的定義上也最好避免把接地焊盤放置在差分對之間（指的是物理上2個相鄰的差分線）。
上傳時間： 2022-06-02
上傳用戶：
高通藍(lán)牙芯片qcc5127詳細(xì)規(guī)格書datasheet.pdf英文版，共97頁 詳細(xì)說明:1 Package information(pin allocations, pios terminal functions)2 Bluetooth subsystem 3 Cystal oscillator4 System powerstates (Idel,Active,Sleep, Off)5 Host Interface subsystem6 Applications subsystem ( QSPI Flash controller)7 Audio subsystem(Dual core Kalimba, ROM, RAM and caches, Data, engine)8 Audio interfaces ( Analog, Digital, Simultaneous audio routing)9 Peripheral interfaces (PIOs, LED, USB, SPI, UART)10 Boot manager11 System manager12 example application schematic13 Electrical characteristics14 Audio performance15 Bluetooth performance16 Power consumption
上傳時間： 2022-06-12
上傳用戶：
隨著現(xiàn)代光電子技術(shù)的迅速發(fā)展，各類光電轉(zhuǎn)換器件的不斷出現(xiàn)，光電檢測技術(shù)的應(yīng)用領(lǐng)域越來越廣泛，尤其是微弱光信號檢測技術(shù)的應(yīng)用發(fā)展。微弱光信號檢測中，常常由于信號動態(tài)范圍寬、背景噪聲大給信號檢測帶來較大的困難。本文根據(jù)微弱光信號檢測技術(shù)原理，設(shè)計了一種基于單片機(jī)的微弱光信號檢測系統(tǒng)。首先，本文探討了微弱光信號檢測技術(shù)的研究背景和國內(nèi)外研究現(xiàn)狀，對比了在微弱光信號檢測中常用的幾種方法。其次，對于微弱光信號檢測系統(tǒng)的放大電路模塊、電路控制模塊、電源電路、信號采集與傳輸模塊進(jìn)行了詳細(xì)的介紹和討論。其中，重點(diǎn)分析了放大電路部分，利用對數(shù)放大器的信號壓縮功能，結(jié)合積分放大器原理實現(xiàn)寬動態(tài)、大噪聲信號的壓縮和變換，使信號平穩(wěn)變換輸出，有效的被提取出來。對于系統(tǒng)的軟件部分采用單片機(jī)C語言編寫程序。然后，利用兩種光電二極管（PN型和PIN型）對微弱光信號檢測系統(tǒng)的入射光功率特性和入射光頻率特性進(jìn)行了討論和分析，并測量了實際的發(fā)光二極管的光譜。最后，對系統(tǒng)電路測量結(jié)果和輸出特性進(jìn)行了總結(jié)，并提出了該課題下一步研究工作。微弱光信號檢測系統(tǒng)電路的測量結(jié)果表明，該系統(tǒng)在微弱光信號檢測中達(dá)到較理想的效果。系統(tǒng)電路成本較低、速度較快、操作靈活，可以用于多種場合下的微弱信號的檢測。關(guān)鍵字：微弱光檢測，對數(shù)放大器，數(shù)據(jù)采集，光譜測量
標(biāo)簽： 微弱光信號檢測系統(tǒng)
上傳時間： 2022-06-18
上傳用戶：默默
PCB電路如微帶電路有較為顯著的介質(zhì)和輻射損耗，而傳統(tǒng)金屬波導(dǎo)雖然損耗低、信號干擾小，但其結(jié)構(gòu)很難做到小型化和集成。因此這兩種結(jié)構(gòu)不適用于要求低功耗且空間尺寸受限的移動終端。采用基片集成波導(dǎo)（SIW）可同時降低損耗和增加可集成性，其兼?zhèn)淞私饘俨▽?dǎo)和平面電路的優(yōu)良屬性，是未來5G毫米波終端應(yīng)用場景最佳的選項之一。本文的主要內(nèi)容包括：對SIw、波柬掃描陣、縫隙天線陣和Butler知陣多波束饋電網(wǎng)絡(luò)等基本原理進(jìn)行了簡要的回顧。此四方面的知識是本文所有設(shè)計的理論支撐。系統(tǒng)梳理了siw.縫隙天線陣的設(shè)計步驟和Butler矩陣饋電網(wǎng)絡(luò)的分析方法。提出了將4 x4 Butler矩陣多波束饋電網(wǎng)絡(luò)用于木來5G終端天線的設(shè)計以實現(xiàn)多波束寬角度高增益信號覆蓋、本文選擇采用了多被束方案，并結(jié)合了sG移動終端設(shè)計了適用于5G終端的4x4 Buter矩陣多波束饋電網(wǎng)絡(luò)和縫隙天線陣，加工測試表明多波束方案基本可滿足未來5G終端天線的要求。在傳統(tǒng)4x4 Butler的基礎(chǔ)上，提出和設(shè)計了一款改進(jìn)型的4x4 SIW Butler矩陣。從理論上驗證了方案的可行性且推導(dǎo)了各個器件須滿足的條件。新設(shè)計的Butler矩陣其核心是將移相器歸入到3dB定向耦合器的設(shè)計中。仿真和測試結(jié)果表明，改進(jìn)型的4x4 SIW Butler矩陣不僅擁有更好的輸出幅相平坦度還具有比傳統(tǒng)4x4 SIW Butler矩陣更高的設(shè)計靈活性。設(shè)計了一款3x3 SIw Butler矩陣。首先給出了該款矩陣的設(shè)計思路來源，然后從原理上驗證了此矩陣設(shè)計的可行性和詳細(xì)地推導(dǎo)出了3x3 Butler短陣的結(jié)構(gòu)和器件參數(shù)。仿真和結(jié)果表明，該型Butler矩陣比4×4 SIW Butler矩陣尺寸更小、結(jié)構(gòu)更簡單，但具有和4×4 SIW Buter矩陣相當(dāng)?shù)脑鲆嬷岛筒ㄊ采w范圍。
上傳時間： 2022-06-20
上傳用戶：
SPI協(xié)議及工作原理分析一、概述.SPI，Serial Perripheral Interface，串行外圍設(shè)備接口，是Motorola公司推出的一種同步串行接口技術(shù).SPI總線在物理上是通過接在外圍設(shè)備微控制器（PICmicro）上面的微處理控制單元（MCU）上叫作同步串行端口（Synchronous Serial Port）的模塊（Module）來實現(xiàn)的，它允許MCU以全雙工的同步串行方式與各種外圍設(shè)備進(jìn)行高速數(shù)據(jù)通信SPI主要應(yīng)用在EEPROM，F(xiàn)lash，實時時鐘（RTC），數(shù)模轉(zhuǎn)換器（ADC），數(shù)字信號處理器（DSP）以及數(shù)字信號解碼器之間它在芯片中只占用四根管腳（Pin）用來控制以及數(shù)據(jù)傳輸，節(jié)約了芯片的pin 數(shù)目，同時為PCB在布局上節(jié)省了空間.正是出于這種簡單易用的特性，現(xiàn)在越來越多的芯片上都集成了SPl技術(shù)。
標(biāo)簽： spi協(xié)議
上傳時間： 2022-06-24
上傳用戶：jiabin
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