Abstract: The process of designing a radio system can be complex and often involves many project tradeoffs. Witha little insight, balancing these various characteristics can make the job of designing a radio system easier. Thistutorial explores these tradeoffs and provides details to consider for various radio applications. With a focus on theindustrial, scientific, medical (ISM) bands, the subjects of frequency selection, one-way versus two-way systems,modulation techniques, cost, antenna options, power-supply influences, effects on range, and protocol selectionare explored.
Abstract: This application note helps system designers choose the correct external components for use with the MAX16948 dualremote antenna LDO/switch, thus ensuring that automobile-regulated phantom antenna supply and output-current-monitoring circuitrymeet performance objectives. An electronic calculator is provided that helps specify the critical external components for theMAX16948, thus reducing design time. The calculator also determines the device's analog output voltage, output current-limitthreshold, and output current-sensing accuracies. The calculator includes new automatic Step By Step feature that assists designerswith component choice. To use the new automatic feature, click on the Step By Step button relative to the desired section.
本軟件是關(guān)于MAX338, MAX339的英文數(shù)據(jù)手冊：MAX338, MAX339 8通道/雙4通道、低泄漏、CMOS模擬多路復(fù)用器
The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions.
These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
Abstract: Designers who must interface 1-Wire temperature sensors with Xilinx field-programmable gate arrays(FPGAs) can use this reference design to drive a DS28EA00 1-Wire slave device. The downloadable softwarementioned in this document can also be used as a starting point to connect other 1-Wire slave devices. The systemimplements a 1-Wire master connected to a UART and outputs temperature to a PC from the DS28EA00 temperaturesensor. In addition, high/low alarm outputs are displayed from the DS28EA00 PIO pins using LEDs.
Nios II定制指令用戶指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom
instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner
loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor.
The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.
