Advances in low power electronics now allow placementof battery-powered sensors and other devices in locationsfar from the power grid. Ideally, for true grid independence,the batteries should not need replacement, but instead berecharged using locally available renewable energy, suchas solar power. This Design Note shows how to producea COMPACT battery charger that operates from a small2-cell solar panel. A unique feature of this design is thatthe DC/DC converter uses power point control to extractmaximum power from the solar panel.
The LTC3546 is a dual output current mode buck regulatorwith fl exible output current partitioning. Beyondthe advantages normally associated with dual outputregulators (reduced size, cost, EMI and part count, withimproved effi ciency), the LTC3546’s outputs can bepartitioned for either 3A and 1A outputs, or two 2A outputs.This increases its application range and simplifi esmultiple supply rail designs. A confi gurable Burst Mode®clamp for each output sets the current transition levelbetween Burst Mode operation and forced continuousconduction mode to optimize effi ciency over the entireoutput range. An adjustable switching frequency up to4MHz and internal power MOSFET switches allow forsmall and COMPACT footprints.
Avalanche photodiodes (APDs) are widely utilized in laserbased fiberoptic systems to convert optical data intoelectrical form. The APD is usually packaged with a signalconditioning amplifier in a small module. An APD receivermodule and attendant circuitry appears in Figure 1. TheAPD module (figure right) contains the APD and a transimpedance(e.g., current-to-voltage) amplifier. An opticalport permits interfacing fiberoptic cable to the APD’sphotosensitive portion. The module’s COMPACT constructionfacilitates a direct, low loss connection between theAPD and the amplifier, necessary because of the extremelyhigh speed data rates involved
This ink marks LTC’s eighth circuit collection publication.1We are continually surprised, to the point of near mystification, by these circuit amalgams seemingly limitlessappeal. Reader requests ascend rapidly upon publication,remaining high for years, even decades. All LTC circuitcollections, despite diverse content, share this popularity,although just why remains an open question. Why isit? Perhaps the form; COMPACT, complete, succinct andinsular. Perhaps the freedom of selection without commitment,akin to window shopping.
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a COMPACT, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
Although Stellaris microcontrollers have generous internal SRAM capabilities, certain applicationsmay have data storage requirements that exceed the 8 KB limit of the Stellaris LM3S8xx seriesdevices. Since microcontrollers do not have an external parallel data-bus, serial memory optionsmust be considered. Until recently, the ubiquitous serial EEPROM/flash device was the only serialmemory solution. The major limitations of EEPROM and flash technology are slow write speed, slowerase times, and limited write/erase endurance.Recently, serial SRAM devices have become available as a solution for high-speed dataapplications. The N256S08xxHDA series of devices, from AMI Semiconductor, offer 32 K x 8 bits oflow-power data storage, a fast Serial Peripheral Interface (SPI) serial bus, and unlimited write cycles.The parts are available in 8-pin SOIC and COMPACT TSSOP packages.
winCE msdn講座 XP Embedded Now and the future
Windows XP Embedded Developmentand Deployment Model OverviewWindows XP Embedded Component ModelWindows XP Embedded Studio Tools
Microsoft WindowsXP Embedded Product Highlights
Componentized version of Windows XP Professional~ 12,000 components and updates as of Service Pack 2Flexible localizationSame binaries and API as Windows XP ProfessionalHotfixes and service packsEmbedded Enabling FeaturesRuns on standard PC hardwareSupports boot on hard drives, COMPACT flash, DiskOnChipand read-only mediaSupport for remote install and remote bootHeadless device and remote management supportIntegration with Microsoft management tools
MfcCDDB v1.11 A freeware MFC class to support access to CDDB servers Welcome to MfcCDDB, a collection of freeware MFC classes to support access to the COMPACT Disc DataBases on the Internet .
