PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....
C8051FXXX PCB design notes...
為了有效地提升鉛酸蓄電池的使用壽命,同時實現對充電過程的監控,設計出一種用單片機控制的36 V鉛酸蓄電池充電電源。本電路采用反激式拓撲,連續電流工作模式,電源管理IC設計在電源的副邊,由E...
介紹一種基于C8051F060單片機和NAND Flash的數據采集存儲系統,該系統可實現3路信號采樣,每路采樣率為5KS/s,通過異步串行通信接口實現數據傳輸。并詳細說明系統的軟件設計。 Abs...
The TL2575 and TL2575HV represent superior alternatives to popular three-terminal linear regulators....
本文依據集成電路設計方法學,探討了一種基于標準Intel 8086 微處理器的單芯片計算機平臺的架構。研究了其與SDRAM,8255 并行接口等外圍IP 的集成,并在對AMBA協議和8086 CPU分...
The main objective of this book is to present all the relevant informationrequired for RF and micr...
RF circuit design theory and application(射頻電路設計)...
Trademarks: Trademarks and service marks of Cadence Design Systems, Inc. (Cadence) contained in...
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution....