針對運(yùn)行中火車測速運(yùn)用多普勒效應(yīng)采用DSP 設(shè)計(jì)雷達(dá)測速系統(tǒng)并闡述了其基本設(shè)計(jì)思想與工作原理給出系統(tǒng)硬件軟件設(shè)計(jì)結(jié)構(gòu)和原理圖改善了原有光電測速精度提高了系統(tǒng)工作穩(wěn)定性和可靠性經(jīng)實(shí)驗(yàn)證明DSP 采集板工作穩(wěn)定測速效果好關(guān)鍵詞DSP; 雷達(dá)測速; 多普勒效應(yīng)
On Board DSP-Based Radar Speed Measurement System TANG Wei, SUN Zhi-fang, CHEN Quan (Dept.of computer Science,Yangtze University,Jingzhou 434023,China)Abstract: This paper presents a DSP-based train speed measurement by using Doppler radar. The structure of the system is introduced.The hardware and software are also discussed.Key words: DSP; rader speed measurement; doppler principle
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
This application note shows how to achieve low-cost, efficient serial configuration for Spartan FPGA designs. The approachrecommended here takes advantage of unused resources in a design, thereby reducing the cost, part count, memory size,and board space associated with the serial configuration circuitry. As a result, neither processor nor PROM needs to be fullydedicated to performing Spartan configuration.In particular, information is provided on how the idle processing time of an on-board controller can be used to loadconfiguration data from an off-board source. As a result, it is possible to upgrade a Spartan design in the field by sending thebitstream over a network.
This application note covers the design considerations of a system using the performance
features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The
design focuses on high system throughput through the AXI Interconnect core with F
MAX
and
area optimizations in certain portions of the design.
The design uses five AXI video direct memory access (VDMA) engines to simultaneously move
10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p
format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video
test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary
video timing signals. Data read by each AXI VDMA is sent to a common on-screen display
(OSD) core capable of multiplexing or overlaying multiple video streams to a single output video
stream. The output of the OSD core drives the DVI video display interface on the board.
Performance monitor blocks are added to capture performance data. All 10 video streams
moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are
controlled by a MicroBlaze™ processor.
The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the
Xilinx® ML605 Rev D evaluation board
針對傳統(tǒng)集成電路（ASIC）功能固定、升級困難等缺點(diǎn)，利用FPGA實(shí)現(xiàn)了擴(kuò)頻通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核實(shí)現(xiàn)NCO模塊，在下變頻模塊調(diào)用了硬核乘法器并引入CIC濾波器進(jìn)行低通濾波，給出了DQPSK解調(diào)的原理和實(shí)現(xiàn)方法，推導(dǎo)出一種簡便的引入?仔/4固定相移的實(shí)現(xiàn)方法。采用模塊化的設(shè)計(jì)方法使用VHDL語言編寫出源程序，在Virtex-II Pro 開發(fā)板上成功實(shí)現(xiàn)了整個(gè)系統(tǒng)。測試結(jié)果表明該系統(tǒng)正確實(shí)現(xiàn)了STEL-2000A的核心功能。
Abstract:
To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.
In today’s world of modular networking and telecommunications design, it is becomingincreasingly difficult to keep alignment with the many different and often changing interfaces,both inter-board and intra-board. Each manufacturer has their own spin on the way in whichdevices are connected. To satisfy the needs of our customers, we must be able to support alltheir interface requirements. For us to be able to make products for many customers, we mustadopt a modular approach to the design. This modularity is the one issue that drives the majorproblem of shifting our bits from one modular interface to another.
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
