LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上傳時間： 2013-12-20
上傳用戶：康郎
Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users
標簽： Guidelines LAYOUT 320 PCB
上傳時間： 2014-12-24
上傳用戶：zhaistone
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design Guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上傳時間： 2013-11-10
上傳用戶：1595690
This document provides practical, common Guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design Guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the Guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical Guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect Guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
The LTM4601 DC/DC μModule regulator is a completehigh power density stepdown regulator for up to 12Acontinuous (14A peak) loads. The device is housed ina small 15mm ¥ 15mm ¥ 2.8mm LGA surface mountpackage, thus the large power dissipation is a challengein some applications. This thermal application note willprovide Guidelines for using the μModule regulator inambient environments with or without air fl ow. Loadcurrent derating curves are provided for several inputvoltages and output voltages versus ambient temperatureand air fl ow.
上傳時間： 2013-10-19
上傳用戶：bakdesec
Safety GuidelinesThis manual contains notices which you should observe to ensure your own personal safety, as well as toprotect the product and connected equipment. These notices are highlighted in the manual by a warningtriangle and are marked as follows according to the level of danger:
標簽： Programmable 300 and
上傳時間： 2013-12-12
上傳用戶：fandeshun
MPLAB C30用戶指南(英文) HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides Guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
上傳時間： 2013-10-21
上傳用戶：13925096126
Contents 1 Introduction 1 2 Glosary 1 2.1 Concepts 1 2.2 Abbreviations and acronyms 4 3 Capabilities 6 4 Technical Description 6 4.1 General 6 4.2 Service oriented Allocation of Resources on the Abis interface (SARA) 8 4.3 Configuration of dedicated PDCHs in Packet Switched Domain (PSD) 10 4.4 Handling of Packet Data traffic 15 4.5 Channel selection in Cicuit Switched Domain (CSD) 19 4.6 Return of PDCHs to Cicuit Switched Domain (CSD) 22 4.7 Main changes in Ericsson GSM system R10/BSS R10 24 5 Engineering Guidelines 24 6 Parameters 26 6.1 Main controlling parameters 26 6.2 Parameters for special adjustments 26 6.3 Value ranges and default values 28 7 References 29
上傳時間： 2013-11-12
上傳用戶：ainimao
Abstract: Standard PCB design and mounting processes can adversely influence MEMS inertial sensors.This application note contains Guidelines for the layout, soldering, and mounting of MEMS inertialsensors in LGA packages in order to reduce stresses and improve functionality.
上傳時間： 2014-01-15
上傳用戶：sjb555
Abstract: This application note illustrates the flexibility of the MAX7060 ASK/FSK transmitter. While the currently available evaluationkit (EV kit) has been optimized for the device's use in a specific frequency band (i.e., 288MHz to 390MHz), this document addresseshow the EV kit circuitry can be modified for improved operation at 433.92MHz, a frequency commonly used in Europe. Twoalternative match and filter configurations are presented: one for optimizing drain efficiency, the other for achieving higher transmitpower. Features and capabilities of earlier Maxim industrial, scientific, and medical radio-frequency (ISM-RF) transmitters areprovided, allowing comparison of the MAX7060 to its predecessors. Several design Guidelines and cautions for using the MAX7060are discussed.
上傳時間： 2013-11-14
上傳用戶：swaylong
