《器件封裝用戶(hù)向?qū)А焚愳`思產(chǎn)品封裝資料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
One of the strengths of Synplify is the Finite State Machine compiler. This is a powerfulfeature that not only has the ability to automatic...
數(shù)字與模擬電路設(shè)計(jì)技巧IC與LSI的功能大幅提升使得高壓電路與電力電路除外,幾乎所有的電路都是由半導(dǎo)體組件所構(gòu)成,雖然半導(dǎo)體組件高速、高頻化時(shí)會(huì)有EMI的困擾,不過(guò)為了充分發(fā)揮半導(dǎo)體組件應(yīng)有的性能,電路板設(shè)計(jì)與封裝技術(shù)仍具有決定性的影響。 模擬與數(shù)字技術(shù)的融合由于IC與LSI半導(dǎo)體本身的高速化,同時(shí)...
高進(jìn)制調(diào)制中,Gray碼映射之后,收端進(jìn)行的軟解映射程序。解映射之后的軟信息,可直接用于譯碼...
A program to demonstrate the optimization process of ant colony optimization for the traveling saleman problem (TSP). The cities are shown as red circ...