Abstract: This document explains how the Cupertino (MAXREFDES5#) subsystem reference design meets the higher resolution, higher voltage,and isolation needs of industrial control and industrial automation applications. Hardware and firmware design files as WELL as FFTs andhistograms from lab measurements are provided.
Abstract: Alexander Graham Bell patented twisted pair wires in 1881. We still use them today because they work so WELL. In addition we have the advantage ofincredible computer power within our world. Circuit simulators and filter design programs are available for little or no cost. We combine the twisted pair and lowpassfilters to produce spectacular rejection of radio frequency interference (RFI) and electromagnetic interference (EMI). We also illustrate use of a precision resistorarray to produce a customizable differential amplifier. The precision resistors set the gain and common mode rejection ratios, while we choose the frequencyresponse.
Recently a new technology for high voltage Power MOSFETshas been introduced – the CoolMOS™ . Based on thenew device concept of charge compensation the RDS(on) areaproduct for e.g. 600V transistors has been reduced by afactor of 5. The devices show no bipolar current contributionlike the WELL known tail current observed during the turn-offphase of IGBTs. CoolMOS™ virtually combines the lowswitching losses of a MOSFET with the on-state losses of anIGBT.
Abstract: It is incredible how many programmable logic controls (PLCs) around us make our modern life possible and pleasant.Machines in our homes heat and cool our air and water, as WELL as preserve and cook our food. This tutorial explains the importanceof PLCs, and describes how to choose component parts using the parametric tools on the Maxim's website.A similar version of this article was published February 29, 2012 in John Day's Automotive Electronic News.
Linear Technology’s High Frequency Product lineupincludes a variety of RF I/Q modulators. The purpose ofthis application note is to illustrate the circuits requiredto interface these modulators with several popular D/Aconverters. Such circuits typically are required to maximizethe voltage transfer from the DAC to the baseband inputsof the modulator, as WELL as provide some reconstructionfi ltering.
This application note describes a Linear Technology "Half-Flash" A/D converter, the LTC1099, being connected to a 256 element line scan photodiode array. This technology adapts itself to handheld (i.e., low power) bar code readers, as WELL as high resolution automated machine inspection applications..
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as WELL as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: The rapid build out of today's smart grid raises a number of security questions. In this article,we review two recent WELL-documented security breaches and a report of a security gap. These situationsinclude a 2009 smart-meter hack in Puerto Rico; a 2012 password discovery in grid distributionequipment; and insecure storage of a private key in distribution automation equipment. For each of theseattacks, we examine the breach, the potential threat, and secure silicon methods that, as part of acomplete security strategy, can help thwart the attacks.
Linear Technology offers a variety of devices that simplifyconverting power from a USB cable, but the LTC®3455represents the highest level of functional integration yet. The LTC3455 seamlessly manages power flowbetween an AC adapter, USB cable and Li-ion battery,while complying with USB power standards, all from a4mm × 4mm QFN package. In addtion, two high efficiencysynchronous buck converters generate low voltage railswhich most USB-powered peripherals require. TheLTC3455 also provides power-on reset signals for themicroprocessor, a Hot SwapTM output for poweringmemory cards as WELL as an uncommitted gain blocksuitable for use as a low-battery comparator or an LDOcontroller. The PCB real estate required for the entire USBpower control circuit and two DC/DC converters is only225mm2.
