：）alter table Students drop constraint no_na alter table Students add constraint sno primary key(Sno)
標簽： constraint Students alter table
上傳時間： 2015-10-20
上傳用戶：hopy
This paper introduces an affine invariant of trapezia, and the explicit constraint equation between the intrinsic matrix of a camera and the similarity invariants of a trapezium are established using the affine invariant. By this constraint, the inner parameters, motion parameters of the cameras and the similarity invariants of trapezia can be linearly determined using some prior knowledge on the cameras or the trapezia. The proposed algorithms have wide applicability since parallel lines are not rare in many scenes. Experimental results validate the proposed approaches. This work presents a unifying framework based on the parallelism constraint, and the previous methods based on the parallelograms or the parallelepipeds can be integrated into this framework. Key words: invariant parallelism constraint camera calibration 3D reconstruction
標簽： introduces constraint invariant explicit
上傳時間： 2014-01-16
上傳用戶：6546544
Mining sequential patterns with constraint (SPADE with constraint)
標簽： constraint with sequential patterns
上傳時間： 2013-12-25
上傳用戶：ynzfm
Abstract Syntax Notation One (ASN.1): constraint specification
標簽： specification constraint Abstract Notation
上傳時間： 2014-01-05
上傳用戶：cx111111
一次性生成constraint Delaunay的論文，結構完整，敘述詳細。
標簽： constraint Delaunay 論文
上傳時間： 2014-01-27
上傳用戶：hzy5825468
cadence allegro constraint manager high speed
上傳時間： 2013-07-21
上傳用戶：ccsdebug
15.2 已經加入了有關貫孔及銲點的Z軸延遲計算功能. 先開啟 Setup - constraints - Electrical constraint sets 下的 DRC 選項. 點選 Electrical constraints dialog box 下 Options 頁面 勾選 Z-Axis delay欄.
上傳時間： 2013-10-08
上傳用戶：王慶才
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2014-04-18
上傳用戶：wpt
if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_藥品庫存_藥品資料]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[藥品庫存] DROP constraint FK_藥品庫存_藥品資料 GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_門診劃價明細_門診劃價]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[門診劃價明細] DROP constraint FK_門診劃價明細_門診劃價 GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[FK_門診掛號_門診掛號類型]') and OBJECTPROPERTY(id, N'IsForeignKey') = 1) ALTER TABLE [dbo].[門診掛號] DROP constraint FK_門診掛號_門診掛號類型 GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[產地]') and OBJECTPROPERTY(id, N'IsUserTable') = 1) drop table [dbo].[產地] GO if exists (select * from dbo.sysobjects where id = object_id(N'[dbo].[醫生資料]') and OBJECTPROPERTY(id, N'IsUserTable') = 1) drop table [dbo].[醫生資料]
上傳時間： 2013-11-12
上傳用戶：sunshie
if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[FK_帳單明細_入住單]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[帳單明細] DROP constraint FK_帳單明細_入住單 GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[FK_入住單_客房信息]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[入住單] DROP constraint FK_入住單_客房信息 GO if exists (select * from dbo.sysobjects where id = object_id(N\'[dbo].[FK_客房信息_客房類型]\') and OBJECTPROPERTY(id, N\'IsForeignKey\') = 1) ALTER TABLE [dbo].[客房信息] DROP constraint FK_客房信息_客房類型
上傳時間： 2014-03-23
上傳用戶：chenhr
