IEEE 802.11a-1999 (8802-11:1999/Amd 1:2000(E)), IEEE Standard for Information technology—Telecommunications and information exchange between systems—Local and metropolitan area networks—Specific requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications—Amendment 1: High-speed Physical Layer in the 5 GHz band
標(biāo)簽： IEEE 1999 Information Telecommuni
上傳時(shí)間： 2013-12-24
上傳用戶：hjshhyy
802.11b-1999/Cor1-2001, IEEE Standard for Information technology—Telecommunications and information exchange between systems—Local and metropolitan area networks—Specific requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications—Amendment 2: Higher-speed Physical Layer (PHY) extension in the 2.4 GHz band—Corrigendum1
標(biāo)簽： Telecommunications Information information technology
上傳時(shí)間： 2013-12-10
上傳用戶：gxf2016
IEEE 802.11d-2001, Amendment to IEEE 802.11-1999, (ISO/IEC 8802-11) Information technology--Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Specification for Operation in Additional Regulartory Domains
標(biāo)簽： 802.11 IEEE Information technology
上傳時(shí)間： 2014-01-21
上傳用戶：壞天使kk
IEEE 802.11e-2005, IEEE Standard for Information technology—Telecommunications and information exchange between systems—Local and metropolitan area networks—Specific requirements Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications: Amendment 8: Medium Access Control (MAC) Quality of Service Enhancements
標(biāo)簽： Telecommunications IEEE Information information
上傳時(shí)間： 2016-10-02
上傳用戶：rishian
IEEE 802.11g-2003 IEEE Standard for Information technology—Telecommunications and information exchange between systems—Local and metropolitan area networks—Specific requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications—Amendment 4: Further Higher-Speed Physical Layer Extension in the 2.4 GHz Band
標(biāo)簽： Telecommunications IEEE Information information
上傳時(shí)間： 2016-10-02
上傳用戶：cx111111
IEEE 802.11h-2003 IEEE Standard for Information technology—Telecommunications and Information Exchange Between Systems—LAN/MAN Specific Requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Spectrum and Transmit Power Management Extensions in the 5GHz band in Europe
標(biāo)簽： Information Telecommunications IEEE technology
上傳時(shí)間： 2016-10-02
上傳用戶：lnnn30
IEEE 802.11i-2004 Amendment to IEEE Std 802.11, 1999 Edition (Reaff 2003). IEEE Standard for Information technology--Telecommunications and information exchange between system--Local and metropolitan area networks?Specific requirements--Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications--Amendment 6: Medium Access Control (MAC) Security Enhancements
標(biāo)簽： IEEE 802.11 Amendment Standard
上傳時(shí)間： 2013-12-21
上傳用戶：ywqaxiwang
IEEE 802.11j-2004 IEEE Standard for Information technology—Telecommunications and information exchange between systems--Local and metropolitan area networks—Specific requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications—Amendment 7: 4.9 GHz–5 GHz Operation in Japan
標(biāo)簽： Telecommunications IEEE Information information
上傳時(shí)間： 2014-01-17
上傳用戶：asasasas
Learn how to build a custom Linux® distribution to use in an embedded environment, in this case to drive a Technologic Systems TS-7800 single-board computer. In this tutorial, you learn about cross-compiling, the boot loader, file systems, the root file system, disk images, and the boot process, all with respect to the decisions you make as you re building the system and creating the distribution.
標(biāo)簽： distribution environment embedded custom
上傳時(shí)間： 2013-12-23
上傳用戶：stella2015
是英文 “ Surface mount technology ”的縮寫。即表面安裝技術(shù)，這是一種較傳統(tǒng)的安裝方式。其優(yōu)點(diǎn)是可靠性高，缺點(diǎn)是體積大，成本高，限制 LCM 的小型化。 是英文 “ Chip On Board ”的縮寫。即芯片被邦定(Bonding)在PCB上，由于IC制造商在LCD控制及相關(guān)芯片的生產(chǎn)上正在減小QFP（ SMT 的一種）封裝的產(chǎn)量，因此，在今后的產(chǎn)品中傳統(tǒng)的 SMT 方式將被逐步取代。
標(biāo)簽： technology Surface mount 英文
上傳時(shí)間： 2016-10-08
上傳用戶：nairui21
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