高通(Qualcomm)藍(lán)牙芯片QCC5151_硬件設(shè)計詳細(xì)指導(dǎo)書（官方內(nèi)部培訓(xùn)手冊）共52頁其內(nèi)容是針對硬件設(shè)計、部分重要元器件選擇(ESD，F(xiàn)ilter）及走線注意事項的詳細(xì)說明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 2.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天線 走線的注意事項)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 QSPIinterface 8 USB interfaces 8.1 USB device port8.1.1 USB connections8.1.2 Layout notes8.1.3 USB charger detection
標(biāo)簽：
qualcomm
藍(lán)牙芯片
qcc5151
上傳時間：
2022-01-24
上傳用戶：XuVshu
