Digital-to-analog converters (DACs) are prevalent inindustrial control and automated test applications.General-purpose automated test equipment often requiresmany channels of precisely controlled voltagesthat span several voltage ranges. The LTC2704 is ahighly integrated 16-bit, 4-channel DAC for high-endapplications. It has a wide range of features designed toincrease performance and simplify design.
Linear Technology’s High Frequency Product lineupincludes a variety of RF I/Q modulators. The purpose ofthis application note is to illustrate the circuits requiredto interface these modulators with several popular D/Aconverters. Such circuits typically are required to maximizethe voltage transfer from the DAC to the baseband inputsof the modulator, as well as provide some reconstructionfi ltering.
The MAX2691 low-noise amplifier (LNA) is designed forGPS L2 applications. Designed in Maxim’s advancedSiGe process, the device achieves high gain andlow noise figure while maximizing the input-referred 1dBcompression point and the 3rd-order intercept point. TheMAX2691 provides a high gain of 17.5dB and sub 1dBnoise figure.
This application note describes a Linear Technology "Half-Flash" A/D converter, the LTC1099, being connected to a 256 element line scan photodiode array. This technology adapts itself to handheld (i.e., low power) bar code readers, as well as high resolution automated machine inspection applications..
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: The rapid build out of today's smart grid raises a number of security questions. In this article,we review two recent well-documented security breaches and a report of a security gap. These situationsinclude a 2009 smart-meter hack in Puerto Rico; a 2012 password discovery in grid distributionequipment; and insecure storage of a private key in distribution automation equipment. For each of theseattacks, we examine the breach, the potential threat, and secure silicon methods that, as part of acomplete security strategy, can help thwart the attacks.
Abstract: Stuxnet, a sophisticated virus that damaged Iran's nuclear capability, should be an eye openerfor the world. We can choose to learn something very narrow (how to combat the Stuxnet virus) or wecan choose to focus on the larger goal of thwarting the next type of creative cyber attack. Unfortunately,critical industrial infrastructure is not currently designed with security as a key goal, leaving open multipleavenues for an educated and funded attacker to create massive problems. This tutorial outlines somebasic concepts that engineers and product definers should consider to make sure their new projects stayahead of future threats.
Abstract: Investment in smart meters and smart grid end equipment continues to grow worldwide as countriestry to make their electric delivery systems more efficient. However, as critical as the electric deliveryinfrastructure is, it is normally not secured and thus subject to attack. This article describes the concept oflife-cycle security—the idea that embedded equipment in the smart grid must have security designed into theentire life of the product, even back to the contract manufacturer. We also talk about how life-cycle securityapplies to embedded equipment in the smart grid. Potential threats are discussed, as are potential solutionsto mitigate the risks posed by those threats.
