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SPECIFICATIONs-High

  • Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) SPECIFICATIONs-High speed Physica

    Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) SPECIFICATIONs-High speed Physical Layer in the 5 GHZ Band

    標簽: SPECIFICATIONs-High Wireless Physical Control

    上傳時間: 2013-12-18

    上傳用戶:jkhjkh1982

  • This product has been manufactured to your company’s specifications a part for use in your company’

    This product has been manufactured to your company’s specifications a part for use in your company’s general electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the above applications, we will need to enter into a separate product liability agreement.

    標簽: company your specifications manufactured

    上傳時間: 2017-02-19

    上傳用戶:haohaoxuexi

  • 03 California PhD High integrity GPS-INS filter for precise relative navigation.pdf

    資料->【E】光盤論文->【E1】斯坦福博士論文->03 California PhD High integrity GPS-INS filter for precise relative navigation.pdf

    標簽: California navigation integrity relative

    上傳時間: 2013-07-03

    上傳用戶:jiiszha

  • FPGA-based high-order FIR filter design

    FPGA-based high-order FIR filter design

    標簽: FPGA-based high-order filter design

    上傳時間: 2013-08-06

    上傳用戶:sssnaxie

  • High-Speed Digital System Design

    Introduce High-Speed Digital System Design.

    標簽: High-Speed Digital Design System

    上傳時間: 2013-10-20

    上傳用戶:gps6888

  • pci e PCB設計規范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標簽: pci PCB 設計規范

    上傳時間: 2013-10-15

    上傳用戶:busterman

  • 確保電解電容器的壽命長-LED燈泡為例

    Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their specifications isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.  

    標簽: LED 電解電容器 壽命

    上傳時間: 2013-11-17

    上傳用戶:asdfasdfd

  • Achieving High Power Density Designs

    Achieving High Power Density Designs

    標簽: Achieving Density Designs Power

    上傳時間: 2013-10-12

    上傳用戶:qazxsw

  • TJA1042 High-speed CAN transce

    The TJA1042 is a high-speed CAN transceiver that provides an interface between aController Area Network (CAN) protocol controller and the physical two-wire CAN bus.The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in theautomotive industry, providing the differential transmit and receive capability to (amicrocontroller with) a CAN protocol controller.

    標簽: High-speed transce 1042 TJA

    上傳時間: 2014-12-28

    上傳用戶:氣溫達上千萬的

  • TJA1051 High-speed CAN transce

    The TJA1051 is a high-speed CAN transceiver that provides an interface between aController Area Network (CAN) protocol controller and the physical two-wire CAN bus.The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in theautomotive industry, providing differential transmit and receive capability to (amicrocontroller with) a CAN protocol controller.

    標簽: High-speed transce 1051 TJA

    上傳時間: 2013-10-17

    上傳用戶:jisujeke

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