Solving Integration and differential equations
標簽： differential Integration equations Solving
上傳時間： 2013-12-28
上傳用戶：zhuimenghuadie
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2014-04-18
上傳用戶：wpt
The LTP5900 includes sufficient power supply filtering and decoupling capacitancesuch that additional filtering should not be necessary for most battery-powereddesigns. Care must be taken to avoid large transient voltages on the supply as theM2510 steps up its current consumption (see the section on Supply Design below).
標簽： Integration Hardware Guide 5900
上傳時間： 2014-12-24
上傳用戶：youmo81
The LTP5901 and LTP5902 require little external circuitry, as the devices references,decoupling and power supply filtering are integrated. The LTP5901 and LTP5902 will bemodularly certified for operation in the United States (FCC), Canada (IC) and theEuropean Union (CE).
標簽： Integration LTP Hardware Guide
上傳時間： 2013-11-22
上傳用戶：sunchao524
Linear Technology offers a variety of devices that simplifyconverting power from a USB cable, but the LTC®3455represents the highest level of functional Integration yet. The LTC3455 seamlessly manages power flowbetween an AC adapter, USB cable and Li-ion battery,while complying with USB power standards, all from a4mm × 4mm QFN package. In addtion, two high efficiencysynchronous buck converters generate low voltage railswhich most USB-powered peripherals require. TheLTC3455 also provides power-on reset signals for themicroprocessor, a Hot SwapTM output for poweringmemory cards as well as an uncommitted gain blocksuitable for use as a low-battery comparator or an LDOcontroller. The PCB real estate required for the entire USBpower control circuit and two DC/DC converters is only225mm2.
上傳時間： 2013-11-02
上傳用戶：名爵少年
Advancements in board assembly, PCB layout anddigital IC Integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (POL) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new POL demands aredifficult to meet with traditional controller or regulatorICs, or power modules.
上傳時間： 2014-12-24
上傳用戶：lbbyxmraon
Abstract: This article discusses future trends in the design of smartphones and other consumer products. The discussion focuses onthe importance of Integration, which saves valuable PCB space and drives down costs.
上傳時間： 2014-01-13
上傳用戶：lhw888
The LTM8020, LTM8021, LTM8022 and LTM8023 μModule®regulators are complete easy-to-use encapsulated stepdownDC/DC regulators intended to take the pain and aggravationout of implementing a switching power supplyonto a system board. With a μModule regulator, you onlyneed an input cap, output cap and one or two resistorsto complete the design. As one might imagine, this highlevel of Integration greatly simplifi es the task of printedcircuit board design, reducing the effort to four categories:component footprint generation, component placement,routing the nets, and thermal vias.
上傳時間： 2014-01-18
上傳用戶：laomv123
為提高溫度測量效率，降低系統的成本，擴展傳輸距離，設計出一種新型溫度采集系統。單片機通過控制具有單總線方式的溫度傳感器DS18B20實現對溫度的測量，同時單片機通過控制具有單總線方式300～450MHz頻率范圍內的MAX7044與MAX7033無線發射與接收芯片實現溫度數據的無線傳輸。與傳統溫度采集系統相比，該系統利用單總線方式連接，采用無線傳輸方式實現遠距離通信，易于系統的集成與擴展。實驗結果表明，該系統結構簡單、方便移植，能夠同時實現多達上百點溫度的測量與500m范圍的傳輸。 Abstract: To improve the temperature measurement efficiency and reduce system cost,expansion of transmission distance,a new type of temperature acquisition system is designed.Microcontroller controlled temperature sensor DS18B20which has a single-bus achieves temperature measurement,while microcontroller by controlled the MAX7044and MAX7033chip with a single-bus and having300~450MHz radiofrequency to achieve the wireless transmission of temperature data.Compared with conventional temperature acquisition system,the system uses single-bus connected,and uses wireless transmission means to achieve long-distance communications,easy-to-system Integration and expansion.The experimental results show that the system is simple,convenient transplantation,and can be implemented in as many as a hundred-point temperature measure-ment and the transmission range of500meters.
上傳時間： 2013-10-29
上傳用戶：515414293
為了在工業生產及過程控制中準確測量溫度，設計了一種基于低功耗MSP430單片機的數字溫度計。整個系統通過單片機MSP430F1121A控制DS18B20讀取溫度，采用數碼管顯示，溫度傳感器DS18B20與單片機之間通過串口進行數據傳輸。MSP430系列單片機具有超低功耗，且外圍的整合性高，DS18B20只需一個端口即可實現數據通信，連接方便。通過多次實驗證明，該系統的測試結果與實際環境溫度一致，除了具有接口電路簡單、測量精度高、誤差小、可靠性高等特點外，其低成本、低功耗的特點使其擁有更廣闊的應用前景。 Abstract: In order to obtain accurate measuring temperature in industrial production and process control， a digital thermometer based on MSP430 MCU is designed. The system uses MSP430F1121A MCU to control DS18B20， and gets the temperature data， which is displayed on the LED. The temperature sensor DS18B20 and MCU transmit data through serial communication. MSP430 series has ultra-low power and high Integration， DS18B20 only needs one port to achieve data communication. Through many experimental results prove， this system is consistent with actual environment temperature. The system has characteristics of interface circuit simple， high measuring accuracy， minor error， high reliability， besides， the characteristics of low cost and low power make it having vaster application prospect.
上傳時間： 2013-10-16
上傳用戶：wettetw
