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For more than three decades, Micro Electro Mechanical Systems (MEMS) have
steadily transitioned out of research labs and into production forming a more than $10 billion
market [1]. MEMS devices such as accelerometers, pressure sensors and microphones, to name
a few, have seen immense utilization, particularly in the consumer electronics market, because
of their compact sizes and minute power consumptions. In addition, these devices benefit from
batch fabrication, which has Enabled year-over-year reductions in cost [2]. In recent years,
標(biāo)簽：
Frequency
Tunable
MEMS
上傳時(shí)間：
2020-06-06
上傳用戶：shancjb
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It has been said that the move from narrowband to broadband access is the second
revolution for the Internet — ‘broadband is more bandwidth than you can use’.
Once users have experienced broadband access there is no turning back. A whole
new world of applications and services becomes possible. No longer is it the ‘world-
wide wait’. The speed of response and visual quality Enabled by broadband finally
allows the Internet to reach its true potential.
標(biāo)簽：
Digital
Home
上傳時(shí)間：
2020-06-06
上傳用戶：shancjb
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Since the original publication of Manual 74 in 1991, and the preceding
“Guidelines for Transmission Line Structural Loading” in 1984, the
understanding of structural loadings on transmission line structures has
broadened signifi cantly. However, improvements in computational capa-
bility have Enabled the transmission line engineer to more easily deter-
mine structural loadings without properly understanding the parameters
that affect these loads. Many seasoned professionals have expressed
concern for the apparent lack of recent information on the topic of struc-
tural loadings as new engineers enter this industry. The Committee on
Electrical Transmission Structures is charged with the responsibility to
report, evaluate, and provide loading requirements of transmission struc-
tures. This task committee was therefore formed to update and revise the
1991 manual.
標(biāo)簽：
Transmission
Guidelines
Electrical
Line
for
上傳時(shí)間：
2020-06-07
上傳用戶：shancjb
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Commercial energy storage has moved from the margins to the mainstream as it
fosters flexibility in our smarter, increasingly integrated energy systems. The
energy density, availability, and relatively clean fossil profile of natural gas ensure
its critical role as a fuel for heating and electricity generation. As a transportation
fuel, natural gas continues to increase its market penetration; much of this has been
Enabled by emerging developments in storage technology.
標(biāo)簽：
Hydrogen
Methane
Storage
Energy
and
for
上傳時(shí)間：
2020-06-07
上傳用戶：shancjb
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adio Frequency Identification (RFID) is a rapidly developing automatic wireless data-collection
technology with a long history.The first multi-bit functional passive RFID systems,with a range of
several meters, appeared in the early 1970s, and continued to evolve through the 1980s. Recently,
RFID has experienced a tremendous growth,due to developments in integrated circuits and radios,
and due to increased interest from the retail industrial and government.
標(biāo)簽：
RFID-Enabled
Sensors
RFID
and
上傳時(shí)間：
2020-06-08
上傳用戶：shancjb
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Radio frequency identification (RFID) is gaining in popularity, especially
as we find ourselves in this communications age and headed towards a
ubiquitous computing world. Automatic identification systems become
an important aspect not just in today’s technology but also as part of our
daily life. We need RFID in our cars, transportation systems, access
points, and even simple transactions; we also acknowledge the need for
RFID in our logistics systems, healthcare, and tracking and locating
applications.
標(biāo)簽：
RFID-Enabled
Appications
Design
Sensor
and
上傳時(shí)間：
2020-06-08
上傳用戶：shancjb
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With more than two billion terminals in commercial operation world-wide, wire-
less and mobile technologies have Enabled a first wave of pervasive communication
systems and applications. Still, this is only the beginning as wireless technologies
such as RFID are currently contemplated with a deployment potential of tens of
billions of tags and a virtually unlimited application potential. A recent ITU report
depicts a scenario of “Internet of things” — a world in which billions of objects will
report their location, identity, and history over wireless connections.
標(biāo)簽：
Internet
Things
From
The
RFI
of
上傳時(shí)間：
2020-06-08
上傳用戶：shancjb
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The past decade has seen an explosion of machine learning research and appli-
cations; especially, deep learning methods have Enabled key advances in many
applicationdomains,suchas computervision,speechprocessing,andgameplaying.
However, the performance of many machine learning methods is very sensitive
to a plethora of design decisions, which constitutes a considerable barrier for
new users. This is particularly true in the booming field of deep learning, where
human engineers need to select the right neural architectures, training procedures,
regularization methods, and hyperparameters of all of these components in order to
make their networks do what they are supposed to do with sufficient performance.
This process has to be repeated for every application. Even experts are often left
with tedious episodes of trial and error until they identify a good set of choices for
a particular dataset.
標(biāo)簽：
Auto-Machine-Learning-Methods-Sys
tems-Challenges
上傳時(shí)間：
2020-06-10
上傳用戶：shancjb
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1. Scope ......................................................................................................................................................................... 12. DDR4 SDRAM Package Pinout and Addressing ....................................................................................................... 22.1 DDR4 SDRAM Row for X4,X8 and X16 ................................................................................................................22.2 DDR4 SDRAM Ball Pitch........................................................................................................................................22.3 DDR4 SDRAM Columns for X4,X8 and X16 ..........................................................................................................22.4 DDR4 SDRAM X4/8 Ballout using MO-207......................................................................................................... 22.5 DDR4 SDRAM X16 Ballout using MO-207.............................................................................................................32.6 Pinout Description ..................................................................................................................................................52.7 DDR4 SDRAM Addressing.....................................................................................................................................73. Functional Description ...............................................................................................................................................83.1 Simplified State Diagram ....................................................................................................................................83.2 Basic Functionality..................................................................................................................................................93.3 RESET and Initialization Procedure .....................................................................................................................103.3.1 Power-up Initialization Sequence .............................................................................................................103.3.2 Reset Initialization with Stable Power ......................................................................................................113.4 Register Definition ................................................................................................................................................123.4.1 Programming the mode registers .............................................................................................................123.5 Mode Register ......................................................................................................................................................134. DDR4 SDRAM Command Description and Operation ............................................................................................. 244.1 Command Truth Table ..........................................................................................................................................244.2 CKE Truth Table ...................................................................................................................................................254.3 Burst Length, Type and Order ..............................................................................................................................264.3.1 BL8 Burst order with CRC Enabled .........................................................................................................264.4 DLL-off Mode & DLL on/off Switching procedure ................................................................................................274.4.1 DLL on/off switching procedure ...............................................................................................................274.4.2 DLL “on” to DLL “off” Procedure ..............................................................................................................274.4.3 DLL “off” to DLL “on” Procedure ..............................................................................................................284.5 DLL-off Mode........................................................................................................................................................294.6 Input Clock Frequency Change ............................................................................................................................304.7 Write Leveling.......................................................................................................................................................314.7.1 DRAM setting for write leveling & DRAM termination function in that mode ............................................324.7.2 Procedure Description .............................................................................................................................334.7.3 Write Leveling Mode Exit .........................................................................................................................34
標(biāo)簽：
DDR4
上傳時(shí)間：
2022-01-09
上傳用戶：
-
高通藍(lán)牙芯片QCC5144 詳細(xì)規(guī)格手冊(cè)datasheet （共99頁(yè)）含各個(gè)接口說(shuō)明，應(yīng)用原理圖等信息。 QualcommTrueWireless? stereo earbuds (無(wú)線雙耳） Features（特點(diǎn)） ■ Qualifiedto Bluetooth v5.2 specification （藍(lán)牙協(xié)議標(biāo)準(zhǔn)5.2） ■ 120 MHz Qualcomm ? Kalimba ? audio DSP （120MHz 的音頻DSP處理器） ■ 32 MHz/80MHz Developer Processor for applications ■ Firmware Processor for system ■ Flexible QSPI flash programmable platform （可編程的QSPI外掛存儲(chǔ)器） ■ High-performance 24?bit audio interface （高性能的24位音頻接口） ■ Digital and analog microphone interfaces （含 數(shù)字 及模擬 MIC接口） ■ Flexible PIO controller and LED pins with PWM support ■ Serial interfaces: UART, Bit Serializer (I2C/SPI), USB 2.0 （支持串口，I2C， SPI，USB 接口） ■ Advanced audio algorithms （高級(jí)的音頻算法） ■ ActiveNoise Cancellation: （支持ANC 主動(dòng)降噪功能） Hybrid, Feedforward, and Feedback modes, using Digital or Analog Mics, Enabled using license keys available from Qualcomm? ■ Qualcomm ? aptX ? and aptX HD Audio （支持獨(dú)特的aptx 功能）
標(biāo)簽：
藍(lán)牙芯片
qcc5144
上傳時(shí)間：
2022-04-07
上傳用戶：
