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<button id="yc44o"></button> Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上傳時間： 2013-11-10
上傳用戶：1595690
Features: High efficiency, high reliability, low cost AC input range selected by switch 100% full load burn-in test Protections: Short circuit / Over load Fixed switching frequency at 25KHz Cooling by free air convection 1 year warranty Dimensions: 199*98*38mm (L*W*H)
標簽： Switchin Output Single SKS
上傳時間： 2013-10-30
上傳用戶：taa123456
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上傳時間： 2013-11-16
上傳用戶：萍水相逢
mani: MANIfold learning demonstration GUI by Todd Wittman, Department of Mathematics, University of Minnesota E-mail wittman@math.umn.edu with comments & questions. MANI Website: httP://www.math.umn.edu/~wittman/mani/index.html Last Modified by GUIDE v2.5 10-Apr-2005 13:28:36 Methods obtained from various authors. (1) MDS -- Michael Lee (2) ISOMAP -- J. Tenenbaum, de Silva, & Langford (3) LLE -- Sam Roweis & Lawrence Saul (4) Hessian LLE -- D. Donoho & C. Grimes (5) Laplacian -- M. Belkin & P. Niyogi (6) Diffusion Map -- R. Coifman & S. Lafon (7) LTSA -- Zhenyue Zhang & Hongyuan Zha
標簽： demonstration Mathematics Department University
上傳時間： 2016-10-29
上傳用戶：youmo81
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