現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場的時(shí)間要求給設(shè)計(jì)師帶來了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見設(shè)計(jì)中可能出現(xiàn)的各種問題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來說，最令人頭大的莫過于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過較長的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問題。本章就是圍繞信號(hào)完整性的問題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2014-05-15
上傳用戶：dudu1210004
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
本應(yīng)用文檔從元件選擇，電路設(shè)計(jì)和印刷電路板的布線等幾個(gè)方面講座了電路板級(jí)的電磁兼容性EMC設(shè)計(jì)。本文從以下幾個(gè)部分進(jìn)行論述：電磁兼容的概述元件選擇和電路設(shè)計(jì)技術(shù)印制電路板的布線技術(shù)
標(biāo)簽： 電磁兼容設(shè)計(jì) 板級(jí) 電子書 電路
上傳時(shí)間： 2013-11-14
上傳用戶：shen007yue
共模干擾和差模干擾是電子、 電氣產(chǎn)品上重要的干擾之一，它們 可以對(duì)周圍產(chǎn)品的穩(wěn)定性產(chǎn)生嚴(yán)重 的影響。在對(duì)某些電子、電氣產(chǎn)品 進(jìn)行電磁兼容性設(shè)計(jì)和測試的過程 中，由于對(duì)各種電磁干擾采取的抑 制措施不當(dāng)而造成產(chǎn)品在進(jìn)行電磁 兼容檢測時(shí)部分測試項(xiàng)目超標(biāo)或通 不過EMC 測試，從而造成了大量人 力、財(cái)力的浪費(fèi)。為了掌握電磁干 擾抑制技術(shù)的一些特點(diǎn)，正確理解 一些概念是十分必要的。共模干擾 和差模干擾的概念就是這樣一種重 要概念。正確理解和區(qū)分共模和差 模干擾對(duì)于電子、電氣產(chǎn)品在設(shè)計(jì) 過程中采取相應(yīng)的抗干擾技術(shù)十分 重要，也有利于提高產(chǎn)品的電磁兼 容性。
上傳時(shí)間： 2014-01-16
上傳用戶：tdyoung
時(shí)域與頻域• 傅立葉變換• 干擾抑制設(shè)計(jì)– 時(shí)鐘電路干擾抑制設(shè)計(jì)– 總線電路干擾抑制設(shè)計(jì)– 單板電源電路去耦設(shè)計(jì)– 開關(guān)電源干擾抑制設(shè)計(jì)– 接口電路干擾抑制設(shè)計(jì)• 抗干擾設(shè)計(jì)– 看門狗電路抗干擾設(shè)計(jì)– 面板復(fù)位電路抗干擾設(shè)計(jì)– 面板指示燈抗干擾設(shè)計(jì)– 接口電路抗干擾設(shè)計(jì)– 電源電路抗干擾設(shè)計(jì)– 面板撥碼開關(guān)電路抗干擾設(shè)計(jì)
標(biāo)簽： EMC 電路 設(shè)計(jì)技術(shù)
上傳時(shí)間： 2013-11-23
上傳用戶：cjl42111
PCB布線對(duì)PCB的電磁兼容性影響很大，為了使PCB上的電路正常工作，應(yīng)根據(jù)本文所述的約束條件來優(yōu)化布線以及元器件/接頭和某些IC所用去耦電路的布局PCB材料的選擇通過合理選擇PCB的材料和印刷線路的布線路徑，可以做出對(duì)其它線路耦合低的傳輸線。當(dāng)傳輸線導(dǎo)體間的距離d小于同其它相鄰導(dǎo)體間的距離時(shí)，就能做到更低的耦合，或者更小的串?dāng)_（見《電子工程專輯》2000 年第1 期"應(yīng)用指南"）。設(shè)計(jì)之前，可根據(jù)下列條件選擇最經(jīng)濟(jì)的PCB形式：對(duì)EMC的要求·印制板的密集程度·組裝與生產(chǎn)的能力·CAD 系統(tǒng)能力·設(shè)計(jì)成本·PCB的數(shù)量·電磁屏蔽的成本當(dāng)采用非屏蔽外殼產(chǎn)品結(jié)構(gòu)時(shí)，尤其要注意產(chǎn)品的整體成本/元器件封裝/管腳樣式、PCB形式、電磁場屏蔽、構(gòu)造和組裝），在許多情況下，選好合適的PCB形式可以不必在塑膠外殼里加入金屬屏蔽盒。
標(biāo)簽： pcb 電磁兼容設(shè)計(jì)
上傳時(shí)間： 2013-11-01
上傳用戶：dddddd
電路板級(jí)的電磁兼容設(shè)計(jì):本應(yīng)用文檔從元件選擇、電路設(shè)計(jì)和印制電路板的布線等幾個(gè)方面討論了電路板級(jí)的電磁兼容性（EMC）設(shè)計(jì)。本文從以下幾個(gè)部分進(jìn)行論述：第一部分：電磁兼容性的概述第二部分：元件選擇和電路設(shè)計(jì)技術(shù)第三部分：印制電路板的布線技術(shù)附錄A：電磁兼容性的術(shù)語附錄B：抗干擾的測量標(biāo)準(zhǔn)第一部分 — 電磁干擾和兼容性的概述電磁干擾是現(xiàn)代電路工業(yè)面對(duì)的一個(gè)主要問題。為了克服干擾，電路設(shè)計(jì)者不得不移走干擾源，或設(shè)法保護(hù)電路不受干擾。其目的都是為了使電路按照預(yù)期的目標(biāo)來工作——即達(dá)到電磁兼容性。通常，僅僅實(shí)現(xiàn)板級(jí)的電磁兼容性這還不夠。雖然電路是在板級(jí)工作的，但是它會(huì)對(duì)系統(tǒng)的其它部分輻射出噪聲，從而產(chǎn)生系統(tǒng)級(jí)的問題。另外，系統(tǒng)級(jí)或是設(shè)備級(jí)的電磁兼容性必須要滿足某種輻射標(biāo)準(zhǔn)，這樣才不會(huì)影響其他設(shè)備或裝置的正常工作。許多發(fā)達(dá)國家對(duì)電子設(shè)備和儀器有嚴(yán)格的電磁兼容性標(biāo)準(zhǔn)；為了適應(yīng)這個(gè)要求，設(shè)計(jì)者必須從板級(jí)設(shè)計(jì)開始就考慮抑制電子干擾。
標(biāo)簽： 電路 板級(jí) 電磁兼容設(shè)計(jì)
上傳時(shí)間： 2013-10-12
上傳用戶：xiaoyaa
針對(duì)目前LED驅(qū)動(dòng)電源功率因數(shù)不高和效率低等問題，設(shè)計(jì)了一款高功率因數(shù)高效率的反激式LED驅(qū)動(dòng)電源。闡述了單級(jí)PFC的基本原理，并給出了PFC的優(yōu)化設(shè)計(jì)方法。分析了電源的整體效率和電磁干擾的來源，提出了提高效率的方法和抑制電磁干擾的途徑。實(shí)驗(yàn)測試結(jié)果表明，該驅(qū)動(dòng)電源具有高功率因數(shù)、高效率的特點(diǎn)；同時(shí)符合EMC測試標(biāo)準(zhǔn)。
上傳時(shí)間： 2013-10-13
上傳用戶：yanyangtian
LTC®4223 是一款符合微通信計(jì)算架構(gòu) (MicroTCA) 規(guī)範(fàn)電源要求的雙通道熱插拔 (Hot Swap™) 控制器，該規(guī)範(fàn)於近期得到了 PCI 工業(yè)計(jì)算機(jī)制造商組織 (PICMG) 的批準(zhǔn)。
上傳時(shí)間： 2014-12-24
上傳用戶：我累個(gè)乖乖
摘要： 基于小型開關(guān)電源會(huì)產(chǎn)生電磁干擾污染電網(wǎng)，同時(shí)它們又容易受到外部電磁環(huán)境的影響，不能精確地工作。我們采用了濾波、屏蔽、接地等技術(shù)，使小開關(guān)電源的EMI被控制在EMC標(biāo)準(zhǔn)規(guī)定的極限下，使它們能夠良好地工作又不至于污染電網(wǎng)。特別在文中對(duì)小開關(guān)電源的電路進(jìn)行了改進(jìn)，使這類電源能夠有效地吸收和抑制干擾。大量的實(shí)踐證明本文中采用的方案經(jīng)濟(jì)可靠地解決了小開關(guān)電源的抗干擾問題，不但能夠改善小開關(guān)電源的性能，還降低了小開關(guān)電源的故障率，使小型開關(guān)電源的使用范圍更加廣泛。
標(biāo)簽： 開關(guān)電源 干擾設(shè)計(jì) 電磁
上傳時(shí)間： 2013-11-23
上傳用戶：mhp0114
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