As we enter the next millennium, there are clear technological patterns. First, the electronic industry continues to scale microelectronic structures to achieve faster devices, new devices, or more per unit area. Secondly, electrostatic charge, electrostatic discharge (ESD), electrical overstress (EOS) and electromagnetic emissions (EMI) continue to be a threat to these scaled structures. This dichotomy presents a dilemma for the scaling of semiconductor technologies and a future threat to new technologies. Technological advancements, material changes, design techniques, and simulation can fend off this growing concern – but to maintain this ever-threatening challenge, one must continue to establish research and education in this issue.
標(biāo)簽： ESD-Phenomena-and-the-Reliability
上傳時間： 2020-06-05
上傳用戶：shancjb
Micro-Electro-Mechanical Systems (MEMS) are miniature systems composed ofintegratedelectricalandmechanicalpartstosenseand/orcontrolthingsonaμmscale. The concept of MEMS is attributed to Richard Feynman’s famous talk on December 29th, 1959 [2,3]. Dr. Feynman foresaw many aspects of future MEMS development with his insight in microphysics. In particular, material properties in the μm scale are differentfrombulkpropertiesandthescalingdownofintegratedcircuits(IC)fabrication technology has been a major driving force of MEMS development.
標(biāo)簽： Performance High MEMS RF
上傳時間： 2020-06-06
上傳用戶：shancjb
A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organics and inorganics. Since these materials all behave differently under various environmental, electrical, and thermal stresses, proper selec- tion of these materials and the assembly processes are critical. In-depth knowledge of the material properties and the processing techniques is there- fore required to build a high-performance and highly reliable power module.
標(biāo)簽： Manufacture Electronic Modules Design Power
上傳時間： 2020-06-07
上傳用戶：shancjb
Sensors are points ofcontact betweenthe material world ofatoms, mass, andenergy and the seemingly immaterial world of information, computation, and cognition. Linking these two domains more tightly yields all sorts of practical benefits, such as improvedinputdevicesforcomputers,moreeffectivemedicaldevices(implantedor worn), more precise agricultural operations, better monitored buildings or bridges, more secure payment systems, and more reliable sensor–actuator control systems. There are many settings in which tighter coupling between digital and physical planes can enhance safety, security, performance, and reliability.
標(biāo)簽： Computational RFID
上傳時間： 2020-06-08
上傳用戶：shancjb
The present work, Advanced Process Engineering Control, is intended to be the continuation of the authors? Basic Process Engineering Control published by DeGruyter in 2014. It presents the main and conventional type control loops in process industries. Titles containing the concept of process engineering were deliberately chosen to suggest the inclusion, within the same approach, of processes other than the traditional ones. These come from outside the traditional fields of chemistry and petrochemistry: the sphere of pharmaceuticals, wastewater management, water puri- fication, water reserve management, construction material industry, food processing, household or automotive industries.
標(biāo)簽： Advanced_Process_Engineering_Cont rol
上傳時間： 2020-06-10
上傳用戶：shancjb
The chief objective of Electric Machinery continues to be to build a strong foundation in the basic principles of electromechanics and electric machinery. Through all of its editions, the emphasis of Electric Machinery has been on both physical insight and analytical techniques. Mastery of the material covered will provide both the basis for understanding many real-world electric-machinery applications as well as the foundation for proceeding on to more advanced courses in electric machinery design and control.
標(biāo)簽： Machinery Electric 6th ed
上傳時間： 2020-06-10
上傳用戶：shancjb
This edition of Digital Image Processing is a major revision of the book. As in the 1977 and 1987 editions by Gonzalez and Wintz, and the 1992, 2002, and 2008 editions by Gonzalez and Woods, this sixth-generation edition was prepared with students and instructors in mind. The principal objectives of the book continue to be to provide an introduction to basic concepts and methodologies applicable to digital image processing, and to develop a foundation that can be used as the basis for further study and research in this field. To achieve these objectives, we focused again on material that we believe is fundamental and whose scope of application is not limited to the solution of specialized problems. The mathematical complexity of the book remains at a level well within the grasp of college seniors and first-year graduate students who have introductory preparation in mathematical analysis, vectors, matrices, probability, statistics, linear systems, and computer programming. The book website provides tutorials to support readers needing a review of this background material
標(biāo)簽： Processing Digital Image
上傳時間： 2021-02-20
上傳用戶：
軟件開發(fā)人員必備工具書，，目錄如下Welcome to Software Construction [1]1.1 What Is Software Construction?1.2 Why Is Software Construction Important?1.3 How to Read This Book......7.1 Valid Reasons to Create a Routine7.2 Design at the Routine Level7.3 Good Routine Names7.4 How Long Can a Routine Be?7.5 How to Use Routine Parameters7.6 Special Considerations in the Use of Functions7.7 Macro Routines and Inline RoutinesDefensive Programming [5.6 + new material]8.1 Protecting Your Program From Invalid Inputs8.2 Assertions8.3 Error Handling Techniques8.4 Exceptions8.5 Barricade Your Program to Contain the Damage Caused by Errors8.6 Debugging Aids8.7 Determining How Much Defensive Programming to Leave in Production Code8.8 Being Defensive About Defensive ProgrammingThe Pseudocode Programming Process [4+new material]9.1 Summary of Steps in Building Classes and Routines9.2 Pseudocode for Pros9.3 Constructing Routines Using the PPP9.4 Alternatives to the PPP......
上傳時間： 2021-12-08
上傳用戶：20125101110
From additive manufacturing to 3D4D printing 3 Breakthrough Innovations Programmable material, 4D Printing and Bio-printing by André, Jean-Claude (z-lib.org)
標(biāo)簽： 3D生物打印
上傳時間： 2022-01-31
上傳用戶：
InGaAs/AlGaAs semiconductor lasers come in threetypes: VCSELs and two types of EELs. The VCSEL, asits name implies, emits vertically, normal to the planeof the device, owing to cavity mirrors grown withinthe epitaxial material itself. The VCSEL’s circular beamhas a numerical aperture (NA) of roughly 0.2, or a fullangle of approximately 25 degrees.
標(biāo)簽： tof
上傳時間： 2022-02-12
上傳用戶：
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