In the past few decades, a technological revolution has occurred that has changed the way we live in dramatic ways. This technological revolution is the result of the emergence and evolution of a wide variety of new wireless networking tech- nologies. Now people using these technologies are able to access the network and control many applications at will with their handheld devices anywhere, anytime. Although these technologies have made a long lasting impact in the revolution, it has also opened up various challenging issues which are yet to be resolved to make them more efficient and cost-effective.
標(biāo)簽： Next-Generation Technologies Wireless
上傳時(shí)間： 2020-05-31
上傳用戶(hù)：shancjb
Rapid growth of wireless communication services in recent decades has created a huge demand of radio spectrum. Spectrum scarcity and utilization inefficiency limit the development of wireless networks. Cognitive radio is a promising tech- nology that allows secondary users to reuse the underutilized licensed spectrum of primary users. The major challenge for spectrum sharing is to achieve high spectrum efficiency while making non-intrusive access to the licensed bands. This requires in- formation of availability and quality of channel resources at secondary transmitters, however, is difficult to be obtained perfectly in practice.
標(biāo)簽： Opportunistic Spectrum Sharing
上傳時(shí)間： 2020-05-31
上傳用戶(hù)：shancjb
This book is an outgrowth of the pioneering development work done by InterDigital Com- munication Corporation in 3rd Generation TDD WCDMA Technology. Many engineers and managers were involved in this development, which spanned a wide range of tech- nology areas, including system architecture, radio interface, radio modem design, radio resource management and hardware/software implementation. In addition, TDD WCDMA technology had many direct and indirect contributors across the globe in the context of the development of the 3GPP TDD WCDMA Standard.
上傳時(shí)間： 2020-06-01
上傳用戶(hù)：shancjb
In the present era, low observability is one of the critical requirements in aerospace sector, especially related to defense. The stealth technology essentially relates to shaping and usage of radar absorbing materials (RAM) or radar absorbing struc- tures (RAS). The performance of such radar cross section (RCS) reduction tech- niques is limited by the bandwidth constraints, payload requirements, and other structural issues. Moreover, with advancement of materials science, the structure geometry no longer remains key decisive factor toward stealth.
標(biāo)簽： Fundamentals Design Radar of EM
上傳時(shí)間： 2020-06-06
上傳用戶(hù)：shancjb
District energy (DE) systems use central heating and/or cooling facilities to provide heating and/or cooling services for communities. The advantages of district energy over conventional heating and cooling include improved efficiency, reliability and safety, reduced environmental impact, and for many situations better economics. DE systems can be particularly beneficial when integrated with cogeneration plants for electricity and heat, i.e., with combined heat and power (CHP) plants. One of the main impediments to increased use of cogeneration-based district energy is a lack of understanding of the behavior of integrated forms of such systems. This book is aimed at providing information on district energy and cogeneration tech- nologies, as well as systems that combine them.
標(biāo)簽： Cogeneration District Systems Energy and
上傳時(shí)間： 2020-06-07
上傳用戶(hù)：shancjb
Recent years have seen a rapid development of neural network control tech- niques and their successful applications. Numerous simulation studies and actual industrial implementations show that artificial neural network is a good candidate for function approximation and control system design in solving the control problems of complex nonlinear systems in the presence of different kinds of uncertainties. Many control approaches/methods, reporting inventions and control applications within the fields of adaptive control, neural control and fuzzy systems, have been published in various books, journals and conference proceedings.
標(biāo)簽： Stable_adaptive_neural_network_co ntrol
上傳時(shí)間： 2020-06-10
上傳用戶(hù)：shancjb
硬件工程師筆試題大全及答案21頁(yè) 硬件工程師筆試題大全及答案1、請(qǐng)列舉您知道的電阻、電容、電感品牌（最好包括國(guó)內(nèi)、國(guó)外品牌）。 電阻：RALEC旺詮、ROYALOHM、SUPEROHM、UniOhm、TA-I大毅、TDK、TOKEN、VISHAY、YAGEO、廣東風(fēng)華 電容：AVX、KEMET、Kyocera、muRata、NEC、nichicon、Panasonic、SAMSUNG、SANYO、TAIYO YUDEN、TDK、VISHAY、YAGEO、廣東風(fēng)華、 電感：AEM、EPCOS、ETC、Gausstek豐晶、muRata、sumida村田、Sunlord順絡(luò)、TAI-TECH臺(tái)慶、TDK、TOKEN、TOREX、VISHAY、WE、YAGEO國(guó)巨、柯愛(ài)亞、科達(dá)嘉、奇力新、千如電子、捷比信、紫泰荊、肇慶英達(dá)、廣東風(fēng)華 2、請(qǐng)解釋電阻、電容、電感封裝的含義：0402、0603、0805。表示的是尺寸參數(shù)。 0402:40*20mil；0603:60*30mil；0805:80*50mil。 3、請(qǐng)問(wèn)電阻、電容、電感的封裝大小分別與什么參數(shù)有關(guān)？電阻封裝大小與電阻值、額定功率有關(guān)；電容封裝大小與電容值、額定電壓有關(guān)；電感封裝大小與電感量、額定電流有
標(biāo)簽： 硬件工程師
上傳時(shí)間： 2022-03-25
上傳用戶(hù)：ttalli
上傳文件為picc18編譯器。包含破解軟件在內(nèi)。
標(biāo)簽： C Compiler for pic18 mcus pro update
上傳時(shí)間： 2022-05-24
上傳用戶(hù)：
全文將用一個(gè)貫穿始終的例子來(lái)說(shuō)明如何繪制版圖。這個(gè)例子繪制的是一個(gè)最簡(jiǎn)單的非門(mén)的版圖。S2-1建立版圖文件使用library manager.首先，建立一個(gè)新的庫(kù)myLib，關(guān)于建立庫(kù)的步驟，在前文介紹cdsSpice時(shí)已經(jīng)說(shuō)得很清楚了，就不再贅述。與前面有些不同的地方是：由于我們要建立的是一個(gè)版圖文件，因此我們?cè)趖echnology file選項(xiàng)中必須選擇compile a new tech file，或是attach to an exsiting tech file。這里由于我們要新建一個(gè)tech file，因此選擇前者。這時(shí)會(huì)彈出load tech file的對(duì)話(huà)框，如圖2-1-1所示。在ASCII Technology File中填入csmclo0.tf即可。接著就可以建立名為inv的cel了。為了完備起見(jiàn)，讀者可以先建立inv的schematic view和symbol view（具體步驟前面已經(jīng)介紹，其中pmos長(zhǎng)6u，寬為0.6u。nmos長(zhǎng)為3u，寬為0.6u。model仍然選擇hj3p和hj3n）。然后建立其layout view，其步驟為：在tool中選擇virtuoso-layout，然后點(diǎn)擊ok。
上傳時(shí)間： 2022-07-20
上傳用戶(hù)：
最新華為pcb技術(shù)規(guī)范行溫度 110°C130°C150℃MOT（最大運(yùn)行溫度）到UL 746130°C150°C180°C 熱阻要求定義：溫度：????? 時(shí)間：????? 氣候：???抗熱震性 -40°C至+ 85°C老化循環(huán)： 100 200 500 1000 -40°C至+ 110°C老化循環(huán)： 100 200 500 1000 -40°C至+ 125°C老化循環(huán)： 100 200 500 1000老化循環(huán)： 特別：????? 低/高溫時(shí)間：2小時(shí)/ 2小熱穩(wěn)定性， 即焊料電阻（即無(wú)鉛焊料）波峰焊接<250°C<260°C<270°C<280°C 回流焊接周期：2<250°C<260°C<270°C<280°C 氣相焊接<250°C<260°C<270°C最大<280°C 產(chǎn)品應(yīng)用中的溫度溫度：???? 時(shí)間： ????? 氣候：?????機(jī)械要求■機(jī)械穩(wěn)定性達(dá)到：+ 85°C+ 110°C+ 130°C+ 150°C ■扭曲 <0.5％<0,75％<1,0％■x/y軸的CTE單位[ppm / K] <18 <14 <10 ■z軸的CTE（低于Tg）單位[ppm / K]<70 <50 <30 ■z軸的CTE（高于Tg）單位[ppm / K]<300 <260 <230 ■銅附著力單位[N /mm2]<0,80,8到1,6> 1,6 ■重量單位[kg /dm2]：nd
標(biāo)簽： pcb規(guī)范
上傳時(shí)間： 2022-07-22
上傳用戶(hù)：
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