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introduction

  • 高電壓降壓轉(zhuǎn)換器驅(qū)動高功率LED

      introduction

    標(biāo)簽: LED 高電壓 降壓轉(zhuǎn)換器 驅(qū)動高功率

    上傳時間: 2014-01-16

    上傳用戶:上善若水

  • 基于MAX7219的LED數(shù)碼顯示驅(qū)動電路設(shè)計

      現(xiàn)有基于MAX7219芯片的數(shù)碼管驅(qū)動電路只適用于小尺寸LED,為擴(kuò)展其使用范圍,在介紹動態(tài)顯示芯片MAX7219功能的基礎(chǔ)上,提出了一個基于該芯片的8位高亮度8英寸數(shù)碼管驅(qū)動電路。電路保留了MAX7219芯片的功能強(qiáng)大、編程簡單等優(yōu)點,通過74LS273鎖存器和ULN2803達(dá)林頓驅(qū)動器,實現(xiàn)了對任意大尺寸數(shù)碼管提供較高電壓和電流驅(qū)動的靜態(tài)顯示,并亮度可調(diào)。   Abstract:   The existing display-driving circuit based on MAX7219 was only applicable to small-size LED. To expand its use, based on the function introduction of dynamic display chip MAX7219, a display-driving circuit for high-brightness 8-bit LED with the size of 8-inch was proposed. The advantages of MAX7219 were retained, such as powerful function and simple programming. Static display with adjustable brightness for large-size LED with higher voltage and current was achieved with the help of 74LS273 and ULN2803.

    標(biāo)簽: 7219 MAX LED 數(shù)碼顯示

    上傳時間: 2013-10-23

    上傳用戶:31633073

  • AVR32801: UC3A3 Schematic Chec

    AVR32801: UC3A3 Schematic Checklist Features •  Power circuit •  Reset circuit •  USB connection •  External bus interface •  ABDAC sound DAC interface •  JTAG and Nexus debug ports •  Clocks and crystal oscillators •  MMC, SD-card, SDHC, SDIO and CE-ATA interface 1 introduction A good hardware design comes from a proper schematic. Since UC3A3 devices have a fair number of pins and functions, the schematic for these devices can be large and quite complex. This application note describes a common checklist which should be used when starting and reviewing the schematics for a UC3A3 design.

    標(biāo)簽: Schematic 32801 UC3A3 Chec

    上傳時間: 2014-12-26

    上傳用戶:DXM35

  • Agilent Wedge for Probing High

    introductionAs chip designers pack more functions into ICs,pin counts continue to grow and the space betweenpins keeps shrinking. Pin spacings of 0.5 mm and0.65 mm are not at all uncommon. The power ofthese new ICs is wonderful, to be sure, but trou-bleshooting them can be a chore because connect-ing scopes and logic analyzers has become muchmore difficult and less dependable.

    標(biāo)簽: Agilent Probing Wedge High

    上傳時間: 2013-10-22

    上傳用戶:蔣清華嗯

  • dsPIC30F產(chǎn)品手冊

    dsPIC30F產(chǎn)品手冊 High Performance Digital Signal Controllers This section of the manual contains the following topics:1.1 introduction 1.2 Manual Objective 1.3 Device Structure1.4 Development Support  1.5 Style and Symbol Conventions 1.6 Related Documents 1.7 Revision History

    標(biāo)簽: dsPIC 30F 30 產(chǎn)品手冊

    上傳時間: 2013-12-26

    上傳用戶:xzt

  • 基于XGATE進(jìn)行Manchester譯碼的方法

    Using the XGATE for Manchester DecodingTable of Contents 1 introduction                         1.1 XGATE Module in S12X               2 Decoding Algorithm                        3 Software Implementation                   3.1 Frame Scheme                       3.2 Operating Modes and Demo             3.3 Files Summary                        3.4 Complete Mode Flowchart              4 Manchester Encoder                      4.1 Devices Used                        5 Conclusion  Appendix A Noise Elements During RF Transmissions in the Manchester Decoding ImplementationA.1 Types of Noise                      A.2 Effects of Noise                      A.3 Workaround for Noise Effects          

    標(biāo)簽: Manchester XGATE 譯碼

    上傳時間: 2013-10-15

    上傳用戶:wqq123456

  • X-tal oscillators on 8-bit mic

    <Almost since the introduction of microcontrollers as electronic components there always has been an oscillatorcircuit on the device to make it work. From application point of view only some external components wererequired to make it work. However, to make sure that it will always work required more effort. This report is basedon feedback from the market from customers applying 8-bit mircrocontrollers.>

    標(biāo)簽: oscillators X-tal bit mic

    上傳時間: 2013-11-12

    上傳用戶:穿著衣服的大衛(wèi)

  • 采用TüV認(rèn)證的FPGA開發(fā)功能安全系統(tǒng)

    This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 圖Figure 1. Local Safety System

    標(biāo)簽: FPGA 安全系統(tǒng)

    上傳時間: 2013-11-05

    上傳用戶:維子哥哥

  • 《器件封裝用戶向?qū)А焚愳`思產(chǎn)品封裝資料

    introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標(biāo)簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-10-22

    上傳用戶:ztj182002

  • WP200-將Spartan-3 FPGA用作遠(yuǎn)程數(shù)碼相機(jī)的低成本控制器

      The introduction of Spartan-3™ devices has createdmultiple changes in the evolution of embedded controldesigns and pushed processing capabilities to the “almostfreestage.” With these new FPGAs falling under $20, involume, with over 1 million system gates, and under $5for 100K gate-level units, any design with programmablelogic has a readily available 8- or 16-bit processor costingless than 75 cents and 32-bit processor for less than $1.50.

    標(biāo)簽: Spartan FPGA 200 WP

    上傳時間: 2013-12-10

    上傳用戶:zgu489

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