This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL MODELSwhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP MODELS are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal MODELS are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
MPLAB C30用戶指南(英文)
HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support
Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory MODELS, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
針對嵌入式機(jī)器視覺系統(tǒng)向獨(dú)立化、智能化發(fā)展的要求，介紹了一種嵌入式視覺系統(tǒng)--智能相機(jī)。基于對智能相機(jī)體系結(jié)構(gòu)、組成模塊和圖像采集、傳輸和處理技術(shù)的分析，對國內(nèi)外的幾款智能相機(jī)進(jìn)行比較。綜合技術(shù)發(fā)展現(xiàn)狀，提出基于FPGA+DSP模式的硬件平臺(tái)，并提出智能相機(jī)的發(fā)展方向。分析結(jié)果表明，該系統(tǒng)設(shè)計(jì)可以實(shí)現(xiàn)脫離PC運(yùn)行，完成圖像獲取與分析，并作出相應(yīng)輸出。
Abstract:
This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP MODELS and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
Single-Ended and Differential S-Parameters
Differential circuits have been important incommunication systems for many years. In the past,differential communication circuits operated at lowfrequencies, where they could be designed andanalyzed using lumped-element MODELS andtechniques. With the frequency of operationincreasing beyond 1GHz, and above 1Gbps fordigital communications, this lumped-elementapproach is no longer valid, because the physicalsize of the circuit approaches the size of awavelength.Distributed MODELS and analysis techniques are nowused instead of lumped-element techniques.Scattering parameters, or S-parameters, have beendeveloped for this purpose [1]. These S-parametersare defined for single-ended networks. S-parameterscan be used to describe differential networks, but astrict definition was not developed until Bockelmanand others addressed this issue [2]. Bockelman’swork also included a study on how to adapt single-ended S-parameters for use with differential circuits[2]. This adaptation, called “mixed-mode S-parameters,” addresses differential and common-mode operation, as well as the conversion betweenthe two modes of operation.This application note will explain the use of single-ended and mixed-mode S-parameters, and the basicconcepts of microwave measurement calibration.
In this paper, we discuss efficient coding and design styles using verilog. This can beimmensely helpful for any digital designer initiating designs. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral MODELS. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL MODELSwhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP MODELS are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
針對嵌入式機(jī)器視覺系統(tǒng)向獨(dú)立化、智能化發(fā)展的要求，介紹了一種嵌入式視覺系統(tǒng)--智能相機(jī)。基于對智能相機(jī)體系結(jié)構(gòu)、組成模塊和圖像采集、傳輸和處理技術(shù)的分析，對國內(nèi)外的幾款智能相機(jī)進(jìn)行比較。綜合技術(shù)發(fā)展現(xiàn)狀，提出基于FPGA+DSP模式的硬件平臺(tái)，并提出智能相機(jī)的發(fā)展方向。分析結(jié)果表明，該系統(tǒng)設(shè)計(jì)可以實(shí)現(xiàn)脫離PC運(yùn)行，完成圖像獲取與分析，并作出相應(yīng)輸出。
Abstract:
This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP MODELS and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
