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HYBRID

  • Electric Vehicles in Smart Grids

    Plug in Electric Vehicles (PEVs) use energy storages usually in the form of battery banks that are designed to be recharged using utility grid power. One category of PEVs are Electric Vehicles (EVs) without an Internal-Combustion (IC) engine where the energy stored in the battery bank is the only source of power to drive the vehicle. These are also referred to as Battery Electric Vehicles (BEVs). The second category of PEVs, which is more commercialized than the EVs, is the Plug in HYBRID Electric Vehicles (PHEVs) where the role of energy storage is to supplement the power produced by the IC engine. 

    標(biāo)簽: Electric Vehicles Smart Grids in

    上傳時(shí)間: 2020-06-07

    上傳用戶(hù):shancjb

  • Power+Electronic+Modules+Design+Manufacture

    A power semiconductor module is basically a power circuit of different materials assembled together using HYBRID technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organics and inorganics. Since these materials all behave differently under various environmental, electrical, and thermal stresses, proper selec- tion of these materials and the assembly processes are critical. In-depth knowledge of the material properties and the processing techniques is there- fore required to build a high-performance and highly reliable power module.

    標(biāo)簽: Manufacture Electronic Modules Design Power

    上傳時(shí)間: 2020-06-07

    上傳用戶(hù):shancjb

  • 藍(lán)牙芯片QCC5144 詳細(xì)規(guī)格書(shū)

    高通藍(lán)牙芯片QCC5144 詳細(xì)規(guī)格手冊(cè)datasheet (共99頁(yè))含各個(gè)接口說(shuō)明,應(yīng)用原理圖等信息。 QualcommTrueWireless? stereo earbuds  (無(wú)線(xiàn)雙耳) Features(特點(diǎn)) ■ Qualifiedto Bluetooth v5.2 specification  (藍(lán)牙協(xié)議標(biāo)準(zhǔn)5.2) ■ 120 MHz Qualcomm ? Kalimba ? audio DSP  (120MHz 的音頻DSP處理器) ■ 32 MHz/80MHz Developer Processor for applications   ■ Firmware Processor for system ■ Flexible QSPI flash programmable platform   (可編程的QSPI外掛存儲(chǔ)器) ■ High-performance 24?bit audio interface       (高性能的24位音頻接口) ■ Digital and analog microphone interfaces      (含 數(shù)字 及模擬 MIC接口) ■ Flexible PIO controller and LED pins with PWM support ■ Serial interfaces: UART, Bit Serializer (I2C/SPI), USB 2.0   (支持串口,I2C, SPI,USB 接口) ■ Advanced audio algorithms   (高級(jí)的音頻算法) ■ ActiveNoise Cancellation:        (支持ANC 主動(dòng)降噪功能) HYBRID, Feedforward, and Feedback modes, using Digital or Analog Mics, enabled using license keys available from Qualcomm? ■ Qualcomm ? aptX ? and aptX HD Audio  (支持獨(dú)特的aptx 功能)

    標(biāo)簽: 藍(lán)牙芯片 qcc5144

    上傳時(shí)間: 2022-04-07

    上傳用戶(hù):

  • 高通藍(lán)牙芯片QCC3040 詳細(xì)規(guī)格手冊(cè)datasheet

    高通藍(lán)牙芯片QCC3040 詳細(xì)規(guī)格手冊(cè)datasheet (共96頁(yè))QualcommTrueWireless? stereo earbuds  (無(wú)線(xiàn)雙耳)Features(特點(diǎn))■ Qualifiedto Bluetooth v5.2 specification  (藍(lán)牙協(xié)議標(biāo)準(zhǔn)5.2)■ 120 MHz Qualcomm ? Kalimba ? audio DSP  (120MHz 的音頻DSP處理器)■ 32 MHz Developer Processor for applications   (32MH的 應(yīng)用處理器)■ Firmware Processor for system■ Flexible QSPI flash programmable platform   (可編程的QSPI外掛存儲(chǔ)器)■ High-performance 24?bit audio interface       (高性能的24位音頻接口)■ Digital and analog microphone interfaces      (含 數(shù)字 及模擬 MIC接口)■ Flexible PIO controller and LED pins with PWM support■ Serial interfaces: UART, Bit Serializer (I2C/SPI), USB 2.0   (支持串口,I2C, SPI,USB 接口)■ Advanced audio algorithms   (高級(jí)的音頻算法)■ ActiveNoise Cancellation:        (支持ANC 主動(dòng)降噪功能)HYBRID, Feedforward, and Feedback modes, using Digitalor Analog Mics, enabled using license keys available from Qualcomm?■ Qualcomm ? aptX ? and aptX HD Audio  (支持獨(dú)特的aptx 功能)

    標(biāo)簽: 藍(lán)牙芯片 qcc3040

    上傳時(shí)間: 2022-04-09

    上傳用戶(hù):slq1234567890

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