OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced Signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.
上傳時間： 2013-10-27
上傳用戶：落花無痕
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST Signal EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2014-04-18
上傳用戶：wpt
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed Signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
Avalanche photo diode (APD) receiver modules arewidely used in fi ber optic communication systems. AnAPD module contains the APD and a Signal conditioningamplifi er, but is not completely self contained. It stillrequires signifi cant support circuitry including a highvoltage, low noise power supply and a precision currentmonitor to indicate the Signal strength. The challenge issqueezing this support circuitry into applications withlimited board space. The LT®3482 addresses this challengeby integrating a monolithic DC/DC step-up converter andan accurate current monitor. The LT3482 can supportup to a 90V APD bias voltage, and the current monitorprovides better than 10% accuracy over four decades ofdynamic range (250nA to 2.5mA).
上傳時間： 2014-01-18
上傳用戶：wenyuoo
A large group of fiber optic lasers are powered by DCcurrent. Laser drive is supplied by a current source withmodulation added further along the Signal path. Thecurrent source, although conceptually simple, constitutesan extraordinarily tricky design problem. There are anumber of practical requirements for a fiber optic currentsource and failure to consider them can cause laser and/or optical component destruction.
上傳時間： 2013-10-30
上傳用戶：wanghui2438
This collection of circuits was worked out between June1991 and July of 1994. Most were designed at customerrequest or are derivatives of such efforts. All representsubstantial effort and, as such, are disseminated here forwider study and (hopefully) use.1 The examples areroughly arranged in categories including power conversion,transducer Signal conditioning, amplifiers and Signalgenerators. As always, reader comment and questionsconcerning variants of the circuits shown may be addresseddirectly to the author.
上傳時間： 2013-11-15
上傳用戶：凌云御清風
鎖定放大是微弱信號檢測的重要手段?；谙嚓P檢測理論，利用開關電容的開關實現鎖定放大器中乘法器的功能，提出開關電容和積分器相結合以實現相關檢測的方法，并設計出一種鎖定放大器。該鎖定放大器將微弱信號轉化為與之相關的方波，通過后續電路得到正比于被測信號的直流電平，為后續采集處理提供方便。測量數據表明鎖定放大器前級可將10-6 A的電流轉換為10-1 V的電壓，后級通過帶通濾波器級聯可將信號放大1×105倍。該方法在降低噪聲的同時，可對微弱信號進行放大，線性度較高、穩定性較好。 Abstract: Lock-in Amplifying（LIA）is one of important means for weak Signal detection. Based on cross-correlation detection theory， switch in the swithched capacitor was used as multiplier of LIA， and a new method of correlation detection was proposed combining swithched capacitor with integrator. A kind of LIA was designed which can convert the weak Signal to square-wave， then DC proportional to measured Signal was obtained through follow-up conditioning circuit， providing convenience for Signal acquisition and processing. The measured data shows that the electric current（10-6 A） can be changed into voltage（10-1 V） by LIA， and the Signal is magnified 1×105 times by cascade band-pass filter. The noise is suppressed and the weak Signal is amplified. It has the advantages of good linearity and stability.
上傳時間： 2013-11-29
上傳用戶：黑漆漆
TI公司低功耗單片機MSP430系列。
標簽： MSP 430 Microcontroller Signal
上傳時間： 2013-11-23
上傳用戶：非衣2016
The MAX9257/MAX9258 programmable serializer/deserializer (SerDes) devices transfer both video data and control Signals over the same twisted-pair cable. However, control data can only be transmitted during the vertical blank time, which is indicated by the control-channel-enabled output (CCEN) Signal. The electronic control unit (ECU) firmware designer needs to know how quickly to respond to the CCEN Signal before it times out and how to calculate this duration. This application note describes how to calculate the duration of the CCEN for the MAX9257/MAX9258 SerDes chipset. The calculation is based on STO timeout, clock frequency, and UART bit timing. The CCEN duration is programmable and can be closed if not in use.
上傳時間： 2014-01-24
上傳用戶：xingisme
針對科研實驗中對拉壓千斤頂加載過程控制的需要，采用ATmega128單片機控制步進電機進而實現對執行系統的電動泵站實行自動控制。對力和位移的數據采集與處理及用步進電機控制電動泵站手柄的技術細節作了重點描述。通過單片機的A/D變換器對AMP放大模塊采集的電橋信號作量化處理，千斤頂的操控手柄位置依電動油泵閥門開啟的方向和大小作若干定位，單片機根據力或位移傳感器信號，實時控制步進電機驅動手柄旋轉到相應操控位置。 Abstract: This article describes the use of ATmega128 AVR microcontroller series of DBS electric pumping stations and QF100/200 separate twoway hydraulic jack to automate the process of manipulating the work of the technical content. Articles on force and displacement data acquisition and processing， and stepper motor control electric pump with the handle of the key technical details were described. Through the MCU’s A / D converter module is collected on the AMP amplification quantify the Signal bridge， jack handle position control valve opening according to the direction of electric pumps for a number of positioning and size of the microcontroller based on force or displacement sensor Signals， real-time control stepper motor drive control handle rotate to the appropriate location.
上傳時間： 2014-01-16
上傳用戶：hasan2015
