Abstract: It is incredible how many programmable logic controls (PLCs) around us make our modern life possible and pleasant.Machines in our homes heat and cool our air and water, as well as preserve and cook our food. This tutorial explains the importanceof PLCs, and describes how to choose component parts using the parametric tools on the Maxim's website.A similar version of this article was published February 29, 2012 in John Day's Automotive Electronic News.
Abstract: A laser module designer can use a fixed resistor, mechanical pot, digital pot, or a digital-to-analogconverter (DAC) to control the laser driver's modulation and bias currents. The advantages of a programmablemethod (POT or DAC) are that the manufacturing process can be automated and digital control can be applied(e.g., to compensate for temperature). Using POTs can be a more simple approach than a DAC. There can be aslight cost advantage to using a POT, but this is usually not significant relative to other pieces of the design.Using a DAC can offer advantages, including improved linearity (translating to ease of software implementationand ability to hit the required accuracy), increased board density, a wider range of resolutions, a betteroptimization range, ease of use with a negative voltage laser driver, and unit-to-unit consistency
Abstract: IC switches and multiplexers are proliferating, thanks to near-continual progress in lowering the supply voltage,incorporating fault-protected inputs, clamping the output voltage, and reducing the switch resistances. The latest of these advancesis the inclusion of precision resistors to allow two-point calibration of gain and offset in precision data-acquisition systems.
Abstract: This tutorial discusses methods for digitally adjusting the output voltage of a DC-DC converter. The digital adjustmentmethods are with a digital-to-analog converter (DAC), a trim pot (digital potentiometer), and PWM output of a microprocessor.Each method is assessed and several DACs and digital potentiometers presented.
Abstract: This article discusses application circuits for Maxim force/sense digital-to-analog converters (DACs). Applications include:selectable fixed-gain DAC, programmable gain DAC, photodiode bias control, amperometric sensor control, digitally programmablecurrent source, Kelvin load sensing, temperature sensing, and high current DAC output. A brief description of the various DAC outputconfigurations is also given.
Abstract: Using a DAC and a microprocessor supervisor, the system safety can be improved in industrial controllers, programmablelogiccontrollers (PLC), and data-acquisition systems. The analog output is set to zero-scale (or pin-programmable midscale) when amicroprocessor failure, optocoupler failure, or undervoltage condition occurs. A simple application is shown on how to implement thisfunction.
Abstract: Transimpedance amplifiers (TIAs) are widely used to translate the current output of sensors like photodiode-to-voltagesignals, since several circuits and instruments can only accept voltage input. An operational amplifier with a feedback resistor fromoutput to the inverting input is the most straightforward implementation of such a TIA. However, even this simple TIA circuit requirescareful trade-offs among noise gain, offset voltage, bandwidth, and stability. Clearly stability in a TIA is essential for good, reliableperformance. This application note explains the empirical calculations for assessing stability and then shows how to fine-tune theselection of the feedback phase-compensation capacitor.
Construction Strategy of ESD Protection CircuitAbstract： The principles used to construct ESD protection on circuits and the basic conceptions of ESD protection design are presented.Key words：ESD protection/On circuit, ESD design window, ESD current path1 引言靜電放電（ESD，Electrostatic Discharge）給電子器件環境會帶來破壞性的后果。它是造成集成電路失效的主要原因之一。隨著集成電路工藝不斷發展，互補金屬氧化物半導體（CMOS，Complementary Metal-Oxide Semiconductor）的特征尺寸不斷縮小，金屬氧化物半導體(MOS, Metal-Oxide Semiconductor)的柵氧厚度越來越薄，MOS 管能承受的電流和電壓也越來越小，因此要進一步優化電路的抗ESD 性能，需要從全芯片ESD 保護結構的設計來進行考慮。
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
Abstract: This application note explains how to layout the MAX20021/MAX20022 automotive quad powermanagementICs (PMICs) to maximize performance and minimize emissions. Example images of a fourlayerlayout are provided.
