NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speedFlash memory. This Flash memory includes a special 128-bit wide memory interface andaccelerator architecture that enables the CPU to execute sequential instructions fromFlash memory at the maximum 72 MHz system clock rate. This feature is available onlyon the LPC2000 ARM Microcontroller family of products. The LPC2400 can execute both32-bit ARM and 16-bit Thumb instructions. Support for the two Instruction Sets meansEngineers can choose to optimize their application for either performance or code size atthe sub-routine level. When the core executes instructions in Thumb state it can reducecode size by more than 30 % with only a small loss in performance while executinginstructions in ARM state maximizes core performance.
為了在CDMA系統中更好地應用QDPSK數字調制方式，在分析四相相對移相（QDPSK)信號調制解調原理的基礎上，設計了一種QDPSK調制解調電路，它包括串并轉換、差分編碼、四相載波產生和選相、相干解調、差分譯碼和并串轉換電路。在MAX+PLUSⅡ軟件平臺上，進行了編譯和波形仿真。綜合后下載到復雜可編程邏輯器件EPM7128SLC84-15中，測試結果表明，調制電路能正確選相，解調電路輸出數據與QDPSK調制輸入數據完全一致，達到了預期的設計要求。
Abstract:
In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications where high data rate is notrequired and a lower data rate can achieve cost reductions in both thephysical media components and in the microprocessor and/ordedicated logic devices which use the network.The network shall be able to operate in either the normal data ratemode or a high-speed data download mode for assembly line andservice data transfer operations. The high-speed mode is onlyintended to be operational when the bus is attached to an off-boardservice node. This node shall provide temporary bus electrical loadswhich facilitate higher speed operation. Such temporary loads shouldbe removed when not performing download operations.The bit rate for normal communications is typically 33 kbit/s, forhigh-speed transmissions like described above a typical bit rate of83 kbit/s is recommended. The NCV7356 features undervoltagelockout, timeout for faulty blocked input signals, output blankingtime in case of bus ringing and a very low sleep mode current.
The CC1101 is a low-cost sub- 1 GHztransceiver designed for very low-powerwireless applications. The circuit is mainlyintended for the ISM (Industrial, Scientific andMedical) and SRD (Short Range Device)frequency bands at 315, 433, 868, and 915MHz, but can easily be programmed foroperation at other frequencies in the 300-348MHz, 387-464 MHz and 779-928 MHz bands.CC1101 is an improved and code compatibleversion of the CC1100 RF transceiver. Themain improvements on the CC1101 include:
基本的編輯工具(GENERAL EDITING FACILITIES)
對象放置(Object Placement)
ISIS支持多種類型的對象，每一類型對象的具體作用和功能將在下一章給出。雖然類型不同，但放置對象的基本步驟都是一樣的。
放置對象的步驟如下(To place an object:)
1.根據對象的類別在工具箱選擇相應模式的圖標(mode icon)。
2. Select the sub-mode icon for the specific type of object.
2、根據對象的具體類型選擇子模式圖標(sub-mode icon)。
3、如果對象類型是元件、端點、管腳、圖形、符號或標記，從選擇器里(selector)選擇你想要的對象的名字。對于元件、端點、管腳和符號，可能首先需要從庫中調出。
4、如果對象是有方向的，將會在預覽窗口顯示出來，你可以通過點擊旋轉和鏡象圖標來調整對象的朝向。
5、最后，指向編輯窗口并點擊鼠標左鍵放置對象。對于不同的對象，確切的步驟可能略有不同，但你會發現和其它的圖形編輯軟件是類似的，而且很直觀。
選中對象(Tagging an Object)
用鼠標指向對象并點擊右鍵可以選中該對象。該操作選中對象并使其高亮顯示，然后可以進行編輯。
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
