第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2013-11-07
上傳用戶：aa7821634
適用于S3C2410的最簡ADS1.2工程！ 工程中僅包括一個匯編代碼，生成的bin文件僅87字節。可以完成初始化并點亮一個LED燈，您可以這個工程為基礎開始2410開發板的熟悉過程。
上傳時間： 2015-05-16
上傳用戶：fhzm5658
dos下顯示漢字，利用int 15 的87 號功能將字庫裝載到1m以上內存。
上傳時間： 2015-05-20
上傳用戶：yimoney
This a set of notes I put together for my Computer Architecture class in 1990. Students had a project in which they had to model a microprocessor architecture of their choice. They used these notes to learn VHDL. The notes cover the VHDL-87 version of the language. Not all of the language is covered (about 95％). You may use this booklet for your own personal learning purposes. You may not use it for profit (eg, selling copies of it, using it in a course for which people pay, etc). If you want to make use of it beyond these conditions, contact me and we can come to some arrangement.
標簽： Architecture Computer Students together
上傳時間： 2014-01-15
上傳用戶：wxhwjf
modelsim_se_tutorThis is a set of notes I put together for my Computer Architecture class in 1990. Students had a project in which they had to model a microprocessor architecture of their choice. They used these notes to learn VHDL. The notes cover the VHDL-87 version of the language. Not all of the language is covered (about 95％).
標簽： modelsim_se_tutorThis Architecture Computer together
上傳時間： 2015-07-07
上傳用戶：xfbs821
This is a set of notes I put together for my Computer Architecture class in 1990. Students had a project in which they had to model a microprocessor architecture of their choice. They used these notes to learn VHDL. The notes cover the VHDL-87 version of the language. Not all of the language is covered (about 95％).
標簽： Architecture Computer Students together
上傳時間： 2013-12-26
上傳用戶：kelimu
邏輯分析儀 PC發送到單片機的命令共7個字節： 第一字節是觸發信號，每bit對應一路信號，1為高電平觸發，0為低電平觸發； 第二字節是觸發有效信號，每bit對應一路信號，1為忽略，0為有效； 第三、四字節是采樣時間，對應如下： 2us=0x0402，5us=0x0a02，10us=0x1402，10us=0x2802，50us=0x6402，100us=0xc802，200us=0x3203，500us=0x7d03，1ms=0xfa03，2ms=0x7d04，4ms=0xfa04，8ms=0x7d05，16ms=0xfa05； 第五、六字節是一樣的，為預觸發：8=0％，7=12.5％，6=25％，5=37.5％，4=50％，3=62.5％，2=75％，1=87.5％ 第七字節為模式，0=普通模式；1=外部時鐘，上升延；2=外部時鐘，下降延；3=外部觸發，上升延；4=外部觸發，下降延；5=靜態模式；6沒有查到，不知道是什么；7為測試模式的二進制信號；8為測試模式的AA、55；9為測試模式的清零。
上傳時間： 2013-12-12
上傳用戶：luke5347
CCISP考試指南與導讀 CISSP STUDY NOTES FROM CISSP PREP GUIDE 1 DOMAIN 1 – SECURITY MANAGEMENT PRACTICES 2 DOMAIN 2 – ACCESS CONTROL SYSTEMS 7 DOMAIN 3 – TELECOM AND NETWORK SECURITY 13 DOMAIN 4 – CRYPTOGRAPHY 34 DOMAIN 5 – SECURITY ARCHITECTURE AND MODELS 46 DOMAIN 6 – OPERATIONS SECURITY 56 DOMAIN 7 – APPLICATIONS AND SYSTEM DEVELOPMENT 63 DOMAIN 8 – BUSINESS CONTINUITY AND DISASTER RECOVERY PLANNING 70 DOMAIN 9 – LAW, INVESTIGATION AND ETHICS 78 DOMAIN 10 – PHYSICAL SECURITY 87
標簽： CISSP MANAGEMENT PRACTICES SECURITY
上傳時間： 2014-02-13
上傳用戶：sy_jiadeyi
硬件平臺：開發板創維特jx2410，gps模塊HOLUX GR-87，USB轉串口線一條。程序是在嵌入式linux操作系統下讀串口實現。
上傳時間： 2014-01-12
上傳用戶：liglechongchong
asp經典源碼，主要內容：樹型菜單 計數器 搜索 上傳 動態廣告條 訪問量統計 asp導航器 提交信息 分頁技術 在線投票 同學錄 多層目錄 留言本 通訊簿 5 網上書店 86 網上購物87 人事管理88 圖書管理 89 在線考試 0 聊天室
上傳時間： 2016-02-13
上傳用戶：古谷仁美
