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·詳細說明：學習USB2.0驅動程序設計源碼，包括Windows DDK Driver驅動的詳細設計，U盤，MP3的程序設計例子- Studies the USB2.0 driver design source code, INCLUDING Windows DDK Driver actuation detailed design, U plate, MP3 programming example
標簽：
USB
2.0
驅動
程序設計
上傳時間：
2013-06-04
上傳用戶：宋桃子
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本文論述了狀態機的verilog編碼風格,以及不同編碼風格的優缺點，Steve Golson's 1994 paper, "State Machine Design Techniques for Verilog and VHDL" [1], is agreat paper on state machine design using Verilog, VHDL and Synopsys tools. Steve's paper alsooffers in-depth background concerning the origin of specific state machine types.This paper, "State Machine Coding Styles for Synthesis," details additional insights into statemachine design INCLUDING coding style approaches and a few additional tricks.
標簽：
Synthesis
Machine
Coding
Styles
上傳時間：
2013-10-15
上傳用戶：dancnc
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Abstract: What can be simpler than designing with CMOS and BiCMOS? These technologies are very easy to use butthey still require careful design. This tutorial discusses the odd case of circuits that seem to work but exhibit somepeculiar behaviors—INCLUDING burning the designer's fingers!
標簽：
CMOS
邏輯電路
上傳時間：
2013-11-03
上傳用戶：dick_sh
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Abstract: This application note presents an overview of the operational characteristics of accurate I²C real-time clocks (RTCs),INCLUDING the DS3231, DS3231M, and DS3232. It focuses on general application guidelines that facilitate use of device resources forpower management, I²C communication circuit configurations, and I²C characteristics relative to device power-up sequences andinitializations. Additional discussions on decoupling are provided to support developing strategies for mitigating power-supply pushingof device frequency.
標簽：
I2C
高精度
實時時鐘
上傳時間：
2013-11-23
上傳用戶：WMC_geophy
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Abstract: A laser module designer can use a fixed resistor, mechanical pot, digital pot, or a digital-to-analogconverter (DAC) to control the laser driver's modulation and bias currents. The advantages of a programmablemethod (POT or DAC) are that the manufacturing process can be automated and digital control can be applied(e.g., to compensate for temperature). Using POTs can be a more simple approach than a DAC. There can be aslight cost advantage to using a POT, but this is usually not significant relative to other pieces of the design.Using a DAC can offer advantages, INCLUDING improved linearity (translating to ease of software implementationand ability to hit the required accuracy), increased board density, a wider range of resolutions, a betteroptimization range, ease of use with a negative voltage laser driver, and unit-to-unit consistency
標簽：
POT
DAC
應用筆記
校準
上傳時間：
2013-11-13
上傳用戶：ca05991270
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This application note is an overview discussion of theLinear Technology SPICE macromodel library. It assumeslittle if any prior knowledge of this software library or itshistory. However, it does assume familiarity with both theanalog simulation program SPICE (or one of its manyderivatives), and modern day op amps, INCLUDING bipolar,JFET, and MOSFET amplifier technologies
標簽：
LTC
運算放大器
模型
上傳時間：
2013-11-14
上傳用戶：zhanditian
-
Application considerations and circuits for the LT1001 and LT1002 single and dual precision amplifiers are illustrated in a number of circuits, INCLUDING strain gauge signal conditioners, linearized platinum RTD circuits, an ultra precision dead zone circuit for motor servos and other examples.
標簽：
精密
運算放大器
上傳時間：
2013-10-18
上傳用戶：dreamboy36
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PCI ExpressTM Architecture
Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, INCLUDING any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
標簽：
Architecture
ExpressTM
PCI
上傳時間：
2013-11-03
上傳用戶：gy592333
-
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect INCLUDING
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
標簽：
pci
PCB
設計規范
上傳時間：
2013-10-15
上傳用戶：busterman
-
This product integration guide provides application circuit information for theSmartMesh® LTP5903PC wireless embedded network manager. This guide is acompanion to the 020-0039 SmartMesh LTP5903PC Datasheet, whichdescribes overall product behavior, INCLUDING detailed information about normaloperating conditions, electrical and mechanical specifications, hardware andsoftware interfaces, and connector pinouts.
標簽：
Integration
Hardware
Guide
5903
上傳時間：
2013-11-14
上傳用戶：農藥鋒6
