c#數(shù)據(jù)庫(kù)開(kāi)發(fā)實(shí)例:有很多的實(shí)例，對(duì)學(xué)習(xí)非常的有意義！ 酒店管理系統(tǒng)源代碼 醫(yī)院信息管理系統(tǒng)源代碼 圖書(shū)館管理系統(tǒng)源代碼 財(cái)務(wù)管理系統(tǒng)源代碼 生產(chǎn)管理系統(tǒng)源代碼 人力資源管理實(shí)例程序源代碼 進(jìn)銷存管理實(shí)例程序源代碼 if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[采購(gòu)訂單_供貨商_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[采購(gòu)訂單] DROP Constraint 采購(gòu)訂單_供貨商_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[采購(gòu)訂單歷史_供貨商_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[采購(gòu)訂單歷史] DROP Constraint 采購(gòu)訂單歷史_供貨商_fk
標(biāo)簽： 數(shù)據(jù)庫(kù) 開(kāi)發(fā)實(shí)例
上傳時(shí)間： 2013-10-30
上傳用戶：392210346
if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[采購(gòu)訂單_供貨商_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[采購(gòu)訂單] DROP Constraint 采購(gòu)訂單_供貨商_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[采購(gòu)訂單歷史_供貨商_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[采購(gòu)訂單歷史] DROP Constraint 采購(gòu)訂單歷史_供貨商_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[采購(gòu)合同_供貨商_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[采購(gòu)合同] DROP Constraint 采購(gòu)合同_供貨商_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[進(jìn)貨單_供貨商_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[進(jìn)貨單] DROP Constraint 進(jìn)貨單_供貨商_fk
標(biāo)簽： 進(jìn)銷 實(shí)例程序 源代碼
上傳時(shí)間： 2013-11-15
上傳用戶：wkxiian
if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_工資發(fā)放歷史表_職員基本信息表]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[工資發(fā)放歷史表] DROP Constraint FK_工資發(fā)放歷史表_職員基本信息表 GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_月工資統(tǒng)計(jì)表_職員基本信息表]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[月工資統(tǒng)計(jì)表] DROP Constraint FK_月工資統(tǒng)計(jì)表_職員基本信息表 GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_職員懲罰表_職員基本信息表]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[職員懲罰表] DROP Constraint FK_職員懲罰表_職員基本信息表
上傳時(shí)間： 2014-11-17
上傳用戶：xinzhch
if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[mrp物料需求計(jì)算_物料編號(hào)_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[mrp物料需求計(jì)算] DROP Constraint mrp物料需求計(jì)算_物料編號(hào)_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[mrp物料需求計(jì)算結(jié)果_物料編號(hào)_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[mrp物料需求計(jì)算結(jié)果] DROP Constraint mrp物料需求計(jì)算結(jié)果_物料編號(hào)_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[mrp物料需求歷史_物料編號(hào)_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[mrp物料需求歷史] DROP Constraint mrp物料需求歷史_物料編號(hào)_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[物料清單_物料編號(hào)_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[物料清單] DROP Constraint 物料清單_物料編號(hào)_fk
標(biāo)簽： 生產(chǎn)管理 源代碼
上傳時(shí)間： 2013-11-23
上傳用戶：wcl168881111111
if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_分錄表_憑證表]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[分錄表] DROP Constraint FK_分錄表_憑證表 GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[本期匯總賬簿_科目代碼_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[本期匯總賬簿] DROP Constraint 本期匯總賬簿_科目代碼_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[本期明細(xì)賬簿_科目代碼_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[本期明細(xì)賬簿] DROP Constraint 本期明細(xì)賬簿_科目代碼_fk GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[分錄表_科目代碼_fk]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[分錄表] DROP Constraint 分錄表_科目代碼_fk GO
標(biāo)簽： 財(cái)務(wù)管理系統(tǒng) 源代碼
上傳時(shí)間： 2013-11-20
上傳用戶：清山綠水
if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[圖書(shū)丟失_圖書(shū)編號(hào)_fk]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[圖書(shū)丟失] DROP Constraint 圖書(shū)丟失_圖書(shū)編號(hào)_fk GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[FK_圖書(shū)罰款_圖書(shū)信息]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[圖書(shū)罰款] DROP Constraint FK_圖書(shū)罰款_圖書(shū)信息 GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[圖書(shū)歸還_圖書(shū)編號(hào)_fk]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[圖書(shū)歸還] DROP Constraint 圖書(shū)歸還_圖書(shū)編號(hào)_fk GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[圖書(shū)借閱_圖書(shū)編號(hào)_fk]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[圖書(shū)借閱] DROP Constraint 圖書(shū)借閱_圖書(shū)編號(hào)_fk GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[FK_圖書(shū)征訂_圖書(shū)信息]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[圖書(shū)征訂] DROP Constraint FK_圖書(shū)征訂_圖書(shū)信息 GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[圖書(shū)注銷_圖書(shū)編號(hào)_fk]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[圖書(shū)注銷] DROP Constraint 圖書(shū)注銷_圖書(shū)編號(hào)_fk
標(biāo)簽： 圖書(shū)館 管理系統(tǒng) 源代碼
上傳時(shí)間： 2014-05-04
上傳用戶：togetsomething
15.2 已經(jīng)加入了有關(guān)貫孔及銲點(diǎn)的Z軸延遲計(jì)算功能. 先開(kāi)啟 Setup - Constraints - Electrical Constraint sets 下的 DRC 選項(xiàng). 點(diǎn)選 Electrical Constraints dialog box 下 Options 頁(yè)面 勾選 Z-Axis delay欄.
上傳時(shí)間： 2013-11-12
上傳用戶：Late_Li
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2013-11-07
上傳用戶：aa7821634
ABAQUS is a general purpose finite element analysis program which is widely used to analyses mechanical, structure and civil engineering problems. Abaqus has some special feature for analysing fracture mechanics problems, and therefore it is a main tools for the FE-analysis in the Fracture Group at the Mechanical Engineering at Glasgow Universtity. The software which can transfer data from Abaqus into a Matlab readable environment has been developed as a part of a research program in Constraint Estimation in Fracture Mechanics. This research program was funded by a grant from the Defence Research Agency through Prof. J. Sumpter.
標(biāo)簽： analysis analyses general element
上傳時(shí)間： 2015-05-13
上傳用戶：xfbs821
This class implements the same API as the Java 1.3 java.util.TimerTask. * Note that a TimerTask can only be scheduled on one Timer at a time, but * that this implementation does not enforce that Constraint.
標(biāo)簽： TimerTask implements the class
上傳時(shí)間： 2015-06-10
上傳用戶：無(wú)聊來(lái)刷下
蟲(chóng)蟲(chóng)下載站版權(quán)所有 京ICP備2021023401號(hào)-1
