OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.
標(biāo)簽: 光電轉(zhuǎn)換 電路設(shè)計
上傳時間: 2013-10-27
上傳用戶:落花無痕
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
標(biāo)簽: Rogers Radio John Freq
上傳時間: 2014-12-23
上傳用戶:han_zh
介紹高速電路的設(shè)計
標(biāo)簽: high-speed Digital Design 高速數(shù)字
上傳時間: 2013-10-16
上傳用戶:yt1993410
【摘要】本文結(jié)合作者多年的印制板設(shè)計經(jīng)驗,著重印制板的電氣性能,從印制板穩(wěn)定性、可靠性方面,來討論多層印制板設(shè)計的基本要求。【關(guān)鍵詞】印制電路板;表面貼裝器件;高密度互連;通孔【Key words】Printed Circuit Board;Surface Mounting Device;high Density Interface;Via一.概述印制板(PCB-Printed Circuit Board)也叫印制電路板、印刷電路板。多層印制板,就是指兩層以上的印制板,它是由幾層絕緣基板上的連接導(dǎo)線和裝配焊接電子元件用的焊盤組成,既具有導(dǎo)通各層線路,又具有相互間絕緣的作用。隨著SMT(表面安裝技術(shù))的不斷發(fā)展,以及新一代SMD(表面安裝器件)的不斷推出,如QFP、QFN、CSP、BGA(特別是MBGA),使電子產(chǎn)品更加智能化、小型化,因而推動了PCB工業(yè)技術(shù)的重大改革和進(jìn)步。自1991年IBM公司首先成功開發(fā)出高密度多層板(SLC)以來,各國各大集團(tuán)也相繼開發(fā)出各種各樣的高密度互連(HDI)微孔板。這些加工技術(shù)的迅猛發(fā)展,促使了PCB的設(shè)計已逐漸向多層、高密度布線的方向發(fā)展。多層印制板以其設(shè)計靈活、穩(wěn)定可靠的電氣性能和優(yōu)越的經(jīng)濟(jì)性能,現(xiàn)已廣泛應(yīng)用于電子產(chǎn)品的生產(chǎn)制造中。下面,作者以多年設(shè)計印制板的經(jīng)驗,著重印制板的電氣性能,結(jié)合工藝要求,從印制板穩(wěn)定性、可靠性方面,來談?wù)劧鄬又瓢逶O(shè)計的基本要領(lǐng)。
上傳時間: 2013-11-19
上傳用戶:zczc
討論、研究高性能覆銅板對它所用的環(huán)氧樹脂的性能要求,應(yīng)是立足整個產(chǎn)業(yè)鏈的角度去觀察、分析。特別應(yīng)從HDI多層板發(fā)展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發(fā)展特點,它的發(fā)展趨勢如何——這都是我們所要研究的高性能CCL發(fā)展趨勢和重點的基本依據(jù)。而HDI多層板的技術(shù)發(fā)展,又是由它的應(yīng)用市場——終端電子產(chǎn)品的發(fā)展所驅(qū)動(見圖1)。 圖1 在HDI多層板產(chǎn)業(yè)鏈中各類產(chǎn)品對下游產(chǎn)品的性能需求關(guān)系圖 1.HDI多層板發(fā)展特點對高性能覆銅板技術(shù)進(jìn)步的影響1.1 HDI多層板的問世,對傳統(tǒng)PCB技術(shù)及其基板材料技術(shù)是一個嚴(yán)峻挑戰(zhàn)20世紀(jì)90年代初,出現(xiàn)新一代高密度互連(high Density Interconnection,簡稱為 HDI)印制電路板——積層法多層板(Build—Up Multiplayer printed board,簡稱為 BUM)的最早開發(fā)成果。它的問世是全世界幾十年的印制電路板技術(shù)發(fā)展歷程中的重大事件。積層法多層板即HDI多層板,至今仍是發(fā)展HDI的PCB的最好、最普遍的產(chǎn)品形式。在HDI多層板之上,將最新PCB尖端技術(shù)體現(xiàn)得淋漓盡致。HDI多層板產(chǎn)品結(jié)構(gòu)具有三大突出的特征:“微孔、細(xì)線、薄層化”。其中“微孔”是它的結(jié)構(gòu)特點中核心與靈魂。因此,現(xiàn)又將這類HDI多層板稱作為“微孔板”。HDI多層板已經(jīng)歷了十幾年的發(fā)展歷程,但它在技術(shù)上仍充滿著朝氣蓬勃的活力,在市場上仍有著前程廣闊的空間。
標(biāo)簽: 性能 發(fā)展趨勢 覆銅板 環(huán)氧樹脂
上傳時間: 2013-11-22
上傳用戶:gundan
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標(biāo)簽: pci PCB 設(shè)計規(guī)范
上傳時間: 2013-10-15
上傳用戶:busterman
Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their specifications isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.
上傳時間: 2013-11-17
上傳用戶:asdfasdfd
Abstract: There are differences between the operation of low-frequency AC transformers and electronic transformersthat supply current to MR16 lamps, and there are also differences in the current draw for MR16 halogen lamps andMR16 LED lamps. These contrasts typically prevent an MR16 LED lamp from operating with most electronictransformers. This article explains how a high-brightness (HB) LED driver optimized for MR16 lamps will allow LEDlamps to be compatible with most electronic transformers.A similar version of this article appeared on Display Plus, July 7, 2012 and in German in Elektronikpraxis, October 1,2012.
上傳時間: 2013-10-14
上傳用戶:playboys0
Abstract: This application note details a step-by-step design process for the MAX16833 high-voltagehigh-brightness LED driver. This process can speed up prototyping and increase the chance for firstpass
上傳時間: 2013-10-09
上傳用戶:tianjinfan
We provide complete power solutions with a full lineup of power managementproducts. This brochure provides an overview of our high performance DC/DC switching regulatorcontrollers for applications including datacom, telecom, industrial, automotive, medical, avionicsand control systems. We make power design easier with our industry-leading field applicationengineering support; a broad selection of demonstration boards with schematics, layout filesand parts lists; SwitcherCAD® software for simulation, application notes and comprehensivetechnical documentation.
上傳時間: 2013-10-15
上傳用戶:lz4v4
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