現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展,電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì),但系統(tǒng)的電壓卻不斷在減小,所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來(lái)了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見(jiàn)設(shè)計(jì)中可能出現(xiàn)的各種問(wèn)題,并及時(shí)給出合理的解決方案,對(duì)于高速的數(shù)字電路來(lái)說(shuō),最令人頭大的莫過(guò)于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過(guò)較長(zhǎng)的一段傳輸線,還能完整地被接收,并保證良好的電磁兼容性,這就是目前頗受關(guān)注的信號(hào)完整性(SI)問(wèn)題。本章就是圍繞信號(hào)完整性的問(wèn)題,讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí),并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來(lái)...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過(guò)孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽: 信號(hào)完整性
上傳時(shí)間: 2013-11-01
上傳用戶(hù):xitai
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠0弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽: PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間: 2013-11-07
上傳用戶(hù):aa7821634
針對(duì)電子系統(tǒng)容易出現(xiàn)的熱失效問(wèn)題,論述在電子系統(tǒng)的熱管理設(shè)計(jì)與驗(yàn)證中,對(duì)半導(dǎo)體器件結(jié)溫的估算和測(cè)量方法。通過(guò)測(cè)量半導(dǎo)體器件內(nèi)部二極管參數(shù),來(lái)繪制二極管正向壓降與其溫度關(guān)系曲線,進(jìn)而求解出器件的結(jié)溫估算值,以指導(dǎo)熱管理設(shè)計(jì);采用熱分布測(cè)量和極值測(cè)量來(lái)計(jì)算器件的實(shí)際結(jié)溫,對(duì)熱管理設(shè)計(jì)進(jìn)行評(píng)估、驗(yàn)證。使用所述估算和測(cè)量方法,可到達(dá)±5%精確度的半導(dǎo)體結(jié)溫測(cè)算,能夠有效評(píng)估器件在特定電子系統(tǒng)中的熱可靠性,為實(shí)現(xiàn)可靠熱管理提供可信的數(shù)據(jù)分析基礎(chǔ)。
標(biāo)簽: 電子系統(tǒng) 熱管理 測(cè)量 結(jié)溫
上傳時(shí)間: 2013-11-10
上傳用戶(hù):jjq719719
針對(duì)嵌入式軟件的特點(diǎn)及其對(duì)調(diào)試技術(shù)的要求,在比較常用的一些動(dòng)態(tài)調(diào)試方法基礎(chǔ)上,提出了一種在線調(diào)試技術(shù)。在不影響系統(tǒng)運(yùn)行環(huán)境和實(shí)時(shí)性要求的前提下,通過(guò)將數(shù)據(jù)臨時(shí)保存在數(shù)組中,自動(dòng)生成文件或在外部觸發(fā)事件下生成文件的方式,實(shí)現(xiàn)對(duì)變量變化過(guò)程的動(dòng)態(tài)跟蹤,并給出了具體設(shè)計(jì)流程圖。最后結(jié)合工程應(yīng)用,通過(guò)對(duì)一類(lèi)嵌套式數(shù)據(jù)丟包現(xiàn)象的排查過(guò)程,驗(yàn)證了本方法的有效性和實(shí)際應(yīng)用價(jià)值。
標(biāo)簽: 在線調(diào)試 中的應(yīng)用 嵌入式 系統(tǒng)軟件
上傳時(shí)間: 2013-11-01
上傳用戶(hù):mnacyf
【摘 要】目的探討嗅球成鞘細(xì)胞(OECs)在坐骨神經(jīng)損傷后促進(jìn)神經(jīng)功能恢復(fù)中的作用。方法SD大鼠30只隨機(jī)分成對(duì)照生理鹽水(SAL)組和實(shí)驗(yàn)(OECs)組,采用硅膠管套接大鼠切斷的坐骨神經(jīng),硅膠管內(nèi)對(duì)照組給予SAL,實(shí)驗(yàn)組給予培養(yǎng)成活的新生大鼠OECs懸液,分別于術(shù)后30或90天,應(yīng)用電生理檢測(cè)、HRP逆行示蹤法及軸突圖像分析檢測(cè)損傷的神經(jīng)在電傳導(dǎo)軸漿運(yùn)輸、髓鞘再生等方面的恢復(fù)情況。 結(jié)果 術(shù)后30和90天,OECs組與SAL組比較:①OECs組損傷側(cè)下肢復(fù)合肌肉動(dòng)作電位(CMAP)的潛伏期(LAT)分別縮短了0160ms和0156ms;神經(jīng)傳導(dǎo)速度分別加快了6.42mös和5.36mös;波幅分別增加了3.92mv和5.84mv;②OECs組損傷側(cè)脊髓前角HRP陽(yáng)性細(xì)胞率分別增加了11.63%和25.01%;③OECs組坐骨神經(jīng)纖維數(shù)目分別增加了1047個(gè)ömm2和1422個(gè)ömm2;神經(jīng)髓鞘厚度分別增加了0.43Lm和0.63Lm。 結(jié)論 嗅球成鞘細(xì)胞對(duì)周?chē)窠?jīng)損傷后的神經(jīng)功能恢復(fù)有積極的促進(jìn)作用。【關(guān)鍵詞】 周?chē)窠?jīng) 損傷 嗅球成鞘細(xì)胞 功能恢復(fù)
標(biāo)簽: 中的作用
上傳時(shí)間: 2013-11-07
上傳用戶(hù):ifree2016
電容器及介質(zhì)種類(lèi): ※高頻類(lèi): 此類(lèi)介質(zhì)材料的電容器為Ⅰ類(lèi)電容器,包括通用型高頻COG、COH電容器和溫度補(bǔ)償型高頻HG、LG、PH、RH、SH、TH、UJ、SL電容器。其中COG、COH電容器電性能最穩(wěn)定,幾乎不隨溫度、電壓和時(shí)間的變化而變化,適用于低損耗,穩(wěn)定性要求高的高頻電路,HG、LG、PH、RH、SH、TH、UJ、SL電容器容量隨溫度變化而相應(yīng)變化,適用于低損耗、溫度補(bǔ)償型電路中。 ※ X7R、X5R:此類(lèi)介質(zhì)材料的電容器為Ⅱ類(lèi)電容器,具有較高的介電常數(shù),容量比Ⅰ類(lèi)電容器高,具有較穩(wěn)定的溫度特性,適用于容量范圍廣,穩(wěn)定性要求不高的電路中,如隔直、耦合、旁路、鑒頻等電路中。 ※Y5V:此類(lèi)介質(zhì)材料的電容器為Ⅱ類(lèi)電容器,是所有電容器中介電常數(shù)最大的電容器,但其容量穩(wěn)定性較差,對(duì)溫度、電壓等條件較敏感,適用于要求大容量,溫度變化不大的電路中。 ※Z5U:此類(lèi)介質(zhì)材料的電容器為Ⅱ類(lèi)電容器,其溫度特性介于X7R和Y5V之間,容量穩(wěn)定性較差,對(duì)溫度、電壓等條件較敏感,適用于要求大容量,使用溫度范圍接近于室溫的旁路,耦合等,低直流偏壓的電路中。
標(biāo)簽: 風(fēng)華 產(chǎn)品承認(rèn)書(shū)
上傳時(shí)間: 2013-11-05
上傳用戶(hù):后時(shí)代明明
基本的編輯工具(GENERAL EDITING FACILITIES) 對(duì)象放置(Object Placement) ISIS支持多種類(lèi)型的對(duì)象,每一類(lèi)型對(duì)象的具體作用和功能將在下一章給出。雖然類(lèi)型不同,但放置對(duì)象的基本步驟都是一樣的。 放置對(duì)象的步驟如下(To place an object:) 1.根據(jù)對(duì)象的類(lèi)別在工具箱選擇相應(yīng)模式的圖標(biāo)(mode icon)。 2. Select the sub-mode icon for the specific type of object. 2、根據(jù)對(duì)象的具體類(lèi)型選擇子模式圖標(biāo)(sub-mode icon)。 3、如果對(duì)象類(lèi)型是元件、端點(diǎn)、管腳、圖形、符號(hào)或標(biāo)記,從選擇器里(selector)選擇你想要的對(duì)象的名字。對(duì)于元件、端點(diǎn)、管腳和符號(hào),可能首先需要從庫(kù)中調(diào)出。 4、如果對(duì)象是有方向的,將會(huì)在預(yù)覽窗口顯示出來(lái),你可以通過(guò)點(diǎn)擊旋轉(zhuǎn)和鏡象圖標(biāo)來(lái)調(diào)整對(duì)象的朝向。 5、最后,指向編輯窗口并點(diǎn)擊鼠標(biāo)左鍵放置對(duì)象。對(duì)于不同的對(duì)象,確切的步驟可能略有不同,但你會(huì)發(fā)現(xiàn)和其它的圖形編輯軟件是類(lèi)似的,而且很直觀。 選中對(duì)象(Tagging an Object) 用鼠標(biāo)指向?qū)ο蟛Ⅻc(diǎn)擊右鍵可以選中該對(duì)象。該操作選中對(duì)象并使其高亮顯示,然后可以進(jìn)行編輯。
上傳時(shí)間: 2013-11-09
上傳用戶(hù):2525775
該類(lèi)有以下特點(diǎn): 1.支持字符串中含有各種常用函數(shù),如"7.5+sin(6*ln(8))/exp(5)" 2.具有很好的糾錯(cuò)能力,能檢查出表達(dá)式中括號(hào)是否配對(duì)、庫(kù)函數(shù)是否正確 3.運(yùn)算過(guò)程中能檢查并判斷出各種異常,如除數(shù)為0、開(kāi)方函數(shù)sqrt(x)中x<0,反余弦函數(shù)acos(x)中的x<-1或x>1等 4.支持積分、求方程,算術(shù)表達(dá)式中可含有x,計(jì)算時(shí)將用類(lèi)中的成員變量xx代替
上傳時(shí)間: 2015-01-07
上傳用戶(hù):410805624
該類(lèi)有以下特點(diǎn): 1.支持字符串中含有各種常用函數(shù),如"7.5+sin(6*ln(8))/exp(5)" 2.具有很好的糾錯(cuò)能力,能檢查出表達(dá)式中括號(hào)是否配對(duì)、庫(kù)函數(shù)是否正確 3.運(yùn)算過(guò)程中能檢查并判斷出各種異常,如除數(shù)為0、開(kāi)方函數(shù)sqrt(x)中x<0,反余弦函數(shù)acos(x)中的x<-1或x>1等 4.支持積分、求方程,算術(shù)表達(dá)式中可含有x,計(jì)算時(shí)將用類(lèi)中的成員變量xx代替
上傳時(shí)間: 2015-01-11
上傳用戶(hù):aix008
文件系統(tǒng)管理 在內(nèi)存中為文件開(kāi)辟存儲(chǔ)空間 可以創(chuàng)建文件和文件夾 (至少有兩級(jí)目錄 :模擬DOS文件系統(tǒng)的操作 可以存儲(chǔ)文件的內(nèi)容 可以查看刪除和修改文件(15 2,系統(tǒng)設(shè)計(jì)功能:根據(jù)題目要求設(shè)計(jì)程序功能 考核內(nèi)容:( 1,功能設(shè)計(jì)方面:功能設(shè)計(jì)是否全面,有無(wú)遺漏 2,完成功能設(shè)計(jì)算法方面:算法是否有效,算法的難易程度 3,運(yùn)算演示方面:設(shè)計(jì)程序能否運(yùn)行,運(yùn)行時(shí)是否每一種情況都考慮 4,程序設(shè)計(jì)報(bào)告內(nèi)容:程序功能,程序模塊結(jié)構(gòu),流程圖,源程序清單 5,教師質(zhì)疑
標(biāo)簽: DOS 文件系統(tǒng) 15 內(nèi)存
上傳時(shí)間: 2014-01-07
上傳用戶(hù):Amygdala
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