亚洲欧美第一页_禁久久精品乱码_粉嫩av一区二区三区免费野_久草精品视频

蟲蟲首頁| 資源下載| 資源專輯| 精品軟件
登錄| 注冊

您現在的位置是:蟲蟲下載站 > 資源下載 > 教程資料 > 《器件封裝用戶向導》賽靈思產品封裝資料

《器件封裝用戶向導》賽靈思產品封裝資料

  • 資源大?。?/b>5103 K
  • 上傳時間: 2013-10-22
  • 上傳用戶:SnowCat
  • 資源積分:2 下載積分
  • 標      簽: 封裝 器件 用戶 賽靈思

資 源 簡 介

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

相 關 資 源

主站蜘蛛池模板: 青神县| 浦北县| 海伦市| 鲁山县| 巧家县| 宜春市| 曲阜市| 黎平县| 精河县| 翼城县| 韶关市| 仪陇县| 安徽省| 韶关市| 榆社县| 正镶白旗| 花莲市| 萨迦县| 德清县| 永胜县| 周至县| 岚皋县| 龙胜| 洮南市| 潼南县| 大石桥市| 锡林浩特市| 蓬莱市| 和龙市| 深州市| 铜陵市| 德钦县| 临夏市| 台南市| 江都市| 寿宁县| 巴东县| 宁国市| 宁陵县| 大埔区| 临海市|