1.增加的設備支持:
Atmel AT91SAM9Rxx
Cirrus Logic CS7401xx-IQZ
Luminary Micro LM3S576x, LM3S5752, LM3S5747, LM3S573x, LM3S5662, LM3S5652, LM3S5632, LM3S3759, LM3S3749, and LM3S3739
NXP LPC32XX and LPC2460
STMicroelectronics STR912FAZ4X, STR912FAW4X, STR911FAW4X, STR911FAM4X, STR910FAW32, and STR910FAZ32
2.修改了NXP LPC23XX/24XX的頭文件庫
3.增加了ST-LINK II的調試支持
4.增加了對Cortex-M3 內核芯片的RTX Event Viewer 的支持
5.增加了MCBSTM32: STM32 FLASH OPTION BYTES PROGRAMMING
6.增加了ULINK2對Cortex-M3的SWV功能的調試
7.增強了使用GNU在MDK下調試M1,M3,ARM7,ARM9的調試功能( Using μVision with CodeSourcery GNU ARM Toolchain.)
8.增加了大量經典開發板例程
Boards目錄列表:
├─Embest 深圳市英蓓特公司開發板例程
│ ├─AT91EB40X-40008
│ ├─S3CEB2410
│ ├─ATEBSAM7S
│ ├─LPC22EB06-I
│ ├─LPCEB2000-A
│ ├─LPCEB2000-B
│ ├─LPCEB2000-S
│ ├─str710
│ ├─str711
│ ├─str730
│ ├─str750
│ ├─STR912
│ ├─STM32V100
│ ├─STM32R100
│ ├─ATEB9200
├─ADI ADI半導體的芯片例程
│ ├─ADuC702X
│ └─ADuC712x
├─Atmel Atmel半導體的芯片例程
│ ├─AT91RM9200-EK
│ ├─AT91SAM7A3-EK
│ ├─AT91SAM7S-EK
│ ├─AT91SAM7SE-EK
│ ├─AT91SAM7X-EK
│ ├─AT91SAM9260-EK
│ ├─AT91SAM9261-EK
│ ├─AT91SAM9263-EK
├─Keil Keil公司的開發板例程
│ ├─MCB2100
│ ├─MCB2103
│ ├─MCB2130
│ ├─MCB2140
│ ├─MCB2300
│ ├─MCB2400
│ ├─MCB2900
│ ├─MCBLM3S
│ ├─MCBSTM32
│ ├─MCBSTR7
│ ├─MCBSTR730
│ ├─MCBSTR750
│ └─MCBSTR9
├─Luminary Luminary半導體公司的芯片例程
│ ├─ek-lm3s1968
│ ├─ek-lm3s3748
│ ├─ek-lm3s3768
│ ├─dk-lm3s101
│ ├─dk-lm3s102
│ ├─dk-lm3s301
│ ├─dk-lm3s801
│ ├─dk-lm3s811
│ ├─dk-lm3s815
│ ├─dk-lm3s817
│ ├─dk-lm3s818
│ ├─dk-lm3s828
│ ├─ek-lm3s2965
│ ├─ek-lm3s6965
│ ├─ek-lm3s811
│ └─ek-lm3s8962
├─NXP NXP半導體公司的芯片例程
│ ├─LH79524
│ ├─LH7A404
│ └─SJA2510
├─OKI OKI半導體公司的芯片例程
│ ├─ML674000
│ ├─ML67Q4003
│ ├─ML67Q4051
│ ├─ML67Q4061
│ ├─ML67Q5003
│ └─ML69Q6203
├─Samsung Samsung半導體公司的芯片例程
│ ├─S3C2440
│ ├─S3C44001
│ └─S3F4A0K
├─ST ST半導體公司的芯片例程
│ ├─CQ-STARM2
│ ├─EK-STM32F
│ ├─STM32F10X_EVAL
│ ├─STR710
│ ├─STR730
│ ├─STR750
│ ├─STR910
│ └─STR9_DONGLE
├─TI TI半導體公司的芯片例程
│ ├─TMS470R1A256
│ └─TMS470R1B1M
├─Winbond Winbond半導體公司的芯片例程
│ └─W90P710
└─ ...
標簽:
realview
mdk
3.2
上傳時間:
2013-10-13
上傳用戶:zhangliming420
The NXP LPC314x combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, three channel10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted atconsumer, industrial, medical, and communication markets. To optimize system powerconsumption, the LPC314x have multiple power domains and a very flexible ClockGeneration Unit (CGU) that provides dynamic clock gating and scaling.
標簽:
314x
LPC
314
ARM
上傳時間:
2013-10-11
上傳用戶:yuchunhai1990
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
標簽:
315x
LPC
315
ARM
上傳時間:
2014-01-17
上傳用戶:Altman