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USB Complete Everything You Need to Develop Custom USB Peripherals THIRD Edition
標(biāo)簽： Peripherals Everything USB Complete
上傳時(shí)間： 2013-12-19
上傳用戶：偷心的海盜
THIRD Paper About Double Scattering in MIMO Systems
標(biāo)簽： Scattering Systems Double THIRD
上傳時(shí)間： 2014-08-19
上傳用戶：123啊
英文第三版-Effective C++ THIRD Edition，提高你程序和設(shè)計(jì)的55個(gè)方法。
標(biāo)簽： Effective Edition THIRD 英文
上傳時(shí)間： 2014-01-24
上傳用戶：cmc_68289287
Matlab For Engineers And Scientists (THIRD Edition, 2008) this ebook is really good for all students who use Matlab
標(biāo)簽： Scientists Engineers students Edition
上傳時(shí)間： 2017-09-11
上傳用戶：小鵬
電子工業(yè)出版社，Microwave Engineering(THIRD Edition)中文版，(美)David M.Pozar著。微波工程經(jīng)典教材，內(nèi)容有：電磁理論、傳輸線理論、傳輸線和波導(dǎo)、微波網(wǎng)絡(luò)分析、阻抗匹配和調(diào)諧、微波諧振器、功率分配器和定向耦合器、微波濾波器、鐵氧體元件的理論與設(shè)計(jì)、噪聲與有源射頻元件、微波放大器設(shè)計(jì)、振蕩器和混頻器、微波系統(tǒng)導(dǎo)論。第1-308頁。
上傳時(shí)間： 2013-07-18
上傳用戶：jyycc
電子工業(yè)出版社，Microwave Engineering(THIRD Edition)中文版，(美)David M.Pozar著。微波工程經(jīng)典教材，內(nèi)容有：電磁理論、傳輸線理論、傳輸線和波導(dǎo)、微波網(wǎng)絡(luò)分析、阻抗匹配和調(diào)諧、微波諧振器、功率分配器和定向耦合器、微波濾波器、鐵氧體元件的理論與設(shè)計(jì)、噪聲與有源射頻元件、微波放大器設(shè)計(jì)、振蕩器和混頻器、微波系統(tǒng)導(dǎo)論。第309-617頁(完)。
上傳時(shí)間： 2013-05-28
上傳用戶：iswlkje
·原書名： WCDMA FOR UMTS-Radio Access for THIRD Generation Mobile Communication 作者：（芬）哈里.霍爾馬 安提.托斯卡拉 [同作者作品] 譯者： 周勝[同譯者作品] 等 叢書名： 其他 出版社：機(jī)械工業(yè)出版社* ISBN：7111096681 上架時(shí)間：2002-1-19 出版日期：2002 年1月 頁碼：266 版次：1-1
標(biāo)簽： NOKIA WCDMA 系統(tǒng)設(shè)計(jì)
上傳時(shí)間： 2013-08-06
上傳用戶：y307115118
Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of THIRD parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users
標(biāo)簽： GUIDELINES LAYOUT 320 PCB
上傳時(shí)間： 2014-12-24
上傳用戶：zhaistone
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the THIRD part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
標(biāo)簽： EMI 開關(guān)電源 英文
上傳時(shí)間： 2013-11-10
上傳用戶：1595690
PCI ExpressTM is the THIRD generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
上傳時(shí)間： 2013-11-17
上傳用戶：squershop
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